KR102725565B1 - 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 - Google Patents

밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 Download PDF

Info

Publication number
KR102725565B1
KR102725565B1 KR1020227038211A KR20227038211A KR102725565B1 KR 102725565 B1 KR102725565 B1 KR 102725565B1 KR 1020227038211 A KR1020227038211 A KR 1020227038211A KR 20227038211 A KR20227038211 A KR 20227038211A KR 102725565 B1 KR102725565 B1 KR 102725565B1
Authority
KR
South Korea
Prior art keywords
inorganic filler
resin composition
sealing resin
mass
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227038211A
Other languages
English (en)
Korean (ko)
Other versions
KR20220152583A (ko
Inventor
유마 다케우치
히사토 다카하시
요시히토 이나바
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=61905596&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102725565(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20220152583A publication Critical patent/KR20220152583A/ko
Application granted granted Critical
Publication of KR102725565B1 publication Critical patent/KR102725565B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H01L21/56—
    • H01L23/29—
    • H01L23/31—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
KR1020227038211A 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 Active KR102725565B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016202714 2016-10-14
JPJP-P-2016-202714 2016-10-14
KR1020197013177A KR20190069464A (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
PCT/JP2017/034810 WO2018070237A1 (ja) 2016-10-14 2017-09-26 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197013177A Division KR20190069464A (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Publications (2)

Publication Number Publication Date
KR20220152583A KR20220152583A (ko) 2022-11-16
KR102725565B1 true KR102725565B1 (ko) 2024-11-05

Family

ID=61905596

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020227038211A Active KR102725565B1 (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
KR1020197013177A Ceased KR20190069464A (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020197013177A Ceased KR20190069464A (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Country Status (6)

Country Link
US (2) US11186742B2 (https=)
JP (2) JP7231821B2 (https=)
KR (2) KR102725565B1 (https=)
CN (2) CN109844020A (https=)
TW (1) TWI753021B (https=)
WO (1) WO2018070237A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102725565B1 (ko) 2016-10-14 2024-11-05 가부시끼가이샤 레조낙 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
TWI811215B (zh) * 2018-04-13 2023-08-11 日商力森諾科股份有限公司 密封用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
JP7749318B2 (ja) * 2018-04-13 2025-10-06 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7020343B2 (ja) * 2018-08-21 2022-02-16 昭和電工マテリアルズ株式会社 封止樹脂材料
WO2021079677A1 (ja) * 2019-10-24 2021-04-29 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物、及び半導体装置
TWI883181B (zh) * 2020-06-23 2025-05-11 日商納美仕有限公司 液狀壓縮成型材
CN117736550A (zh) * 2022-09-15 2024-03-22 华为技术有限公司 树脂组合物及其制备方法和应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336247A (ja) 1999-05-27 2000-12-05 C I Kasei Co Ltd 液状エポキシ樹脂封止材
JP2003292579A (ja) 2002-04-08 2003-10-15 Kyocera Chemical Corp 液状封止用樹脂組成物および半導体封止装置
JP2005298740A (ja) 2004-04-14 2005-10-27 Admatechs Co Ltd 金属酸化物表面処理粒子および樹脂組成物
JP2007204510A (ja) 2006-01-31 2007-08-16 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2011014885A (ja) 2009-06-01 2011-01-20 Shin-Etsu Chemical Co Ltd 多層半導体装置用アンダーフィル材のダム材組成物、及び該ダム材組成物を用いた多層半導体装置の製造方法
JP2015218229A (ja) 2014-05-16 2015-12-07 ナミックス株式会社 液状封止材、それを用いた電子部品
JP2016098317A (ja) 2014-11-21 2016-05-30 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4460968B2 (ja) * 2004-07-27 2010-05-12 株式会社アドマテックス 樹脂組成物の製造方法
JP5042529B2 (ja) 2005-05-30 2012-10-03 株式会社アドマテックス 微小粒子含有組成物及びその製造方法
JP5162160B2 (ja) 2007-06-04 2013-03-13 サンダイヤポリマー株式会社 吸収性樹脂粒子、この製造方法、これを含む吸収体及び吸収性物品
JP2009114222A (ja) * 2007-11-01 2009-05-28 Kyocera Chemical Corp 注形用エポキシ樹脂組成物および電気・電子部品装置
JP2010192525A (ja) 2009-02-16 2010-09-02 Namics Corp 半導体装置およびその製造方法
JP2011006618A (ja) 2009-06-26 2011-01-13 Namics Corp 封止用液状樹脂組成物、フリップチップ実装体およびその製造方法
KR20120050433A (ko) 2009-07-24 2012-05-18 스미토모 베이클리트 컴퍼니 리미티드 수지 조성물, 수지 시트, 프리프레그, 금속 부착 적층판, 프린트 배선판 및 반도체 장치
JP2012107149A (ja) 2010-11-19 2012-06-07 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置
TWI673318B (zh) 2013-11-29 2019-10-01 日商納美仕股份有限公司 環氧樹脂組成物、半導體密封劑及半導體裝置
JP6196138B2 (ja) * 2013-11-29 2017-09-13 ナミックス株式会社 半導体封止剤および半導体装置
JP6656792B2 (ja) * 2014-03-28 2020-03-04 日立化成株式会社 電子部品用液状樹脂組成物及び電子部品装置
KR102455429B1 (ko) 2015-03-19 2022-10-14 나믹스 가부시끼가이샤 플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물
KR102725565B1 (ko) 2016-10-14 2024-11-05 가부시끼가이샤 레조낙 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336247A (ja) 1999-05-27 2000-12-05 C I Kasei Co Ltd 液状エポキシ樹脂封止材
JP2003292579A (ja) 2002-04-08 2003-10-15 Kyocera Chemical Corp 液状封止用樹脂組成物および半導体封止装置
JP2005298740A (ja) 2004-04-14 2005-10-27 Admatechs Co Ltd 金属酸化物表面処理粒子および樹脂組成物
JP2007204510A (ja) 2006-01-31 2007-08-16 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2011014885A (ja) 2009-06-01 2011-01-20 Shin-Etsu Chemical Co Ltd 多層半導体装置用アンダーフィル材のダム材組成物、及び該ダム材組成物を用いた多層半導体装置の製造方法
JP2015218229A (ja) 2014-05-16 2015-12-07 ナミックス株式会社 液状封止材、それを用いた電子部品
JP2016098317A (ja) 2014-11-21 2016-05-30 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP7513074B2 (ja) 2024-07-09
KR20190069464A (ko) 2019-06-19
CN109844020A (zh) 2019-06-04
US11186742B2 (en) 2021-11-30
US20210363380A1 (en) 2021-11-25
CN120399400A (zh) 2025-08-01
WO2018070237A1 (ja) 2018-04-19
JP2023016887A (ja) 2023-02-02
JP7231821B2 (ja) 2023-03-02
KR20220152583A (ko) 2022-11-16
WO2018070237A9 (ja) 2018-06-14
JPWO2018070237A1 (ja) 2019-09-05
US20190233672A1 (en) 2019-08-01
US11873414B2 (en) 2024-01-16
TWI753021B (zh) 2022-01-21
TW201817808A (zh) 2018-05-16

Similar Documents

Publication Publication Date Title
KR102725565B1 (ko) 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
KR102676681B1 (ko) 밀봉용 수지 조성물, 경화물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
JP7167912B2 (ja) 液状封止樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2025109969A (ja) アンダーフィル材、電子部品装置及び電子部品装置の製造方法
TWI612096B (zh) 液狀樹脂組成物、覆晶安裝體及其製造方法
JP7000698B2 (ja) アンダーフィル用樹脂組成物、半導体装置の製造方法及び半導体装置
TWI512035B (zh) 液狀環氧樹脂組成物
JP7251583B2 (ja) 封止用樹脂組成物、硬化物、電子部品装置及び電子部品装置の製造方法
JP7509192B2 (ja) 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
TWI811215B (zh) 密封用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
JP5886051B2 (ja) 樹脂組成物
JP5532582B2 (ja) フリップチップ型半導体装置を封止する方法、チップ・オン・チップ用アンダーフィル材の選定方法、及びフリップチップ型半導体装置
JP2019214644A (ja) ディップ用先供給型半導体封止材、それを用いた半導体装置

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E14-X000 Pre-grant third party observation filed

St.27 status event code: A-2-3-E10-E14-opp-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000