KR102718065B1 - 공급 장치, 공급 시스템 - Google Patents

공급 장치, 공급 시스템 Download PDF

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Publication number
KR102718065B1
KR102718065B1 KR1020220109877A KR20220109877A KR102718065B1 KR 102718065 B1 KR102718065 B1 KR 102718065B1 KR 1020220109877 A KR1020220109877 A KR 1020220109877A KR 20220109877 A KR20220109877 A KR 20220109877A KR 102718065 B1 KR102718065 B1 KR 102718065B1
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KR
South Korea
Prior art keywords
treatment liquid
pipe
supply
region
liquid
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Application number
KR1020220109877A
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English (en)
Korean (ko)
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KR20230039533A (ko
Inventor
마사아키 후루야
히로아키 고바야시
히데키 모리
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시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20230039533A publication Critical patent/KR20230039533A/ko
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Publication of KR102718065B1 publication Critical patent/KR102718065B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H01L21/67017—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials
    • H01L21/67103—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves

Landscapes

  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Telephone Function (AREA)
KR1020220109877A 2021-09-13 2022-08-31 공급 장치, 공급 시스템 Active KR102718065B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-148850 2021-09-13
JP2021148850A JP7438172B2 (ja) 2021-09-13 2021-09-13 供給装置、供給システム

Publications (2)

Publication Number Publication Date
KR20230039533A KR20230039533A (ko) 2023-03-21
KR102718065B1 true KR102718065B1 (ko) 2024-10-15

Family

ID=85478152

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220109877A Active KR102718065B1 (ko) 2021-09-13 2022-08-31 공급 장치, 공급 시스템

Country Status (5)

Country Link
US (1) US12318803B2 (https=)
JP (1) JP7438172B2 (https=)
KR (1) KR102718065B1 (https=)
CN (1) CN115810563B (https=)
TW (2) TWI793054B (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001062669A (ja) 1999-08-24 2001-03-13 Nikon Corp 加工方法およびその装置
US20200354241A1 (en) 2019-05-10 2020-11-12 Sugino Machine Limited Liquid treatment apparatus and liquid treatment method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174420A (ja) * 1994-12-26 1996-07-09 Fuji Oozx Inc 水溶性研削液の自動補充装置
JP3761457B2 (ja) 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US20120006790A1 (en) * 2009-03-31 2012-01-12 Kurita Water Industries Ltd. Apparatus and method for treating etching solution
JP5761521B2 (ja) * 2010-06-07 2015-08-12 栗田工業株式会社 洗浄システムおよび洗浄方法
CN103094151B (zh) * 2011-10-27 2015-07-22 沈阳芯源微电子设备有限公司 一种化学液回收装置
CN103187341B (zh) * 2011-12-27 2015-11-18 芝浦机械电子株式会社 基板的处理装置及处理方法
JP6010457B2 (ja) 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
US10046371B2 (en) * 2013-03-29 2018-08-14 Semes Co., Ltd. Recycling unit, substrate treating apparatus and recycling method using the recycling unit
JP6502633B2 (ja) 2013-09-30 2019-04-17 芝浦メカトロニクス株式会社 基板処理方法及び基板処理装置
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6839990B2 (ja) * 2017-01-31 2021-03-10 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法
US20190203342A1 (en) * 2017-12-29 2019-07-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Cooling system and evaporation machine
JP6869306B2 (ja) * 2019-09-30 2021-05-12 月島機械株式会社 熱媒体利用機器への熱媒体供給方法及び熱媒体利用設備

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001062669A (ja) 1999-08-24 2001-03-13 Nikon Corp 加工方法およびその装置
US20200354241A1 (en) 2019-05-10 2020-11-12 Sugino Machine Limited Liquid treatment apparatus and liquid treatment method

Also Published As

Publication number Publication date
JP7438172B2 (ja) 2024-02-26
TWI828504B (zh) 2024-01-01
KR20230039533A (ko) 2023-03-21
JP2023041461A (ja) 2023-03-24
US12318803B2 (en) 2025-06-03
CN115810563B (zh) 2025-07-08
TW202312240A (zh) 2023-03-16
US20230081295A1 (en) 2023-03-16
CN115810563A (zh) 2023-03-17
TW202318481A (zh) 2023-05-01
TWI793054B (zh) 2023-02-11

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