KR102622227B1 - 제2 기판에 결합된 제1 기판을 가공하는 방법 - Google Patents

제2 기판에 결합된 제1 기판을 가공하는 방법 Download PDF

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KR102622227B1
KR102622227B1 KR1020187015240A KR20187015240A KR102622227B1 KR 102622227 B1 KR102622227 B1 KR 102622227B1 KR 1020187015240 A KR1020187015240 A KR 1020187015240A KR 20187015240 A KR20187015240 A KR 20187015240A KR 102622227 B1 KR102622227 B1 KR 102622227B1
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South Korea
Prior art keywords
substrate
wire
debonding
moving
interface
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English (en)
Korean (ko)
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KR20180063361A (ko
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리나 쿠마리 사후
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코닝 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
    • Y10T156/1967—Cutting delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Surface Treatment Of Glass (AREA)
  • Table Equipment (AREA)
  • Recrystallisation Techniques (AREA)
KR1020187015240A 2015-10-30 2016-10-27 제2 기판에 결합된 제1 기판을 가공하는 방법 Active KR102622227B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562248823P 2015-10-30 2015-10-30
US62/248,823 2015-10-30
PCT/US2016/059014 WO2017075151A1 (en) 2015-10-30 2016-10-27 Methods for processing a first substrate bonded to a second substrate

Publications (2)

Publication Number Publication Date
KR20180063361A KR20180063361A (ko) 2018-06-11
KR102622227B1 true KR102622227B1 (ko) 2024-01-08

Family

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KR1020187015240A Active KR102622227B1 (ko) 2015-10-30 2016-10-27 제2 기판에 결합된 제1 기판을 가공하는 방법

Country Status (6)

Country Link
US (1) US10814603B2 (https=)
JP (1) JP6873986B2 (https=)
KR (1) KR102622227B1 (https=)
CN (1) CN108353507B (https=)
TW (1) TWI688315B (https=)
WO (1) WO2017075151A1 (https=)

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CN108155086A (zh) * 2017-12-13 2018-06-12 武汉华星光电半导体显示技术有限公司 一种分离玻璃基板与柔性oled显示面板的方法及设备
US11007765B2 (en) 2018-03-02 2021-05-18 The Boeing Company Edge delamination methods and systems
KR102476313B1 (ko) * 2021-02-04 2022-12-13 (주)미래컴퍼니 보호 필름 박리 장치 및 이를 이용한 박리 방법
JPWO2024053565A1 (https=) 2022-09-05 2024-03-14
CN119092421B (zh) * 2024-08-09 2025-12-19 东莞触点智能装备有限公司 非破坏性测量晶圆键合强度的方法

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Also Published As

Publication number Publication date
WO2017075151A1 (en) 2017-05-04
JP2018533221A (ja) 2018-11-08
US10814603B2 (en) 2020-10-27
CN108353507A (zh) 2018-07-31
TWI688315B (zh) 2020-03-11
CN108353507B (zh) 2020-11-27
US20180354251A1 (en) 2018-12-13
TW201728236A (zh) 2017-08-01
KR20180063361A (ko) 2018-06-11
JP6873986B2 (ja) 2021-05-19

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