KR102617800B1 - 결정질 물질의 표면에서 비결정질 부동태화 층을 제거하기 위한 세정용 화학적 조성물 - Google Patents

결정질 물질의 표면에서 비결정질 부동태화 층을 제거하기 위한 세정용 화학적 조성물 Download PDF

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Publication number
KR102617800B1
KR102617800B1 KR1020207002493A KR20207002493A KR102617800B1 KR 102617800 B1 KR102617800 B1 KR 102617800B1 KR 1020207002493 A KR1020207002493 A KR 1020207002493A KR 20207002493 A KR20207002493 A KR 20207002493A KR 102617800 B1 KR102617800 B1 KR 102617800B1
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South Korea
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weight
chemical composition
substrate
passivation layer
layer
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KR1020207002493A
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Korean (ko)
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KR20200026258A (ko
Inventor
크리스티앙 피체티
마린 오두엥
제롬 다비오
니콜라 피알로
필립 베르낭
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테크닉 프랑스
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Classifications

    • C11D11/0047—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C11D3/2079—Monocarboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/06—Silver salts
    • G03F7/063—Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer, e.g. finishing, washing; Correction or deletion fluids
    • H01L21/02063—
    • H01L21/02071—
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Detergent Compositions (AREA)
KR1020207002493A 2017-06-30 2018-06-29 결정질 물질의 표면에서 비결정질 부동태화 층을 제거하기 위한 세정용 화학적 조성물 Active KR102617800B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1756215A FR3068509B1 (fr) 2017-06-30 2017-06-30 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de materiaux cristallins
FR1756215 2017-06-30
PCT/FR2018/051607 WO2019002789A1 (fr) 2017-06-30 2018-06-29 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de matériaux cristallins

Publications (2)

Publication Number Publication Date
KR20200026258A KR20200026258A (ko) 2020-03-10
KR102617800B1 true KR102617800B1 (ko) 2023-12-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207002493A Active KR102617800B1 (ko) 2017-06-30 2018-06-29 결정질 물질의 표면에서 비결정질 부동태화 층을 제거하기 위한 세정용 화학적 조성물

Country Status (9)

Country Link
US (1) US11075073B2 (https=)
EP (1) EP3646371B1 (https=)
JP (1) JP7206269B2 (https=)
KR (1) KR102617800B1 (https=)
CN (1) CN110892511A (https=)
FR (1) FR3068509B1 (https=)
MY (1) MY205007A (https=)
TW (1) TWI776909B (https=)
WO (1) WO2019002789A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210317389A1 (en) * 2020-04-14 2021-10-14 William Quan Chemical product for rapid removal of food burned on to the surfaces of cooktops

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101540001B1 (ko) * 2006-10-24 2015-07-28 간또 가가꾸 가부시끼가이샤 포토레지스트 찌꺼기 및 폴리머 찌꺼기 제거액 조성물

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
JPS6064437A (ja) * 1983-09-20 1985-04-13 Toshiba Corp 鉛系パツシベ−シヨンガラスのエツチング液
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
WO2005045895A2 (en) * 2003-10-28 2005-05-19 Sachem, Inc. Cleaning solutions and etchants and methods for using same
KR100660863B1 (ko) * 2005-04-12 2006-12-26 삼성전자주식회사 세정액 및 이를 이용한 반도체 소자의 금속 패턴 형성 방법
EP1946358A4 (en) 2005-11-09 2009-03-04 Advanced Tech Materials COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS ON WHICH DIELECTRIC MATERIAL WITH LOW DIELECTRIC CONSTANT
US20100124713A1 (en) * 2008-11-17 2010-05-20 Xerox Corporation Toners including carbon nanotubes dispersed in a polymer matrix
US8431516B2 (en) * 2009-10-24 2013-04-30 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
WO2013088266A1 (en) * 2011-12-13 2013-06-20 Ecolab Usa Inc. Concentrated warewashing compositions and methods
US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
JP2015005660A (ja) 2013-06-21 2015-01-08 東京エレクトロン株式会社 酸化タンタル膜の除去方法および除去装置
KR101700636B1 (ko) * 2015-04-17 2017-01-31 재원산업 주식회사 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법
GB2554635A (en) * 2016-08-03 2018-04-11 Northwick Park Institute For Medical Res Ltd Bioreactors and methods for processing biological material
WO2018061582A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 処理液および積層体の処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101540001B1 (ko) * 2006-10-24 2015-07-28 간또 가가꾸 가부시끼가이샤 포토레지스트 찌꺼기 및 폴리머 찌꺼기 제거액 조성물

Also Published As

Publication number Publication date
WO2019002789A1 (fr) 2019-01-03
EP3646371B1 (fr) 2021-04-14
CN110892511A (zh) 2020-03-17
JP2020526046A (ja) 2020-08-27
JP7206269B2 (ja) 2023-01-17
FR3068509B1 (fr) 2020-02-28
TWI776909B (zh) 2022-09-11
TW201905240A (zh) 2019-02-01
MY205007A (en) 2024-09-27
FR3068509A1 (fr) 2019-01-04
US11075073B2 (en) 2021-07-27
US20200335326A1 (en) 2020-10-22
EP3646371A1 (fr) 2020-05-06
KR20200026258A (ko) 2020-03-10

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