MY205007A - Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials - Google Patents

Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials

Info

Publication number
MY205007A
MY205007A MYPI2019006445A MYPI2019006445A MY205007A MY 205007 A MY205007 A MY 205007A MY PI2019006445 A MYPI2019006445 A MY PI2019006445A MY PI2019006445 A MYPI2019006445 A MY PI2019006445A MY 205007 A MY205007 A MY 205007A
Authority
MY
Malaysia
Prior art keywords
weight
chemical composition
passivation layer
substrate
cleaning chemical
Prior art date
Application number
MYPI2019006445A
Other languages
English (en)
Inventor
Christian Pizzetti
Marine Audouin
Jrme Daviot
Nicolas Pialot
Philippe Vernin
Original Assignee
Technic France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technic France filed Critical Technic France
Publication of MY205007A publication Critical patent/MY205007A/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/20Cleaning during device manufacture
    • H10P70/27Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/20Cleaning during device manufacture
    • H10P70/23Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02Inorganic compounds ; Elemental compounds
    • C11D3/04Water-soluble compounds
    • C11D3/042Acids
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/20Organic compounds containing oxygen
    • C11D3/2075Carboxylic acids-salts thereof
    • C11D3/2079Monocarboxylic acids-salts thereof
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/34Organic compounds containing sulfur
    • C11D3/3409Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/06Silver salts
    • G03F7/063Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer, e.g. finishing, washing; Correction or deletion fluids
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Detergent Compositions (AREA)
MYPI2019006445A 2017-06-30 2018-06-29 Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials MY205007A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1756215A FR3068509B1 (fr) 2017-06-30 2017-06-30 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de materiaux cristallins
PCT/FR2018/051607 WO2019002789A1 (fr) 2017-06-30 2018-06-29 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de matériaux cristallins

Publications (1)

Publication Number Publication Date
MY205007A true MY205007A (en) 2024-09-27

Family

ID=60182676

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019006445A MY205007A (en) 2017-06-30 2018-06-29 Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials

Country Status (9)

Country Link
US (1) US11075073B2 (https=)
EP (1) EP3646371B1 (https=)
JP (1) JP7206269B2 (https=)
KR (1) KR102617800B1 (https=)
CN (1) CN110892511A (https=)
FR (1) FR3068509B1 (https=)
MY (1) MY205007A (https=)
TW (1) TWI776909B (https=)
WO (1) WO2019002789A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210317389A1 (en) * 2020-04-14 2021-10-14 William Quan Chemical product for rapid removal of food burned on to the surfaces of cooktops

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064437A (ja) * 1983-09-20 1985-04-13 Toshiba Corp 鉛系パツシベ−シヨンガラスのエツチング液
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
WO2005045895A2 (en) * 2003-10-28 2005-05-19 Sachem, Inc. Cleaning solutions and etchants and methods for using same
KR100660863B1 (ko) * 2005-04-12 2006-12-26 삼성전자주식회사 세정액 및 이를 이용한 반도체 소자의 금속 패턴 형성 방법
EP1946358A4 (en) 2005-11-09 2009-03-04 Advanced Tech Materials COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS ON WHICH DIELECTRIC MATERIAL WITH LOW DIELECTRIC CONSTANT
JP4642001B2 (ja) * 2006-10-24 2011-03-02 関東化学株式会社 フォトレジスト残渣及びポリマー残渣除去液組成物
US20100124713A1 (en) * 2008-11-17 2010-05-20 Xerox Corporation Toners including carbon nanotubes dispersed in a polymer matrix
US8431516B2 (en) * 2009-10-24 2013-04-30 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
WO2013088266A1 (en) * 2011-12-13 2013-06-20 Ecolab Usa Inc. Concentrated warewashing compositions and methods
US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
JP2015005660A (ja) 2013-06-21 2015-01-08 東京エレクトロン株式会社 酸化タンタル膜の除去方法および除去装置
KR101700636B1 (ko) * 2015-04-17 2017-01-31 재원산업 주식회사 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법
GB2554635A (en) * 2016-08-03 2018-04-11 Northwick Park Institute For Medical Res Ltd Bioreactors and methods for processing biological material
WO2018061582A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 処理液および積層体の処理方法

Also Published As

Publication number Publication date
WO2019002789A1 (fr) 2019-01-03
EP3646371B1 (fr) 2021-04-14
CN110892511A (zh) 2020-03-17
JP2020526046A (ja) 2020-08-27
JP7206269B2 (ja) 2023-01-17
FR3068509B1 (fr) 2020-02-28
TWI776909B (zh) 2022-09-11
TW201905240A (zh) 2019-02-01
FR3068509A1 (fr) 2019-01-04
US11075073B2 (en) 2021-07-27
US20200335326A1 (en) 2020-10-22
EP3646371A1 (fr) 2020-05-06
KR20200026258A (ko) 2020-03-10
KR102617800B1 (ko) 2023-12-27

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