CN110892511A - 用于除去晶体材料表面的非晶钝化层的化学清洁组合物 - Google Patents

用于除去晶体材料表面的非晶钝化层的化学清洁组合物 Download PDF

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Publication number
CN110892511A
CN110892511A CN201880043734.4A CN201880043734A CN110892511A CN 110892511 A CN110892511 A CN 110892511A CN 201880043734 A CN201880043734 A CN 201880043734A CN 110892511 A CN110892511 A CN 110892511A
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CN
China
Prior art keywords
weight
passivation layer
acid
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880043734.4A
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English (en)
Chinese (zh)
Inventor
C·皮泽蒂
M·奥杜安
J·达维奥
N·皮亚洛
P·韦尔南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
French Technology Co
Original Assignee
French Technology Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by French Technology Co filed Critical French Technology Co
Publication of CN110892511A publication Critical patent/CN110892511A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C11D3/2079—Monocarboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/06—Silver salts
    • G03F7/063—Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer, e.g. finishing, washing; Correction or deletion fluids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Detergent Compositions (AREA)
CN201880043734.4A 2017-06-30 2018-06-29 用于除去晶体材料表面的非晶钝化层的化学清洁组合物 Pending CN110892511A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1756215A FR3068509B1 (fr) 2017-06-30 2017-06-30 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de materiaux cristallins
FR1756215 2017-06-30
PCT/FR2018/051607 WO2019002789A1 (fr) 2017-06-30 2018-06-29 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de matériaux cristallins

Publications (1)

Publication Number Publication Date
CN110892511A true CN110892511A (zh) 2020-03-17

Family

ID=60182676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880043734.4A Pending CN110892511A (zh) 2017-06-30 2018-06-29 用于除去晶体材料表面的非晶钝化层的化学清洁组合物

Country Status (9)

Country Link
US (1) US11075073B2 (https=)
EP (1) EP3646371B1 (https=)
JP (1) JP7206269B2 (https=)
KR (1) KR102617800B1 (https=)
CN (1) CN110892511A (https=)
FR (1) FR3068509B1 (https=)
MY (1) MY205007A (https=)
TW (1) TWI776909B (https=)
WO (1) WO2019002789A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210317389A1 (en) * 2020-04-14 2021-10-14 William Quan Chemical product for rapid removal of food burned on to the surfaces of cooktops

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
US20060228890A1 (en) * 2005-04-12 2006-10-12 Lee Hyo-San Cleaning solution and method of forming a metal pattern for a semiconductor device using the same
CN101523297A (zh) * 2006-10-24 2009-09-02 关东化学株式会社 光刻胶残渣及聚合物残渣去除液组合物
CN101738887A (zh) * 2008-11-17 2010-06-16 施乐公司 包含分散在聚合物基体中的碳纳米管的调色剂
KR20160123707A (ko) * 2015-04-17 2016-10-26 재원산업 주식회사 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064437A (ja) * 1983-09-20 1985-04-13 Toshiba Corp 鉛系パツシベ−シヨンガラスのエツチング液
WO2005045895A2 (en) * 2003-10-28 2005-05-19 Sachem, Inc. Cleaning solutions and etchants and methods for using same
EP1946358A4 (en) 2005-11-09 2009-03-04 Advanced Tech Materials COMPOSITION AND METHOD FOR RECYCLING SEMICONDUCTOR WAFERS ON WHICH DIELECTRIC MATERIAL WITH LOW DIELECTRIC CONSTANT
US8431516B2 (en) * 2009-10-24 2013-04-30 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
WO2013088266A1 (en) * 2011-12-13 2013-06-20 Ecolab Usa Inc. Concentrated warewashing compositions and methods
US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
JP2015005660A (ja) 2013-06-21 2015-01-08 東京エレクトロン株式会社 酸化タンタル膜の除去方法および除去装置
GB2554635A (en) * 2016-08-03 2018-04-11 Northwick Park Institute For Medical Res Ltd Bioreactors and methods for processing biological material
WO2018061582A1 (ja) * 2016-09-29 2018-04-05 富士フイルム株式会社 処理液および積層体の処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
US20060228890A1 (en) * 2005-04-12 2006-10-12 Lee Hyo-San Cleaning solution and method of forming a metal pattern for a semiconductor device using the same
CN101523297A (zh) * 2006-10-24 2009-09-02 关东化学株式会社 光刻胶残渣及聚合物残渣去除液组合物
CN101738887A (zh) * 2008-11-17 2010-06-16 施乐公司 包含分散在聚合物基体中的碳纳米管的调色剂
KR20160123707A (ko) * 2015-04-17 2016-10-26 재원산업 주식회사 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법

Also Published As

Publication number Publication date
WO2019002789A1 (fr) 2019-01-03
EP3646371B1 (fr) 2021-04-14
JP2020526046A (ja) 2020-08-27
JP7206269B2 (ja) 2023-01-17
FR3068509B1 (fr) 2020-02-28
TWI776909B (zh) 2022-09-11
TW201905240A (zh) 2019-02-01
MY205007A (en) 2024-09-27
FR3068509A1 (fr) 2019-01-04
US11075073B2 (en) 2021-07-27
US20200335326A1 (en) 2020-10-22
EP3646371A1 (fr) 2020-05-06
KR20200026258A (ko) 2020-03-10
KR102617800B1 (ko) 2023-12-27

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