KR102609199B1 - 접속 구조체의 제조 방법, 도전성 입자, 도전 필름 및 접속 구조체 - Google Patents
접속 구조체의 제조 방법, 도전성 입자, 도전 필름 및 접속 구조체 Download PDFInfo
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Images
Classifications
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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PCT/JP2016/078020 WO2017051872A1 (ja) | 2015-09-25 | 2016-09-23 | 接続構造体の製造方法、導電性粒子、導電フィルム及び接続構造体 |
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JP2010248386A (ja) * | 2009-04-16 | 2010-11-04 | Asahi Kasei E-Materials Corp | 異方導電性接着フィルムの製造方法 |
JP2012191195A (ja) * | 2011-02-25 | 2012-10-04 | Sekisui Chem Co Ltd | 接続構造体の製造方法、異方性導電材料及び接続構造体 |
JP2015130328A (ja) * | 2013-12-03 | 2015-07-16 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
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US7605056B2 (en) * | 2005-05-31 | 2009-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device including separation by physical force |
KR20070017762A (ko) * | 2005-08-08 | 2007-02-13 | 엘지.필립스 엘시디 주식회사 | 식각액 조성물, 이를 이용한 도전막의 패터닝 방법 및평판표시장치의 제조 방법 |
TWI325967B (en) * | 2007-10-19 | 2010-06-11 | Au Optronics Corp | Inspection device and method for detecting conductive particle indentations |
JP5225766B2 (ja) | 2008-06-25 | 2013-07-03 | 旭化成イーマテリアルズ株式会社 | 異方導電性接着シート及び微細接続構造体 |
JP5358328B2 (ja) * | 2009-07-16 | 2013-12-04 | デクセリアルズ株式会社 | 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法 |
JP5496343B2 (ja) * | 2009-09-29 | 2014-05-21 | コリア アドバンスト インスティテュート オブ サイエンス アンド テクノロジー | ナノファイバーを用いた導電性ポリマー接着剤及びその製造方法 |
JP4752986B1 (ja) * | 2010-01-08 | 2011-08-17 | 日立化成工業株式会社 | 回路接続用接着フィルム及び回路接続構造体 |
JP2011159801A (ja) * | 2010-02-01 | 2011-08-18 | Showa Denko Kk | 半導体発光素子及びその製造方法、並びにランプ |
WO2014007334A1 (ja) * | 2012-07-05 | 2014-01-09 | 積水化学工業株式会社 | 導電性粒子、樹脂粒子、導電材料及び接続構造体 |
JP2014075215A (ja) * | 2012-10-03 | 2014-04-24 | Sekisui Chem Co Ltd | 絶縁材料、多層フィルム、積層体、接続構造体、積層体の製造方法及び接続構造体の製造方法 |
JP6161380B2 (ja) * | 2013-04-17 | 2017-07-12 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
CN105379434B (zh) * | 2013-10-29 | 2018-06-08 | 积水化学工业株式会社 | 再生电子部件的制造方法 |
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JP2010248386A (ja) * | 2009-04-16 | 2010-11-04 | Asahi Kasei E-Materials Corp | 異方導電性接着フィルムの製造方法 |
JP2012191195A (ja) * | 2011-02-25 | 2012-10-04 | Sekisui Chem Co Ltd | 接続構造体の製造方法、異方性導電材料及び接続構造体 |
JP2015130328A (ja) * | 2013-12-03 | 2015-07-16 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
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JP6789118B2 (ja) | 2020-11-25 |
JPWO2017051872A1 (ja) | 2018-07-12 |
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KR20180061084A (ko) | 2018-06-07 |
WO2017051872A1 (ja) | 2017-03-30 |
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