KR102609199B1 - 접속 구조체의 제조 방법, 도전성 입자, 도전 필름 및 접속 구조체 - Google Patents

접속 구조체의 제조 방법, 도전성 입자, 도전 필름 및 접속 구조체 Download PDF

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Publication number
KR102609199B1
KR102609199B1 KR1020177025884A KR20177025884A KR102609199B1 KR 102609199 B1 KR102609199 B1 KR 102609199B1 KR 1020177025884 A KR1020177025884 A KR 1020177025884A KR 20177025884 A KR20177025884 A KR 20177025884A KR 102609199 B1 KR102609199 B1 KR 102609199B1
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KR
South Korea
Prior art keywords
electrode
conductive
particles
conductive particles
connection
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KR1020177025884A
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English (en)
Korean (ko)
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KR20180061084A (ko
Inventor
시게오 마하라
시아오게 왕
유토 도바시
마사오 사사다이라
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20180061084A publication Critical patent/KR20180061084A/ko
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Publication of KR102609199B1 publication Critical patent/KR102609199B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
KR1020177025884A 2015-09-25 2016-09-23 접속 구조체의 제조 방법, 도전성 입자, 도전 필름 및 접속 구조체 KR102609199B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2015-188015 2015-09-25
JPJP-P-2015-188014 2015-09-25
JP2015188015 2015-09-25
JP2015188014 2015-09-25
PCT/JP2016/078020 WO2017051872A1 (ja) 2015-09-25 2016-09-23 接続構造体の製造方法、導電性粒子、導電フィルム及び接続構造体

Publications (2)

Publication Number Publication Date
KR20180061084A KR20180061084A (ko) 2018-06-07
KR102609199B1 true KR102609199B1 (ko) 2023-12-05

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KR1020177025884A KR102609199B1 (ko) 2015-09-25 2016-09-23 접속 구조체의 제조 방법, 도전성 입자, 도전 필름 및 접속 구조체

Country Status (5)

Country Link
JP (1) JP6789118B2 (ja)
KR (1) KR102609199B1 (ja)
CN (1) CN107615466B (ja)
TW (1) TWI719054B (ja)
WO (1) WO2017051872A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7185252B2 (ja) * 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010248386A (ja) * 2009-04-16 2010-11-04 Asahi Kasei E-Materials Corp 異方導電性接着フィルムの製造方法
JP2012191195A (ja) * 2011-02-25 2012-10-04 Sekisui Chem Co Ltd 接続構造体の製造方法、異方性導電材料及び接続構造体
JP2015130328A (ja) * 2013-12-03 2015-07-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7605056B2 (en) * 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
KR20070017762A (ko) * 2005-08-08 2007-02-13 엘지.필립스 엘시디 주식회사 식각액 조성물, 이를 이용한 도전막의 패터닝 방법 및평판표시장치의 제조 방법
TWI325967B (en) * 2007-10-19 2010-06-11 Au Optronics Corp Inspection device and method for detecting conductive particle indentations
JP5225766B2 (ja) 2008-06-25 2013-07-03 旭化成イーマテリアルズ株式会社 異方導電性接着シート及び微細接続構造体
JP5358328B2 (ja) * 2009-07-16 2013-12-04 デクセリアルズ株式会社 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法
JP5496343B2 (ja) * 2009-09-29 2014-05-21 コリア アドバンスト インスティテュート オブ サイエンス アンド テクノロジー ナノファイバーを用いた導電性ポリマー接着剤及びその製造方法
JP4752986B1 (ja) * 2010-01-08 2011-08-17 日立化成工業株式会社 回路接続用接着フィルム及び回路接続構造体
JP2011159801A (ja) * 2010-02-01 2011-08-18 Showa Denko Kk 半導体発光素子及びその製造方法、並びにランプ
WO2014007334A1 (ja) * 2012-07-05 2014-01-09 積水化学工業株式会社 導電性粒子、樹脂粒子、導電材料及び接続構造体
JP2014075215A (ja) * 2012-10-03 2014-04-24 Sekisui Chem Co Ltd 絶縁材料、多層フィルム、積層体、接続構造体、積層体の製造方法及び接続構造体の製造方法
JP6161380B2 (ja) * 2013-04-17 2017-07-12 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN105379434B (zh) * 2013-10-29 2018-06-08 积水化学工业株式会社 再生电子部件的制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010248386A (ja) * 2009-04-16 2010-11-04 Asahi Kasei E-Materials Corp 異方導電性接着フィルムの製造方法
JP2012191195A (ja) * 2011-02-25 2012-10-04 Sekisui Chem Co Ltd 接続構造体の製造方法、異方性導電材料及び接続構造体
JP2015130328A (ja) * 2013-12-03 2015-07-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
TW201717217A (zh) 2017-05-16
CN107615466A (zh) 2018-01-19
TWI719054B (zh) 2021-02-21
JP6789118B2 (ja) 2020-11-25
JPWO2017051872A1 (ja) 2018-07-12
CN107615466B (zh) 2021-04-30
KR20180061084A (ko) 2018-06-07
WO2017051872A1 (ja) 2017-03-30

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