TWI719054B - 連接構造體之製造方法、導電性粒子、導電膜及連接構造體 - Google Patents

連接構造體之製造方法、導電性粒子、導電膜及連接構造體 Download PDF

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Publication number
TWI719054B
TWI719054B TW105130926A TW105130926A TWI719054B TW I719054 B TWI719054 B TW I719054B TW 105130926 A TW105130926 A TW 105130926A TW 105130926 A TW105130926 A TW 105130926A TW I719054 B TWI719054 B TW I719054B
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TW
Taiwan
Prior art keywords
electrode
conductive
connection
particles
less
Prior art date
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TW105130926A
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English (en)
Chinese (zh)
Other versions
TW201717217A (zh
Inventor
真原茂雄
王暁舸
土橋悠人
笹平昌男
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日商積水化學工業股份有限公司
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Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW201717217A publication Critical patent/TW201717217A/zh
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Publication of TWI719054B publication Critical patent/TWI719054B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
TW105130926A 2015-09-25 2016-09-23 連接構造體之製造方法、導電性粒子、導電膜及連接構造體 TWI719054B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-188014 2015-09-25
JP2015-188015 2015-09-25
JP2015188015 2015-09-25
JP2015188014 2015-09-25

Publications (2)

Publication Number Publication Date
TW201717217A TW201717217A (zh) 2017-05-16
TWI719054B true TWI719054B (zh) 2021-02-21

Family

ID=58386027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105130926A TWI719054B (zh) 2015-09-25 2016-09-23 連接構造體之製造方法、導電性粒子、導電膜及連接構造體

Country Status (5)

Country Link
JP (1) JP6789118B2 (ja)
KR (1) KR102609199B1 (ja)
CN (1) CN107615466B (ja)
TW (1) TWI719054B (ja)
WO (1) WO2017051872A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7185252B2 (ja) * 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200918913A (en) * 2007-10-19 2009-05-01 Au Optronics Corp Inspection device and method for detecting conductive particle indentations
TW201115591A (en) * 2009-07-16 2011-05-01 Sony Chem & Inf Device Corp Conductive particle, anisotropic conductive film, joined structure, and connecting method
TW201200577A (en) * 2010-01-08 2012-01-01 Hitachi Chemical Co Ltd Circuit connecting adhesion film and circuit connecting structure
JP2012191195A (ja) * 2011-02-25 2012-10-04 Sekisui Chem Co Ltd 接続構造体の製造方法、異方性導電材料及び接続構造体
JP2014075215A (ja) * 2012-10-03 2014-04-24 Sekisui Chem Co Ltd 絶縁材料、多層フィルム、積層体、接続構造体、積層体の製造方法及び接続構造体の製造方法
TW201527370A (zh) * 2013-10-29 2015-07-16 Sekisui Chemical Co Ltd 再生電子零件之製造方法及連接構造體

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7605056B2 (en) * 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
KR20070017762A (ko) * 2005-08-08 2007-02-13 엘지.필립스 엘시디 주식회사 식각액 조성물, 이를 이용한 도전막의 패터닝 방법 및평판표시장치의 제조 방법
JP5225766B2 (ja) 2008-06-25 2013-07-03 旭化成イーマテリアルズ株式会社 異方導電性接着シート及び微細接続構造体
JP5581605B2 (ja) * 2009-04-16 2014-09-03 デクセリアルズ株式会社 異方導電性接着フィルムの製造方法
JP5496343B2 (ja) * 2009-09-29 2014-05-21 コリア アドバンスト インスティテュート オブ サイエンス アンド テクノロジー ナノファイバーを用いた導電性ポリマー接着剤及びその製造方法
JP2011159801A (ja) * 2010-02-01 2011-08-18 Showa Denko Kk 半導体発光素子及びその製造方法、並びにランプ
WO2014007334A1 (ja) * 2012-07-05 2014-01-09 積水化学工業株式会社 導電性粒子、樹脂粒子、導電材料及び接続構造体
JP6161380B2 (ja) * 2013-04-17 2017-07-12 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6397742B2 (ja) * 2013-12-03 2018-09-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200918913A (en) * 2007-10-19 2009-05-01 Au Optronics Corp Inspection device and method for detecting conductive particle indentations
TW201115591A (en) * 2009-07-16 2011-05-01 Sony Chem & Inf Device Corp Conductive particle, anisotropic conductive film, joined structure, and connecting method
TW201200577A (en) * 2010-01-08 2012-01-01 Hitachi Chemical Co Ltd Circuit connecting adhesion film and circuit connecting structure
JP2012191195A (ja) * 2011-02-25 2012-10-04 Sekisui Chem Co Ltd 接続構造体の製造方法、異方性導電材料及び接続構造体
JP2014075215A (ja) * 2012-10-03 2014-04-24 Sekisui Chem Co Ltd 絶縁材料、多層フィルム、積層体、接続構造体、積層体の製造方法及び接続構造体の製造方法
TW201527370A (zh) * 2013-10-29 2015-07-16 Sekisui Chemical Co Ltd 再生電子零件之製造方法及連接構造體

Also Published As

Publication number Publication date
TW201717217A (zh) 2017-05-16
KR102609199B1 (ko) 2023-12-05
CN107615466A (zh) 2018-01-19
JP6789118B2 (ja) 2020-11-25
JPWO2017051872A1 (ja) 2018-07-12
CN107615466B (zh) 2021-04-30
KR20180061084A (ko) 2018-06-07
WO2017051872A1 (ja) 2017-03-30

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