KR102587022B1 - 재료의 전환을 이용한 고체의 분할 - Google Patents

재료의 전환을 이용한 고체의 분할 Download PDF

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Publication number
KR102587022B1
KR102587022B1 KR1020227014422A KR20227014422A KR102587022B1 KR 102587022 B1 KR102587022 B1 KR 102587022B1 KR 1020227014422 A KR1020227014422 A KR 1020227014422A KR 20227014422 A KR20227014422 A KR 20227014422A KR 102587022 B1 KR102587022 B1 KR 102587022B1
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South Korea
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solid
laser
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deformable body
deformable
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Korean (ko)
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KR20220058670A (ko
Inventor
리처 잔
크리스티안 베이어
랄프 리에스케
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실텍트라 게엠베하
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Priority claimed from DE102014018841.8A external-priority patent/DE102014018841A1/de
Priority claimed from DE102014018720.9A external-priority patent/DE102014018720A1/de
Priority claimed from DE102015000449.2A external-priority patent/DE102015000449A1/de
Application filed by 실텍트라 게엠베하 filed Critical 실텍트라 게엠베하
Priority to KR1020237033908A priority Critical patent/KR102753492B1/ko
Publication of KR20220058670A publication Critical patent/KR20220058670A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
KR1020227014422A 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할 Active KR102587022B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237033908A KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
DE102014017583 2014-11-27
DE102014017582.0 2014-11-27
DE102014017583.9 2014-11-27
DE102014017582 2014-11-27
DE102014018841.8A DE102014018841A1 (de) 2014-11-27 2014-12-17 Laserbasiertes Trennverfahren
DE102014018720.9 2014-12-17
DE102014018841.8 2014-12-17
DE102014018720.9A DE102014018720A1 (de) 2014-11-27 2014-12-17 Festkörpertrennverfahren mit laserbasierter Vorschädigung
DE102015000449.2A DE102015000449A1 (de) 2015-01-15 2015-01-15 Festkörperteilung mittels Stoffumwandlung
DE102015000449.2 2015-01-15
PCT/EP2015/077981 WO2016083610A2 (de) 2014-11-27 2015-11-27 Festkörperteilung mittels stoffumwandlung
KR1020207001035A KR20200006641A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207001035A Division KR20200006641A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237033908A Division KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Publications (2)

Publication Number Publication Date
KR20220058670A KR20220058670A (ko) 2022-05-09
KR102587022B1 true KR102587022B1 (ko) 2023-10-10

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KR1020227014422A Active KR102587022B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020257000572A Pending KR20250011236A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020237033908A Active KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020187014524A Ceased KR20180059569A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020177017549A Active KR101864558B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020207001035A Ceased KR20200006641A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Family Applications After (5)

Application Number Title Priority Date Filing Date
KR1020257000572A Pending KR20250011236A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020237033908A Active KR102753492B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020187014524A Ceased KR20180059569A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020177017549A Active KR101864558B1 (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할
KR1020207001035A Ceased KR20200006641A (ko) 2014-11-27 2015-11-27 재료의 전환을 이용한 고체의 분할

Country Status (8)

Country Link
US (3) US11407066B2 (enExample)
EP (6) EP3666445B1 (enExample)
JP (2) JP6396505B2 (enExample)
KR (6) KR102587022B1 (enExample)
CN (3) CN108838562B (enExample)
MY (2) MY174094A (enExample)
SG (1) SG11201704275UA (enExample)
WO (1) WO2016083610A2 (enExample)

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