KR102583836B1 - 표면 보호 필름 및 광학 부재 - Google Patents

표면 보호 필름 및 광학 부재 Download PDF

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Publication number
KR102583836B1
KR102583836B1 KR1020217012809A KR20217012809A KR102583836B1 KR 102583836 B1 KR102583836 B1 KR 102583836B1 KR 1020217012809 A KR1020217012809 A KR 1020217012809A KR 20217012809 A KR20217012809 A KR 20217012809A KR 102583836 B1 KR102583836 B1 KR 102583836B1
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South Korea
Prior art keywords
film
surface protection
acid
meth
mpa
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English (en)
Korean (ko)
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KR20210087942A (ko
Inventor
마사토 야마가타
나츠코 오키타
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20210087942A publication Critical patent/KR20210087942A/ko
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Publication of KR102583836B1 publication Critical patent/KR102583836B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Pens And Brushes (AREA)
  • Prostheses (AREA)
KR1020217012809A 2018-11-06 2019-11-01 표면 보호 필름 및 광학 부재 Active KR102583836B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018208826 2018-11-06
JPJP-P-2018-208826 2018-11-06
PCT/JP2019/042963 WO2020095828A1 (ja) 2018-11-06 2019-11-01 表面保護フィルムおよび光学部材

Publications (2)

Publication Number Publication Date
KR20210087942A KR20210087942A (ko) 2021-07-13
KR102583836B1 true KR102583836B1 (ko) 2023-10-04

Family

ID=70610994

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217012809A Active KR102583836B1 (ko) 2018-11-06 2019-11-01 표면 보호 필름 및 광학 부재

Country Status (5)

Country Link
JP (1) JP7277478B2 (https=)
KR (1) KR102583836B1 (https=)
CN (1) CN113056534B (https=)
TW (1) TWI811477B (https=)
WO (1) WO2020095828A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7132371B2 (ja) * 2021-01-22 2022-09-06 日東電工株式会社 粘着剤層付フィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006630A (ja) * 2002-01-11 2004-01-08 Mitsui Chemicals Inc 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
JP2004259713A (ja) * 2003-02-24 2004-09-16 Mitsui Chemicals Inc 半導体ウエハの表面保護用粘着フィルム、及び該粘着フィルムを用いる半導体ウエハの保護方法
WO2018003893A1 (ja) * 2016-06-30 2018-01-04 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3936810B2 (ja) * 1998-09-14 2007-06-27 日東電工株式会社 帯電防止透明フィルム及びその光学部材
JP4336427B2 (ja) * 1999-10-01 2009-09-30 帝人株式会社 表面保護フィルムおよびそれからなる積層体
JP2003027019A (ja) * 2001-07-23 2003-01-29 Hitachi Chem Co Ltd 光学シート保護用粘着フィルム
JP5174303B2 (ja) * 2001-09-11 2013-04-03 三菱樹脂株式会社 フィルム
TW578222B (en) * 2002-01-11 2004-03-01 Mitsui Chemicals Inc Semiconductor wafer surface protective adhesive tape and backside process method of semiconductor wafer using the same
JP5565620B2 (ja) 2010-07-07 2014-08-06 ナガセケムテックス株式会社 帯電防止性粘着剤組成物、粘着剤層、粘着シート、表面保護フィルム及び偏光板
TWI645967B (zh) * 2012-03-26 2019-01-01 日東電工股份有限公司 Surface protection film
JP2016074899A (ja) 2014-10-08 2016-05-12 昭和電工株式会社 表面保護フィルム用粘着剤組成物及び表面保護フィルム
JP6419548B2 (ja) * 2014-11-27 2018-11-07 日東電工株式会社 表面保護フィルム、表面保護フィルムの製造方法、及び、光学部材
JP2018161783A (ja) * 2017-03-24 2018-10-18 日東電工株式会社 表層材付き樹脂シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006630A (ja) * 2002-01-11 2004-01-08 Mitsui Chemicals Inc 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
JP2004259713A (ja) * 2003-02-24 2004-09-16 Mitsui Chemicals Inc 半導体ウエハの表面保護用粘着フィルム、及び該粘着フィルムを用いる半導体ウエハの保護方法
WO2018003893A1 (ja) * 2016-06-30 2018-01-04 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム

Also Published As

Publication number Publication date
CN113056534A (zh) 2021-06-29
TWI811477B (zh) 2023-08-11
WO2020095828A1 (ja) 2020-05-14
JP7277478B2 (ja) 2023-05-19
CN113056534B (zh) 2022-12-02
KR20210087942A (ko) 2021-07-13
JPWO2020095828A1 (ja) 2021-09-30
TW202028394A (zh) 2020-08-01

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