CN113056534B - 表面保护薄膜及光学构件 - Google Patents

表面保护薄膜及光学构件 Download PDF

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Publication number
CN113056534B
CN113056534B CN201980071806.0A CN201980071806A CN113056534B CN 113056534 B CN113056534 B CN 113056534B CN 201980071806 A CN201980071806 A CN 201980071806A CN 113056534 B CN113056534 B CN 113056534B
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China
Prior art keywords
film
surface protection
meth
acid
acrylate
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Active
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CN201980071806.0A
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English (en)
Chinese (zh)
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CN113056534A (zh
Inventor
山形真人
冲田奈津子
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN113056534A publication Critical patent/CN113056534A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Pens And Brushes (AREA)
  • Prostheses (AREA)
CN201980071806.0A 2018-11-06 2019-11-01 表面保护薄膜及光学构件 Active CN113056534B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018208826 2018-11-06
JP2018-208826 2018-11-06
PCT/JP2019/042963 WO2020095828A1 (ja) 2018-11-06 2019-11-01 表面保護フィルムおよび光学部材

Publications (2)

Publication Number Publication Date
CN113056534A CN113056534A (zh) 2021-06-29
CN113056534B true CN113056534B (zh) 2022-12-02

Family

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CN201980071806.0A Active CN113056534B (zh) 2018-11-06 2019-11-01 表面保护薄膜及光学构件

Country Status (5)

Country Link
JP (1) JP7277478B2 (https=)
KR (1) KR102583836B1 (https=)
CN (1) CN113056534B (https=)
TW (1) TWI811477B (https=)
WO (1) WO2020095828A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7132371B2 (ja) * 2021-01-22 2022-09-06 日東電工株式会社 粘着剤層付フィルム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1431682A (zh) * 2002-01-11 2003-07-23 三井化学株式会社 半导体晶片表面保护粘结膜及使用其的半导体晶片加工方法
JP2004259713A (ja) * 2003-02-24 2004-09-16 Mitsui Chemicals Inc 半導体ウエハの表面保護用粘着フィルム、及び該粘着フィルムを用いる半導体ウエハの保護方法
CN105647410A (zh) * 2014-11-27 2016-06-08 日东电工株式会社 表面保护薄膜、表面保护薄膜的制造方法及光学构件
WO2018003893A1 (ja) * 2016-06-30 2018-01-04 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3936810B2 (ja) * 1998-09-14 2007-06-27 日東電工株式会社 帯電防止透明フィルム及びその光学部材
JP4336427B2 (ja) * 1999-10-01 2009-09-30 帝人株式会社 表面保護フィルムおよびそれからなる積層体
JP2003027019A (ja) * 2001-07-23 2003-01-29 Hitachi Chem Co Ltd 光学シート保護用粘着フィルム
JP5174303B2 (ja) * 2001-09-11 2013-04-03 三菱樹脂株式会社 フィルム
JP4252805B2 (ja) * 2002-01-11 2009-04-08 三井化学株式会社 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
JP5565620B2 (ja) 2010-07-07 2014-08-06 ナガセケムテックス株式会社 帯電防止性粘着剤組成物、粘着剤層、粘着シート、表面保護フィルム及び偏光板
TWI645967B (zh) * 2012-03-26 2019-01-01 日東電工股份有限公司 Surface protection film
JP2016074899A (ja) 2014-10-08 2016-05-12 昭和電工株式会社 表面保護フィルム用粘着剤組成物及び表面保護フィルム
JP2018161783A (ja) * 2017-03-24 2018-10-18 日東電工株式会社 表層材付き樹脂シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1431682A (zh) * 2002-01-11 2003-07-23 三井化学株式会社 半导体晶片表面保护粘结膜及使用其的半导体晶片加工方法
JP2004259713A (ja) * 2003-02-24 2004-09-16 Mitsui Chemicals Inc 半導体ウエハの表面保護用粘着フィルム、及び該粘着フィルムを用いる半導体ウエハの保護方法
CN105647410A (zh) * 2014-11-27 2016-06-08 日东电工株式会社 表面保护薄膜、表面保护薄膜的制造方法及光学构件
WO2018003893A1 (ja) * 2016-06-30 2018-01-04 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム

Also Published As

Publication number Publication date
CN113056534A (zh) 2021-06-29
TWI811477B (zh) 2023-08-11
WO2020095828A1 (ja) 2020-05-14
JP7277478B2 (ja) 2023-05-19
KR102583836B1 (ko) 2023-10-04
KR20210087942A (ko) 2021-07-13
JPWO2020095828A1 (ja) 2021-09-30
TW202028394A (zh) 2020-08-01

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