KR102562873B1 - 테이프 특성의 평가 방법 및 확장 장치 - Google Patents

테이프 특성의 평가 방법 및 확장 장치 Download PDF

Info

Publication number
KR102562873B1
KR102562873B1 KR1020190003705A KR20190003705A KR102562873B1 KR 102562873 B1 KR102562873 B1 KR 102562873B1 KR 1020190003705 A KR1020190003705 A KR 1020190003705A KR 20190003705 A KR20190003705 A KR 20190003705A KR 102562873 B1 KR102562873 B1 KR 102562873B1
Authority
KR
South Korea
Prior art keywords
tape
holding
expansion
unit
holding means
Prior art date
Application number
KR1020190003705A
Other languages
English (en)
Korean (ko)
Other versions
KR20190088015A (ko
Inventor
마사미츠 아가리
요시히로 가와구치
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190088015A publication Critical patent/KR20190088015A/ko
Application granted granted Critical
Publication of KR102562873B1 publication Critical patent/KR102562873B1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
KR1020190003705A 2018-01-17 2019-01-11 테이프 특성의 평가 방법 및 확장 장치 KR102562873B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018005825A JP7126829B2 (ja) 2018-01-17 2018-01-17 テープ特性の評価方法及び拡張装置
JPJP-P-2018-005825 2018-01-17

Publications (2)

Publication Number Publication Date
KR20190088015A KR20190088015A (ko) 2019-07-25
KR102562873B1 true KR102562873B1 (ko) 2023-08-02

Family

ID=67274137

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190003705A KR102562873B1 (ko) 2018-01-17 2019-01-11 테이프 특성의 평가 방법 및 확장 장치

Country Status (3)

Country Link
JP (1) JP7126829B2 (ja)
KR (1) KR102562873B1 (ja)
CN (1) CN110047769B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110931382B (zh) * 2019-12-11 2022-04-08 湘能华磊光电股份有限公司 一种led晶粒的光电性能检测方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001225986A (ja) * 2000-02-16 2001-08-21 Ricoh Co Ltd シート材保持装置
JP2014143297A (ja) 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 拡張装置および拡張方法
JP2015211079A (ja) 2014-04-24 2015-11-24 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2016012636A (ja) * 2014-06-27 2016-01-21 株式会社ディスコ テープ拡張装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09113438A (ja) * 1995-10-23 1997-05-02 Sekisui Chem Co Ltd 粘着テープの剥離試験器
JP4647830B2 (ja) 2001-05-10 2011-03-09 株式会社ディスコ 被加工物の分割処理方法および分割処理方法に用いるチップ間隔拡張装置
WO2009136635A1 (ja) * 2008-05-09 2009-11-12 日東電工株式会社 剥離試験装置、粘着テープの衝撃剥離特性の評価方法、粘着テープ及びモバイル機器
US20100003119A1 (en) 2008-07-07 2010-01-07 Disco Corporation Method for picking up device attached with adhesive tape
CN103245608A (zh) * 2012-02-14 2013-08-14 鸿富锦精密工业（深圳）有限公司 双面胶粘合力检测装置
JP5973883B2 (ja) * 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
JP2017516998A (ja) * 2014-05-27 2017-06-22 インターテープ ポリマー コーポレーション テープシール強度の試験装置及び試験方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001225986A (ja) * 2000-02-16 2001-08-21 Ricoh Co Ltd シート材保持装置
JP2014143297A (ja) 2013-01-24 2014-08-07 Disco Abrasive Syst Ltd 拡張装置および拡張方法
JP2015211079A (ja) 2014-04-24 2015-11-24 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2016012636A (ja) * 2014-06-27 2016-01-21 株式会社ディスコ テープ拡張装置

Also Published As

Publication number Publication date
CN110047769A (zh) 2019-07-23
JP2019125719A (ja) 2019-07-25
CN110047769B (zh) 2024-03-19
JP7126829B2 (ja) 2022-08-29
KR20190088015A (ko) 2019-07-25

Similar Documents

Publication Publication Date Title
TWI774949B (zh) 擴張方法及擴張裝置
KR102562873B1 (ko) 테이프 특성의 평가 방법 및 확장 장치
JP2016040079A (ja) 脆性材料基板の分断方法及び分断装置
KR20190079509A (ko) 분할 장치
US10872791B2 (en) Tape attaching method and tape attaching apparatus
KR20180061024A (ko) 취성 재료 기판의 분단 방법 및 분단 장치
US10103055B2 (en) Expansion sheet, expansion sheet manufacturing method, and expansion sheet expanding method
JP2016043503A (ja) 脆性材料基板の分断方法、脆性材料基板分断用の基板保持部材、および、脆性材料基板の分断時に使用する粘着フィルム張設用の枠体
JP6110257B2 (ja) ウエーハユニットの処理方法
JP7486345B2 (ja) エキスパンド方法及びエキスパンド装置
JP7224214B2 (ja) 拡張装置
KR20220066832A (ko) 익스팬드 장치 및 익스팬드 방법
TWI676539B (zh) 樹脂片材之分斷方法及分斷裝置
JP2023005232A (ja) 拡張方法及び拡張装置
JP6140325B2 (ja) 脆性材料基板の分断装置
JP7483561B2 (ja) エキスパンド方法及びエキスパンド装置
JP6408365B2 (ja) 間隔調整装置および調整方法
JP2022178915A (ja) エキスパンド方法及びエキスパンド装置
JP2021176176A (ja) エキスパンド方法及びエキスパンド装置
JP2021044495A (ja) 被加工物の加工方法
KR20240025635A (ko) 익스팬드 장치, 반도체 칩의 제조 방법 및 반도체 칩
JP2023020149A (ja) 加工装置
KR20210111696A (ko) 분할 방법 및 분할 장치
KR20190079512A (ko) 피가공물의 분할 방법 및 분할 장치

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant