KR102541387B1 - 인덕터들을 갖는 유리 웨이퍼를 이용한 진보된-노드 soc(system-on-chip)를 갖는 인덕터들의 통합 및 웨이퍼간 결합 - Google Patents

인덕터들을 갖는 유리 웨이퍼를 이용한 진보된-노드 soc(system-on-chip)를 갖는 인덕터들의 통합 및 웨이퍼간 결합 Download PDF

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KR102541387B1
KR102541387B1 KR1020187009210A KR20187009210A KR102541387B1 KR 102541387 B1 KR102541387 B1 KR 102541387B1 KR 1020187009210 A KR1020187009210 A KR 1020187009210A KR 20187009210 A KR20187009210 A KR 20187009210A KR 102541387 B1 KR102541387 B1 KR 102541387B1
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wafer
inductor
inductor wafer
soc
forming
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KR20180048948A (ko
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카림 아라비
라빈드라 바만 쉬노이
예브게니 페트로비치 고세브
메테 에르터크
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퀄컴 인코포레이티드
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    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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KR1020187009210A 2015-09-02 2016-08-08 인덕터들을 갖는 유리 웨이퍼를 이용한 진보된-노드 soc(system-on-chip)를 갖는 인덕터들의 통합 및 웨이퍼간 결합 Active KR102541387B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/843,964 US20170062398A1 (en) 2015-09-02 2015-09-02 Integration of inductors with advanced-node system-on-chip (soc) using glass wafer with inductors and wafer-to-wafer joining
US14/843,964 2015-09-02
PCT/US2016/045998 WO2017039962A1 (en) 2015-09-02 2016-08-08 Integration of inductors with advanced-node system-on-chip (soc) using glass wafer with inductors and wafer-to-wafer joining

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Publication Number Publication Date
KR20180048948A KR20180048948A (ko) 2018-05-10
KR102541387B1 true KR102541387B1 (ko) 2023-06-08

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US (2) US20170062398A1 (enExample)
EP (1) EP3345218B1 (enExample)
JP (1) JP2018532260A (enExample)
KR (1) KR102541387B1 (enExample)
CN (1) CN108012565A (enExample)
BR (1) BR112018004288A2 (enExample)
CA (1) CA2992855A1 (enExample)
WO (1) WO2017039962A1 (enExample)

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