CN108012565A - 通过电感器及晶片到晶片接合使用玻璃晶片将电感器与先进节点片上系统(soc)集成 - Google Patents

通过电感器及晶片到晶片接合使用玻璃晶片将电感器与先进节点片上系统(soc)集成 Download PDF

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Publication number
CN108012565A
CN108012565A CN201680048793.1A CN201680048793A CN108012565A CN 108012565 A CN108012565 A CN 108012565A CN 201680048793 A CN201680048793 A CN 201680048793A CN 108012565 A CN108012565 A CN 108012565A
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inductor
wafer
die
soc
vias
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Chinese (zh)
Inventor
卡里姆·阿拉比
拉温德拉·瓦曼·谢诺伊
艾弗杰尼·佩托维奇·高瑟夫
梅特·埃蒂尔克
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Qualcomm Inc
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Qualcomm Inc
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing & Machinery (AREA)
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  • Geometry (AREA)
CN201680048793.1A 2015-09-02 2016-08-08 通过电感器及晶片到晶片接合使用玻璃晶片将电感器与先进节点片上系统(soc)集成 Pending CN108012565A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/843,964 US20170062398A1 (en) 2015-09-02 2015-09-02 Integration of inductors with advanced-node system-on-chip (soc) using glass wafer with inductors and wafer-to-wafer joining
US14/843,964 2015-09-02
PCT/US2016/045998 WO2017039962A1 (en) 2015-09-02 2016-08-08 Integration of inductors with advanced-node system-on-chip (soc) using glass wafer with inductors and wafer-to-wafer joining

Publications (1)

Publication Number Publication Date
CN108012565A true CN108012565A (zh) 2018-05-08

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CN201680048793.1A Pending CN108012565A (zh) 2015-09-02 2016-08-08 通过电感器及晶片到晶片接合使用玻璃晶片将电感器与先进节点片上系统(soc)集成

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US (2) US20170062398A1 (enExample)
EP (1) EP3345218B1 (enExample)
JP (1) JP2018532260A (enExample)
KR (1) KR102541387B1 (enExample)
CN (1) CN108012565A (enExample)
BR (1) BR112018004288A2 (enExample)
CA (1) CA2992855A1 (enExample)
WO (1) WO2017039962A1 (enExample)

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US9935076B1 (en) * 2015-09-30 2018-04-03 Apple Inc. Structure and method for fabricating a computing system with an integrated voltage regulator module
US20170169934A1 (en) * 2015-12-15 2017-06-15 Globalfoundries Inc. Patterned magnetic shields for inductors and transformers
WO2019066951A1 (en) * 2017-09-29 2019-04-04 Intel Corporation MAGNETIC CORE / ENVELOPE PARTICLES FOR INDUCER NETWORKS
US11538617B2 (en) * 2018-06-29 2022-12-27 Intel Corporation Integrated magnetic core inductors on glass core substrates
US11271071B2 (en) * 2019-11-15 2022-03-08 Nuvia, Inc. Integrated system with power management integrated circuit having on-chip thin film inductors
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US20170062398A1 (en) 2017-03-02
KR20180048948A (ko) 2018-05-10
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KR102541387B1 (ko) 2023-06-08
JP2018532260A (ja) 2018-11-01

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