KR102526024B1 - 열경화성 조성물 및 그를 이용한 도전성 접착제 - Google Patents

열경화성 조성물 및 그를 이용한 도전성 접착제 Download PDF

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Publication number
KR102526024B1
KR102526024B1 KR1020187013145A KR20187013145A KR102526024B1 KR 102526024 B1 KR102526024 B1 KR 102526024B1 KR 1020187013145 A KR1020187013145 A KR 1020187013145A KR 20187013145 A KR20187013145 A KR 20187013145A KR 102526024 B1 KR102526024 B1 KR 102526024B1
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KR
South Korea
Prior art keywords
component
meth
thermosetting composition
acrylate
present
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KR1020187013145A
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English (en)
Korean (ko)
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KR20180087247A (ko
Inventor
소이치 오타
히토시 마후네
마코토 카토
토모야 코다마
마사유키 오사다
Original Assignee
가부시끼가이샤 쓰리본드
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Publication of KR20180087247A publication Critical patent/KR20180087247A/ko
Application granted granted Critical
Publication of KR102526024B1 publication Critical patent/KR102526024B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/28—Oxygen or compounds releasing free oxygen
    • C08F4/32—Organic compounds
    • C08F4/34—Per-compounds with one peroxy-radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymerization Catalysts (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020187013145A 2015-11-26 2016-11-25 열경화성 조성물 및 그를 이용한 도전성 접착제 KR102526024B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015230610 2015-11-26
JPJP-P-2015-230610 2015-11-26
PCT/JP2016/085071 WO2017090759A1 (fr) 2015-11-26 2016-11-25 Composition thermodurcissable et adhésif conducteur l'utilisant

Publications (2)

Publication Number Publication Date
KR20180087247A KR20180087247A (ko) 2018-08-01
KR102526024B1 true KR102526024B1 (ko) 2023-04-25

Family

ID=58763501

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187013145A KR102526024B1 (ko) 2015-11-26 2016-11-25 열경화성 조성물 및 그를 이용한 도전성 접착제

Country Status (4)

Country Link
JP (1) JP6781382B2 (fr)
KR (1) KR102526024B1 (fr)
CN (1) CN108350105B (fr)
WO (1) WO2017090759A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019206417A1 (fr) * 2018-04-26 2019-10-31 Henkel Ag & Co. Kgaa Adhésif électroconducteur pour fixer des cellules solaires

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011087008A1 (fr) * 2010-01-14 2011-07-21 三菱レイヨン株式会社 Composition de résine durcissable, substance résultant du durcissement de ladite composition, et élément optique
WO2012141299A1 (fr) * 2011-04-15 2012-10-18 電気化学工業株式会社 Composition durcissable
JP2015135805A (ja) * 2013-12-16 2015-07-27 日立化成株式会社 樹脂ペースト組成物及び半導体装置
WO2015115552A1 (fr) 2014-01-29 2015-08-06 日立化成株式会社 Composition adhésive, produit durci de résine obtenu à partir de la composition adhésive, procédé de fabrication d'un dispositif à semi-conducteurs utilisant la composition adhésive, et élément d'imagerie à semi-conducteurs

Family Cites Families (12)

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KR100538372B1 (ko) * 2001-01-17 2005-12-21 미쯔이카가쿠 가부시기가이샤 수지조성물, 상기 조성물을 함유하는 도료, 도막 및도막의 형성방법
JP3907525B2 (ja) * 2001-05-25 2007-04-18 三井化学株式会社 樹脂組成物
KR100780136B1 (ko) * 2002-11-29 2007-11-28 히다치 가세고교 가부시끼가이샤 접착제조성물
US7612127B2 (en) * 2003-12-22 2009-11-03 Denki Kagaku Kogyo Kabushiki Kaisha Curable resin composition
JP4343016B2 (ja) 2004-04-15 2009-10-14 株式会社クラレ アクリル系封止材および封止物
KR100690344B1 (ko) * 2004-12-11 2007-03-09 주식회사 엘지화학 내화학성, 유동성 및 내변색성이 우수한 투명 공중합체수지 제조 방법 및 그 공중합체 수지
WO2012118061A1 (fr) * 2011-03-01 2012-09-07 ナミックス株式会社 Composition conductrice de l'électricité
JP5861824B2 (ja) * 2011-11-17 2016-02-16 スリーボンドファインケミカル株式会社 熱硬化性組成物
JP2015074776A (ja) * 2013-10-11 2015-04-20 株式会社日本触媒 硬化性樹脂組成物
CN103820042A (zh) * 2014-02-27 2014-05-28 深圳市友联亨达光电有限公司 一种热固化型光学透明热熔胶膜（toca）及贴合方法
JP6456134B2 (ja) * 2014-12-23 2019-01-23 ナミックス株式会社 導電性樹脂組成物、ディスペンス用導電性樹脂組成物、ダイアタッチ剤、および半導体装置
WO2016145652A1 (fr) * 2015-03-19 2016-09-22 Ablestik (Shanghai) Ltd. Procédé de fabrication d'un dispositif semi-conducteur optique, une composition de résine thermodurcissable associée, et un semi-conducteur optique obtenu à partir de celle-ci

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011087008A1 (fr) * 2010-01-14 2011-07-21 三菱レイヨン株式会社 Composition de résine durcissable, substance résultant du durcissement de ladite composition, et élément optique
WO2012141299A1 (fr) * 2011-04-15 2012-10-18 電気化学工業株式会社 Composition durcissable
JP2015135805A (ja) * 2013-12-16 2015-07-27 日立化成株式会社 樹脂ペースト組成物及び半導体装置
WO2015115552A1 (fr) 2014-01-29 2015-08-06 日立化成株式会社 Composition adhésive, produit durci de résine obtenu à partir de la composition adhésive, procédé de fabrication d'un dispositif à semi-conducteurs utilisant la composition adhésive, et élément d'imagerie à semi-conducteurs

Also Published As

Publication number Publication date
WO2017090759A1 (fr) 2017-06-01
CN108350105B (zh) 2020-10-13
CN108350105A (zh) 2018-07-31
JP6781382B2 (ja) 2020-11-04
JPWO2017090759A1 (ja) 2018-09-20
KR20180087247A (ko) 2018-08-01

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