KR102515856B1 - 척테이블 - Google Patents

척테이블 Download PDF

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Publication number
KR102515856B1
KR102515856B1 KR1020180064232A KR20180064232A KR102515856B1 KR 102515856 B1 KR102515856 B1 KR 102515856B1 KR 1020180064232 A KR1020180064232 A KR 1020180064232A KR 20180064232 A KR20180064232 A KR 20180064232A KR 102515856 B1 KR102515856 B1 KR 102515856B1
Authority
KR
South Korea
Prior art keywords
holding
plate
holding surface
suction
work
Prior art date
Application number
KR1020180064232A
Other languages
English (en)
Korean (ko)
Other versions
KR20180134292A (ko
Inventor
사토시 야마나카
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20180134292A publication Critical patent/KR20180134292A/ko
Application granted granted Critical
Publication of KR102515856B1 publication Critical patent/KR102515856B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
KR1020180064232A 2017-06-08 2018-06-04 척테이블 KR102515856B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017113376A JP7007816B2 (ja) 2017-06-08 2017-06-08 チャックテーブル
JPJP-P-2017-113376 2017-06-08

Publications (2)

Publication Number Publication Date
KR20180134292A KR20180134292A (ko) 2018-12-18
KR102515856B1 true KR102515856B1 (ko) 2023-03-29

Family

ID=64820283

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180064232A KR102515856B1 (ko) 2017-06-08 2018-06-04 척테이블

Country Status (4)

Country Link
JP (1) JP7007816B2 (zh)
KR (1) KR102515856B1 (zh)
CN (1) CN109048655B (zh)
TW (1) TWI733020B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6880112B2 (ja) * 2019-07-08 2021-06-02 株式会社日本ピスコ 移動装置の吸着機構
CN112792711B (zh) * 2020-12-31 2022-05-17 武汉风帆电化科技股份有限公司 一种晶硅片碱抛光装置及抛光工艺
JP2023061565A (ja) 2021-10-20 2023-05-02 株式会社ディスコ ウェーハの研削方法及び研削装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031979A (ja) * 2014-07-28 2016-03-07 株式会社日本セラテック 真空チャック
WO2016092700A1 (ja) * 2014-12-12 2016-06-16 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2520977A (en) * 1947-05-08 1950-09-05 Lens Block Corp Vacuum lens block
JPH03289154A (ja) * 1990-04-05 1991-12-19 Toshiba Corp 半導体ウエーハチャック装置
JP2768867B2 (ja) * 1991-03-29 1998-06-25 株式会社日立製作所 真空チャック装置
TW200303593A (en) * 2002-02-19 2003-09-01 Olympus Optical Co Substrate sucking apparatus
JP5446662B2 (ja) * 2008-09-26 2014-03-19 Ｎｏｋ株式会社 密封構造
JP5486970B2 (ja) * 2010-03-17 2014-05-07 東京エレクトロン株式会社 基板脱着方法及び基板処理装置
JP2014072510A (ja) * 2012-10-02 2014-04-21 Disco Abrasive Syst Ltd チャックテーブル
CN203529438U (zh) * 2013-07-22 2014-04-09 温州阿尔贝斯气动有限公司 一种真空吸盘
CN105161449A (zh) * 2014-05-30 2015-12-16 盛美半导体设备（上海）有限公司 晶圆固定装置
JP6732429B2 (ja) * 2014-11-28 2020-07-29 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法
CN204584958U (zh) * 2015-01-26 2015-08-26 青海青玻实业有限公司 一种玻璃搬运用吸盘装置
JP6486770B2 (ja) * 2015-05-20 2019-03-20 株式会社ディスコ 切削装置
CN207795254U (zh) * 2018-01-15 2018-08-31 廊坊市建科汇峰科技有限公司 盾构机用密封圈

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031979A (ja) * 2014-07-28 2016-03-07 株式会社日本セラテック 真空チャック
WO2016092700A1 (ja) * 2014-12-12 2016-06-16 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法

Also Published As

Publication number Publication date
TW201903878A (zh) 2019-01-16
CN109048655B (zh) 2022-06-28
KR20180134292A (ko) 2018-12-18
JP7007816B2 (ja) 2022-01-25
TWI733020B (zh) 2021-07-11
JP2018207033A (ja) 2018-12-27
CN109048655A (zh) 2018-12-21

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