KR102507583B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102507583B1
KR102507583B1 KR1020200114597A KR20200114597A KR102507583B1 KR 102507583 B1 KR102507583 B1 KR 102507583B1 KR 1020200114597 A KR1020200114597 A KR 1020200114597A KR 20200114597 A KR20200114597 A KR 20200114597A KR 102507583 B1 KR102507583 B1 KR 102507583B1
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KR
South Korea
Prior art keywords
substrate
outer edge
image
processing
nozzle
Prior art date
Application number
KR1020200114597A
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English (en)
Korean (ko)
Other versions
KR20210031832A (ko
Inventor
히로아키 가쿠마
유지 오키타
히데지 나오하라
다쓰야 마스이
유이치 데바
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20210031832A publication Critical patent/KR20210031832A/ko
Application granted granted Critical
Publication of KR102507583B1 publication Critical patent/KR102507583B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Image Analysis (AREA)
KR1020200114597A 2019-09-13 2020-09-08 기판 처리 장치 및 기판 처리 방법 KR102507583B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-166984 2019-09-13
JP2019166984A JP7330027B2 (ja) 2019-09-13 2019-09-13 基板処理装置、および、基板処理方法

Publications (2)

Publication Number Publication Date
KR20210031832A KR20210031832A (ko) 2021-03-23
KR102507583B1 true KR102507583B1 (ko) 2023-03-08

Family

ID=74862505

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200114597A KR102507583B1 (ko) 2019-09-13 2020-09-08 기판 처리 장치 및 기판 처리 방법

Country Status (4)

Country Link
JP (1) JP7330027B2 (ja)
KR (1) KR102507583B1 (ja)
CN (1) CN112509940B (ja)
TW (1) TWI744972B (ja)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4326751B2 (ja) 2002-05-24 2009-09-09 大日本スクリーン製造株式会社 基板処理ユニット
US7366344B2 (en) * 2003-07-14 2008-04-29 Rudolph Technologies, Inc. Edge normal process
JP2006114800A (ja) * 2004-10-18 2006-04-27 Seiko Epson Corp 試料エッジ処理装置、試料エッジ処理方法、及び半導体装置の製造方法
US7616804B2 (en) * 2006-07-11 2009-11-10 Rudolph Technologies, Inc. Wafer edge inspection and metrology
TW200916764A (en) * 2007-09-05 2009-04-16 Nikon Corp Monitoring apparatus, monitoring method, inspecting apparatus and inspecting method
KR101023068B1 (ko) * 2008-10-29 2011-06-14 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 처리 방법
KR101191034B1 (ko) * 2009-08-19 2012-10-12 세메스 주식회사 모니터링 시스템 및 그 방법
CN103033127B (zh) * 2011-10-09 2015-07-22 上海微电子装备有限公司 一种基板预对准位姿测量方法
JP5661022B2 (ja) 2011-11-21 2015-01-28 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP5836223B2 (ja) * 2011-12-02 2015-12-24 株式会社神戸製鋼所 貼合基板の回転ズレ量計測装置、貼合基板の回転ズレ量計測方法、及び貼合基板の製造方法
JP6351992B2 (ja) * 2014-02-17 2018-07-04 株式会社Ｓｃｒｅｅｎホールディングス 変位検出装置、基板処理装置、変位検出方法および基板処理方法
KR102308587B1 (ko) * 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
US10196741B2 (en) * 2014-06-27 2019-02-05 Applied Materials, Inc. Wafer placement and gap control optimization through in situ feedback
JP6584356B2 (ja) * 2016-03-30 2019-10-02 東京エレクトロン株式会社 基板処理装置及び基板処理装置の処理方法
JP2018054429A (ja) * 2016-09-28 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 検出方法および検出装置
JP2019036634A (ja) 2017-08-15 2019-03-07 東京エレクトロン株式会社 基板処理装置
JP6934435B2 (ja) 2018-02-26 2021-09-15 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法、基板処理装置、および基板処理方法

Also Published As

Publication number Publication date
KR20210031832A (ko) 2021-03-23
TWI744972B (zh) 2021-11-01
CN112509940A (zh) 2021-03-16
JP2021044478A (ja) 2021-03-18
CN112509940B (zh) 2024-03-26
TW202111283A (zh) 2021-03-16
JP7330027B2 (ja) 2023-08-21

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