KR102505236B1 - 백사이드 반도체 성장 - Google Patents
백사이드 반도체 성장 Download PDFInfo
- Publication number
- KR102505236B1 KR102505236B1 KR1020197003917A KR20197003917A KR102505236B1 KR 102505236 B1 KR102505236 B1 KR 102505236B1 KR 1020197003917 A KR1020197003917 A KR 1020197003917A KR 20197003917 A KR20197003917 A KR 20197003917A KR 102505236 B1 KR102505236 B1 KR 102505236B1
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- South Korea
- Prior art keywords
- backside
- source
- drain region
- transistor
- circuit structure
- Prior art date
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- H01L29/165—
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
- H10D62/822—Heterojunctions comprising only Group IV materials heterojunctions, e.g. Si/Ge heterojunctions
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/006—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using switches for selecting the desired band
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0212—Manufacture or treatment of FETs having insulated gates [IGFET] using self-aligned silicidation
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- H10D30/027—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs
- H10D30/0278—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs forming single crystalline channels on wafers after forming insulating device isolations
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/637—Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
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- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6744—Monocrystalline silicon
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
- H10D30/797—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions being in source or drain regions, e.g. SiGe source or drain
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- H10D62/113—Isolations within a component, i.e. internal isolations
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- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
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- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
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- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
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- H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
- H10D64/0112—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors using conductive layers comprising silicides
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- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
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- H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
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- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/19—Preparing inhomogeneous wafers
- H10P90/1904—Preparing vertically inhomogeneous wafers
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- H10P90/19—Preparing inhomogeneous wafers
- H10P90/1904—Preparing vertically inhomogeneous wafers
- H10P90/1906—Preparing SOI wafers
- H10P90/1922—Preparing SOI wafers using silicon etch back techniques, e.g. BESOI or ELTRAN
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- H10W20/0245—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising use of blind vias during the manufacture
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- H10W20/211—Through-semiconductor vias, e.g. TSVs
- H10W20/218—Through-semiconductor vias, e.g. TSVs in silicon-on-insulator [SOI] wafers
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- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
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- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
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- H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
- H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
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- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/234,889 | 2016-08-11 | ||
| US15/234,889 US9780210B1 (en) | 2016-08-11 | 2016-08-11 | Backside semiconductor growth |
| PCT/US2017/041755 WO2018031175A1 (en) | 2016-08-11 | 2017-07-12 | Backside semiconductor growth |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190036533A KR20190036533A (ko) | 2019-04-04 |
| KR102505236B1 true KR102505236B1 (ko) | 2023-03-02 |
Family
ID=59485418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197003917A Active KR102505236B1 (ko) | 2016-08-11 | 2017-07-12 | 백사이드 반도체 성장 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9780210B1 (https=) |
| EP (1) | EP3497715B8 (https=) |
| JP (1) | JP7158373B2 (https=) |
| KR (1) | KR102505236B1 (https=) |
| CN (1) | CN109643691B (https=) |
| BR (1) | BR112019002343B1 (https=) |
| CA (1) | CA3030289C (https=) |
| WO (1) | WO2018031175A1 (https=) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017052562A1 (en) | 2015-09-24 | 2017-03-30 | Intel Corporation | Methods of forming backside self-aligned vias and structures formed thereby |
| EP3440705A4 (en) | 2016-04-01 | 2019-11-13 | INTEL Corporation | TRANSISTOR CELLS WITH A DEEP CONTACT WITH CLADDING OF DIELECTRIC MATERIAL |
| US9847293B1 (en) * | 2016-08-18 | 2017-12-19 | Qualcomm Incorporated | Utilization of backside silicidation to form dual side contacted capacitor |
| CN109643742B (zh) | 2016-08-26 | 2024-09-27 | 英特尔公司 | 集成电路器件结构和双侧制造技术 |
| US10431664B2 (en) * | 2017-06-30 | 2019-10-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gate structure and methods thereof |
| DE102018106266B4 (de) | 2017-06-30 | 2024-07-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Halbleitervorrichtung und verfahren zu ihrer herstellung |
| US10439565B2 (en) * | 2017-09-27 | 2019-10-08 | Qualcomm Incorporated | Low parasitic capacitance low noise amplifier |
| KR102019354B1 (ko) | 2017-11-03 | 2019-09-09 | 삼성전자주식회사 | 안테나 모듈 |
| WO2019132863A1 (en) | 2017-12-26 | 2019-07-04 | Intel Corporation | Stacked transistors with contact last |
| WO2019172879A1 (en) | 2018-03-05 | 2019-09-12 | Intel Corporation | Metallization structures for stacked device connectivity and their methods of fabrication |
| US10580903B2 (en) | 2018-03-13 | 2020-03-03 | Psemi Corporation | Semiconductor-on-insulator transistor with improved breakdown characteristics |
| CN110504240B (zh) * | 2018-05-16 | 2021-08-13 | 联华电子股份有限公司 | 半导体元件及其制造方法 |
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| BR112019002343B1 (pt) | 2023-04-04 |
| CA3030289A1 (en) | 2018-02-15 |
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| WO2018031175A1 (en) | 2018-02-15 |
| CA3030289C (en) | 2025-02-18 |
| KR20190036533A (ko) | 2019-04-04 |
| EP3497715B8 (en) | 2025-07-09 |
| EP3497715A1 (en) | 2019-06-19 |
| JP2019525478A (ja) | 2019-09-05 |
| CN109643691B (zh) | 2023-09-01 |
| US9780210B1 (en) | 2017-10-03 |
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