KR102486893B1 - 수지 조성물, 경화물, 봉지용 필름 및 봉지 구조체 - Google Patents

수지 조성물, 경화물, 봉지용 필름 및 봉지 구조체 Download PDF

Info

Publication number
KR102486893B1
KR102486893B1 KR1020187006211A KR20187006211A KR102486893B1 KR 102486893 B1 KR102486893 B1 KR 102486893B1 KR 1020187006211 A KR1020187006211 A KR 1020187006211A KR 20187006211 A KR20187006211 A KR 20187006211A KR 102486893 B1 KR102486893 B1 KR 102486893B1
Authority
KR
South Korea
Prior art keywords
mass
resin composition
film
inorganic filler
sealing
Prior art date
Application number
KR1020187006211A
Other languages
English (en)
Korean (ko)
Other versions
KR20180048674A (ko
Inventor
유스케 와타세
다이스케 후지모토
유타카 노무라
히로쿠니 오기하라
도모요 가네코
마사야 도바
마사히코 스즈키
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼와덴코머티리얼즈가부시끼가이샤 filed Critical 쇼와덴코머티리얼즈가부시끼가이샤
Publication of KR20180048674A publication Critical patent/KR20180048674A/ko
Application granted granted Critical
Publication of KR102486893B1 publication Critical patent/KR102486893B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020187006211A 2015-09-02 2016-09-01 수지 조성물, 경화물, 봉지용 필름 및 봉지 구조체 KR102486893B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015172851 2015-09-02
JPJP-P-2015-172851 2015-09-02
PCT/JP2016/075688 WO2017038941A1 (ja) 2015-09-02 2016-09-01 樹脂組成物、硬化物、封止用フィルム及び封止構造体

Publications (2)

Publication Number Publication Date
KR20180048674A KR20180048674A (ko) 2018-05-10
KR102486893B1 true KR102486893B1 (ko) 2023-01-09

Family

ID=58187629

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187006211A KR102486893B1 (ko) 2015-09-02 2016-09-01 수지 조성물, 경화물, 봉지용 필름 및 봉지 구조체

Country Status (5)

Country Link
JP (3) JP6763391B2 (ja)
KR (1) KR102486893B1 (ja)
CN (1) CN107924886A (ja)
TW (2) TWI825365B (ja)
WO (1) WO2017038941A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019017283A1 (ja) * 2017-07-21 2019-01-24 株式会社村田製作所 電子部品
KR20200094221A (ko) * 2017-12-28 2020-08-06 히타치가세이가부시끼가이샤 볼 그리드 어레이 패키지 밀봉용 에폭시 수지 조성물, 에폭시 수지 경화물 및 전자 부품 장치
WO2020065872A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2022107395A (ja) * 2021-01-08 2022-07-21 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物及び電子部品装置
CN114437511A (zh) * 2021-12-31 2022-05-06 江苏科化新材料科技有限公司 环氧树脂组合物及其应用、环氧树脂成型材料及其制备方法与应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012025907A (ja) 2010-07-27 2012-02-09 Panasonic Electric Works Co Ltd 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品
JP2012188555A (ja) 2011-03-10 2012-10-04 Sumitomo Bakelite Co Ltd 半導体装置および半導体装置の製造方法
JP2014029958A (ja) 2012-07-31 2014-02-13 Ajinomoto Co Inc 半導体装置の製造方法
JP2015106698A (ja) * 2013-12-02 2015-06-08 味の素株式会社 半導体装置の製造方法
WO2015098838A1 (ja) 2013-12-26 2015-07-02 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56166729A (en) 1980-05-06 1981-12-22 Mitsubishi Electric Corp Automatic speed aligning device
JP2001127095A (ja) 1999-10-29 2001-05-11 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2001244372A (ja) 2000-03-01 2001-09-07 Seiko Epson Corp 半導体装置およびその製造方法
JP3995421B2 (ja) * 2001-01-19 2007-10-24 株式会社ルネサステクノロジ 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JP2005200533A (ja) * 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2006028264A (ja) * 2004-07-13 2006-02-02 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2008274083A (ja) * 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2010229269A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 熱伝導性エポキシ樹脂シート材
JP2013006893A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
JP5983085B2 (ja) * 2012-06-25 2016-08-31 住友ベークライト株式会社 エポキシ樹脂組成物及び電子部品装置
WO2015098842A1 (ja) * 2013-12-26 2015-07-02 日東電工株式会社 半導体装置の製造方法
JP2015126124A (ja) * 2013-12-26 2015-07-06 日東電工株式会社 半導体パッケージの製造方法
JP6584752B2 (ja) * 2014-06-12 2019-10-02 日東電工株式会社 封止用樹脂シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012025907A (ja) 2010-07-27 2012-02-09 Panasonic Electric Works Co Ltd 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品
JP2012188555A (ja) 2011-03-10 2012-10-04 Sumitomo Bakelite Co Ltd 半導体装置および半導体装置の製造方法
JP2014029958A (ja) 2012-07-31 2014-02-13 Ajinomoto Co Inc 半導体装置の製造方法
JP2015106698A (ja) * 2013-12-02 2015-06-08 味の素株式会社 半導体装置の製造方法
WO2015098838A1 (ja) 2013-12-26 2015-07-02 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート

Also Published As

Publication number Publication date
JP7115520B2 (ja) 2022-08-09
CN107924886A (zh) 2018-04-17
TW201718692A (zh) 2017-06-01
TW202126719A (zh) 2021-07-16
JPWO2017038941A1 (ja) 2018-06-14
JP6763391B2 (ja) 2020-09-30
WO2017038941A1 (ja) 2017-03-09
KR20180048674A (ko) 2018-05-10
JP2022136188A (ja) 2022-09-15
TWI825365B (zh) 2023-12-11
TWI714625B (zh) 2021-01-01
JP2020200478A (ja) 2020-12-17

Similar Documents

Publication Publication Date Title
US9873771B2 (en) Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
KR102486893B1 (ko) 수지 조성물, 경화물, 봉지용 필름 및 봉지 구조체
JP6749887B2 (ja) 封止用フィルム及びそれを用いた電子部品装置
CN109155256B (zh) 密封结构体及其制造方法、以及密封材
JP6717005B2 (ja) 樹脂組成物、硬化物、樹脂フィルム、封止材及び封止構造体
JP7099453B2 (ja) 封止用フィルム、封止構造体及び封止構造体の製造方法
JP7124819B2 (ja) 封止用フィルム、封止構造体及び封止構造体の製造方法
KR102441766B1 (ko) 봉지용 필름 및 봉지 구조체, 및 이들의 제조 방법
JPWO2018181761A1 (ja) 封止フィルム、電子部品装置の製造方法及び電子部品装置
JP7354666B2 (ja) 封止用フィルム、封止構造体、及び封止構造体の製造方法
JP6544427B2 (ja) 熱硬化性樹脂組成物、硬化物、樹脂シート、封止構造体及びその製造方法、並びに、電子部品装置及びその製造方法
JP6834265B2 (ja) 封止構造体の製造方法、封止材及び硬化物
JP2018064054A (ja) 封止材、及び、封止構造体の製造方法

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant