KR102476432B1 - 접속체의 제조 방법, 전자 부품의 접속 방법, 접속체 - Google Patents

접속체의 제조 방법, 전자 부품의 접속 방법, 접속체 Download PDF

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Publication number
KR102476432B1
KR102476432B1 KR1020167036449A KR20167036449A KR102476432B1 KR 102476432 B1 KR102476432 B1 KR 102476432B1 KR 1020167036449 A KR1020167036449 A KR 1020167036449A KR 20167036449 A KR20167036449 A KR 20167036449A KR 102476432 B1 KR102476432 B1 KR 102476432B1
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KR
South Korea
Prior art keywords
adhesive
circuit board
electronic component
connection
circuit connection
Prior art date
Application number
KR1020167036449A
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English (en)
Korean (ko)
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KR20170069962A (ko
Inventor
고스케 아사바
신이치 하야시
유스케 다나카
Original Assignee
데쿠세리아루즈 가부시키가이샤
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Publication of KR20170069962A publication Critical patent/KR20170069962A/ko
Application granted granted Critical
Publication of KR102476432B1 publication Critical patent/KR102476432B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
KR1020167036449A 2014-10-16 2015-10-13 접속체의 제조 방법, 전자 부품의 접속 방법, 접속체 KR102476432B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-212108 2014-10-16
JP2014212108A JP6609406B2 (ja) 2014-10-16 2014-10-16 接続体の製造方法、電子部品の接続方法、接続体
PCT/JP2015/078867 WO2016060098A1 (ja) 2014-10-16 2015-10-13 接続体の製造方法、電子部品の接続方法、接続体

Publications (2)

Publication Number Publication Date
KR20170069962A KR20170069962A (ko) 2017-06-21
KR102476432B1 true KR102476432B1 (ko) 2022-12-09

Family

ID=55746644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167036449A KR102476432B1 (ko) 2014-10-16 2015-10-13 접속체의 제조 방법, 전자 부품의 접속 방법, 접속체

Country Status (5)

Country Link
JP (1) JP6609406B2 (zh)
KR (1) KR102476432B1 (zh)
CN (1) CN107079589B (zh)
TW (1) TWI688176B (zh)
WO (1) WO2016060098A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018133331A (ja) * 2017-02-15 2018-08-23 デクセリアルズ株式会社 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト
CN109389903B (zh) * 2017-08-04 2021-01-29 京东方科技集团股份有限公司 柔性基板及其加工方法、加工系统
KR102631317B1 (ko) * 2017-09-11 2024-02-01 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
JP6619783B2 (ja) * 2017-09-21 2019-12-11 株式会社タムラ製作所 電極の接続方法および電子基板の製造方法
WO2019138855A1 (ja) 2018-01-15 2019-07-18 パイクリスタル株式会社 フレキシブル基板、電子デバイス、電子デバイスの製造方法
CN109739037B (zh) * 2018-11-23 2023-12-15 深圳市新盈恒科技有限公司 一种方便维修的液晶显示屏
US20220418058A1 (en) * 2020-02-10 2022-12-29 Pioneer Corporation Electronic device and method for manufacturing electronic device
CN111526669B (zh) * 2020-05-07 2021-07-23 深圳市晶泓科技有限公司 一种透明电路板及透明led显示屏的制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234017A (ja) * 1993-07-29 2003-08-22 Hitachi Chem Co Ltd 回路接続材料とその接続材料を用いた回路の接続方法
JP2012124504A (ja) * 2005-02-02 2012-06-28 Sony Chemical & Information Device Corp 電気部品の実装方法
WO2012169497A1 (ja) * 2011-06-06 2012-12-13 デクセリアルズ株式会社 接続方法、接続体の製造方法、接続体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005026577A (ja) 2003-07-04 2005-01-27 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP2012178441A (ja) * 2011-02-25 2012-09-13 Sekisui Chem Co Ltd 接続構造体の製造方法及び接続構造体
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
JP5721593B2 (ja) * 2011-09-12 2015-05-20 積水化学工業株式会社 接続構造体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234017A (ja) * 1993-07-29 2003-08-22 Hitachi Chem Co Ltd 回路接続材料とその接続材料を用いた回路の接続方法
JP2012124504A (ja) * 2005-02-02 2012-06-28 Sony Chemical & Information Device Corp 電気部品の実装方法
WO2012169497A1 (ja) * 2011-06-06 2012-12-13 デクセリアルズ株式会社 接続方法、接続体の製造方法、接続体

Also Published As

Publication number Publication date
CN107079589A (zh) 2017-08-18
KR20170069962A (ko) 2017-06-21
TWI688176B (zh) 2020-03-11
JP6609406B2 (ja) 2019-11-20
TW201633638A (zh) 2016-09-16
JP2016082070A (ja) 2016-05-16
WO2016060098A1 (ja) 2016-04-21
CN107079589B (zh) 2020-06-09

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