KR102457598B1 - 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 - Google Patents

경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 Download PDF

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Publication number
KR102457598B1
KR102457598B1 KR1020177000246A KR20177000246A KR102457598B1 KR 102457598 B1 KR102457598 B1 KR 102457598B1 KR 1020177000246 A KR1020177000246 A KR 1020177000246A KR 20177000246 A KR20177000246 A KR 20177000246A KR 102457598 B1 KR102457598 B1 KR 102457598B1
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South Korea
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resin
group
resin composition
component
curable resin
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KR1020177000246A
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English (en)
Korean (ko)
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KR20170017999A (ko
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요코 시바사키
마나부 아키야마
노부히토 이토
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다이요 잉키 세이조 가부시키가이샤
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Publication of KR20170017999A publication Critical patent/KR20170017999A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
KR1020177000246A 2014-06-12 2015-05-14 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 KR102457598B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014121312 2014-06-12
JPJP-P-2014-121312 2014-06-12
PCT/JP2015/063870 WO2015190210A1 (ja) 2014-06-12 2015-05-14 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Publications (2)

Publication Number Publication Date
KR20170017999A KR20170017999A (ko) 2017-02-15
KR102457598B1 true KR102457598B1 (ko) 2022-10-21

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KR1020177000246A KR102457598B1 (ko) 2014-06-12 2015-05-14 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6799462B2 (zh)
KR (1) KR102457598B1 (zh)
CN (1) CN106662813B (zh)
TW (1) TWI704169B (zh)
WO (1) WO2015190210A1 (zh)

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JP6645061B2 (ja) * 2015-07-27 2020-02-12 東レ株式会社 感光性樹脂組成物、感光性樹脂積層体、および感光性樹脂印刷版原版
JP6723788B2 (ja) * 2016-03-31 2020-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102369508B1 (ko) * 2016-03-31 2022-03-04 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP6822987B2 (ja) * 2018-01-31 2021-01-27 株式会社タムラ製作所 感光性樹脂組成物
JP7147197B2 (ja) * 2018-03-16 2022-10-05 大日本印刷株式会社 配線基板および配線基板の製造方法
JP7101513B2 (ja) * 2018-03-28 2022-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2019178304A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7196587B2 (ja) * 2018-12-19 2022-12-27 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
US20210109443A1 (en) * 2019-01-23 2021-04-15 Microcosm Technology Co., Ltd. Photosensitive polyimide resin composition and polyimide film thereof
WO2020150913A1 (zh) * 2019-01-23 2020-07-30 律胜科技股份有限公司 感光性聚酰亚胺树脂组合物及其聚酰亚胺膜
KR20220061086A (ko) * 2019-09-06 2022-05-12 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 그리고 그 경화물을 포함하는 전자 부품
JP7298468B2 (ja) * 2019-12-18 2023-06-27 信越化学工業株式会社 熱硬化性樹脂組成物及びその使用
JP7306343B2 (ja) * 2020-07-17 2023-07-11 味の素株式会社 感光性樹脂組成物
WO2022211120A1 (ja) * 2021-03-31 2022-10-06 太陽インキ製造株式会社 積層硬化性樹脂構造体、ドライフィルム、硬化物および電子部品
TWI780783B (zh) * 2021-06-18 2022-10-11 大陸商律勝科技（蘇州）有限公司 印刷電路板之製造方法及具保護層之印刷電路板

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WO2010074197A1 (ja) * 2008-12-25 2010-07-01 味の素株式会社 感光性樹脂組成物
JP2010270293A (ja) * 2009-04-23 2010-12-02 Hitachi Chem Co Ltd 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置。
JP2013053075A (ja) * 2011-09-01 2013-03-21 Gc Corp 歯科用セメント組成物

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Publication number Publication date
JP6799462B2 (ja) 2020-12-16
CN106662813B (zh) 2021-02-26
CN106662813A (zh) 2017-05-10
TWI704169B (zh) 2020-09-11
JPWO2015190210A1 (ja) 2017-04-20
TW201609869A (zh) 2016-03-16
KR20170017999A (ko) 2017-02-15
WO2015190210A1 (ja) 2015-12-17

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