JP6799462B2 - 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 - Google Patents

硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Download PDF

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Publication number
JP6799462B2
JP6799462B2 JP2016527701A JP2016527701A JP6799462B2 JP 6799462 B2 JP6799462 B2 JP 6799462B2 JP 2016527701 A JP2016527701 A JP 2016527701A JP 2016527701 A JP2016527701 A JP 2016527701A JP 6799462 B2 JP6799462 B2 JP 6799462B2
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Prior art keywords
resin
resin composition
group
component
curable resin
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JPWO2015190210A1 (ja
Inventor
陽子 柴▲崎▼
陽子 柴▲崎▼
秋山　学
学 秋山
信人 伊藤
信人 伊藤
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Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
JP2016527701A 2014-06-12 2015-05-14 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Active JP6799462B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014121312 2014-06-12
JP2014121312 2014-06-12
PCT/JP2015/063870 WO2015190210A1 (ja) 2014-06-12 2015-05-14 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2015190210A1 JPWO2015190210A1 (ja) 2017-04-20
JP6799462B2 true JP6799462B2 (ja) 2020-12-16

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JP2016527701A Active JP6799462B2 (ja) 2014-06-12 2015-05-14 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Country Status (5)

Country Link
JP (1) JP6799462B2 (zh)
KR (1) KR102457598B1 (zh)
CN (1) CN106662813B (zh)
TW (1) TWI704169B (zh)
WO (1) WO2015190210A1 (zh)

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Publication number Priority date Publication date Assignee Title
JP6645061B2 (ja) * 2015-07-27 2020-02-12 東レ株式会社 感光性樹脂組成物、感光性樹脂積層体、および感光性樹脂印刷版原版
JP6723788B2 (ja) * 2016-03-31 2020-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102369508B1 (ko) * 2016-03-31 2022-03-04 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP6822987B2 (ja) * 2018-01-31 2021-01-27 株式会社タムラ製作所 感光性樹脂組成物
JP7147197B2 (ja) * 2018-03-16 2022-10-05 大日本印刷株式会社 配線基板および配線基板の製造方法
JP7101513B2 (ja) * 2018-03-28 2022-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2019178304A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7196587B2 (ja) * 2018-12-19 2022-12-27 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
US20210109443A1 (en) * 2019-01-23 2021-04-15 Microcosm Technology Co., Ltd. Photosensitive polyimide resin composition and polyimide film thereof
WO2020150913A1 (zh) * 2019-01-23 2020-07-30 律胜科技股份有限公司 感光性聚酰亚胺树脂组合物及其聚酰亚胺膜
KR20220061086A (ko) * 2019-09-06 2022-05-12 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 그리고 그 경화물을 포함하는 전자 부품
JP7298468B2 (ja) * 2019-12-18 2023-06-27 信越化学工業株式会社 熱硬化性樹脂組成物及びその使用
JP7306343B2 (ja) * 2020-07-17 2023-07-11 味の素株式会社 感光性樹脂組成物
WO2022211120A1 (ja) * 2021-03-31 2022-10-06 太陽インキ製造株式会社 積層硬化性樹脂構造体、ドライフィルム、硬化物および電子部品
TWI780783B (zh) * 2021-06-18 2022-10-11 大陸商律勝科技（蘇州）有限公司 印刷電路板之製造方法及具保護層之印刷電路板

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JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JP4316227B2 (ja) * 2002-12-05 2009-08-19 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその用途
JP2008297231A (ja) * 2007-05-30 2008-12-11 Nippon Kayaku Co Ltd ヒドロキシアミド基含有脂環式ポリイミド及びその前駆体、並びにそれらを用いたポジ型感光性樹脂組成物、並びにそれらの硬化物
JP2010032743A (ja) * 2008-07-29 2010-02-12 Kyocera Chemical Corp アルカリ現像型の感光性熱硬化型樹脂組成物及びフレキシブルプリント配線板
JP5830830B2 (ja) * 2009-03-19 2015-12-09 日立化成株式会社 感光性接着剤組成物、それを用いたフィルム状接着剤、接着シート、接着剤層付半導体ウェハ、半導体装置、感光性接着剤組成物及びフィルム状接着剤の製造方法、並びに接着剤パターンの形成方法
CN102160163A (zh) * 2008-09-22 2011-08-17 日立化成工业株式会社 半导体装置及其制造方法
WO2010074197A1 (ja) * 2008-12-25 2010-07-01 味の素株式会社 感光性樹脂組成物
JP2010224319A (ja) * 2009-03-24 2010-10-07 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP5712475B2 (ja) * 2009-04-23 2015-05-07 日立化成株式会社 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置。
JP5661293B2 (ja) * 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
US20130108963A1 (en) * 2010-06-03 2013-05-02 Sumitomo Bakelite Co., Ltd. Photosensitive resin composition and method for preparing photosensitive composition
TWI507479B (zh) * 2010-12-14 2015-11-11 Kaneka Corp 新穎感光性樹脂組合物及其利用
JP5847814B2 (ja) * 2011-06-17 2016-01-27 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物
JP2013053075A (ja) * 2011-09-01 2013-03-21 Gc Corp 歯科用セメント組成物

Also Published As

Publication number Publication date
KR102457598B1 (ko) 2022-10-21
CN106662813B (zh) 2021-02-26
CN106662813A (zh) 2017-05-10
TWI704169B (zh) 2020-09-11
JPWO2015190210A1 (ja) 2017-04-20
TW201609869A (zh) 2016-03-16
KR20170017999A (ko) 2017-02-15
WO2015190210A1 (ja) 2015-12-17

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