KR102450786B1 - 적층체 및 그 제조 방법 - Google Patents
적층체 및 그 제조 방법 Download PDFInfo
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- KR102450786B1 KR102450786B1 KR1020177032885A KR20177032885A KR102450786B1 KR 102450786 B1 KR102450786 B1 KR 102450786B1 KR 1020177032885 A KR1020177032885 A KR 1020177032885A KR 20177032885 A KR20177032885 A KR 20177032885A KR 102450786 B1 KR102450786 B1 KR 102450786B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- B32B27/00—Layered products comprising a layer of synthetic resin
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- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- C—CHEMISTRY; METALLURGY
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
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| PCT/JP2016/002037 WO2016166986A1 (ja) | 2015-04-17 | 2016-04-15 | 積層体及びその製造方法 |
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| KR20170137855A KR20170137855A (ko) | 2017-12-13 |
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| JP2019010731A (ja) * | 2015-11-24 | 2019-01-24 | コニカミノルタ株式会社 | ガスバリアー性フィルム及び電子デバイス |
| JP7235466B2 (ja) * | 2018-01-26 | 2023-03-08 | レール・リキード-ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | ランタノイド化合物、ランタノイド含有薄膜、および該ランタノイド化合物を用いたランタノイド含有薄膜の成膜方法 |
| CN112175220B (zh) * | 2020-09-03 | 2023-01-03 | 广东以色列理工学院 | 耐高温的改性聚丙烯薄膜及其制备方法和应用 |
| CN119685802B (zh) * | 2025-02-24 | 2025-05-30 | 浙江大学 | 一种引发式分子层沉积方法及区域选择性沉积调控方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013015417A1 (ja) | 2011-07-28 | 2013-01-31 | 凸版印刷株式会社 | 積層体、ガスバリアフィルム、積層体の製造方法、及び積層体製造装置 |
| WO2013035689A1 (ja) | 2011-09-07 | 2013-03-14 | 東レ株式会社 | ガスバリア性フィルム |
| WO2014156932A1 (ja) | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | 積層体、バリアフィルム、及びこれらの製造方法 |
| WO2014156888A1 (ja) * | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | 積層体及びガスバリアフィルム |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7476420B2 (en) * | 2000-10-23 | 2009-01-13 | Asm International N.V. | Process for producing metal oxide films at low temperatures |
| JP2003327718A (ja) | 2002-03-08 | 2003-11-19 | Dainippon Printing Co Ltd | 基材フィルム、並びにガスバリア性フィルムおよびこれを用いたディスプレイ |
| US20030203210A1 (en) * | 2002-04-30 | 2003-10-30 | Vitex Systems, Inc. | Barrier coatings and methods of making same |
| KR100496265B1 (ko) * | 2002-11-29 | 2005-06-17 | 한국전자통신연구원 | 반도체 소자의 박막 형성방법 |
| US6888172B2 (en) * | 2003-04-11 | 2005-05-03 | Eastman Kodak Company | Apparatus and method for encapsulating an OLED formed on a flexible substrate |
| EP1629543B1 (en) | 2003-05-16 | 2013-08-07 | E.I. Du Pont De Nemours And Company | Barrier films for flexible polymer substrates fabricated by atomic layer deposition |
| JP2005104026A (ja) | 2003-09-30 | 2005-04-21 | Fuji Photo Film Co Ltd | ガスバリア性積層フィルム及び該積層フィルムを用いた画像表示素子 |
| NO20045674D0 (no) * | 2004-12-28 | 2004-12-28 | Uni I Oslo | Thin films prepared with gas phase deposition technique |
| EP2011898B1 (en) * | 2007-07-03 | 2021-04-07 | Beneq Oy | Method in depositing metal oxide materials |
| JP5912228B2 (ja) * | 2010-05-17 | 2016-04-27 | 凸版印刷株式会社 | ガスバリア性積層体の製造方法 |
| JP5304733B2 (ja) * | 2010-06-10 | 2013-10-02 | 住友金属鉱山株式会社 | 誘電体膜を有する金属ベース層付耐熱性樹脂フィルムと金属膜付耐熱性樹脂フィルムの各製造方法および誘電体膜を有する金属ベース層付耐熱性樹脂フィルムの製造装置 |
| JPWO2012020771A1 (ja) * | 2010-08-13 | 2013-10-28 | 旭硝子株式会社 | 積層体および積層体の製造方法 |
| JP2012116151A (ja) | 2010-12-03 | 2012-06-21 | Sony Corp | バリアフィルム及びその製造方法 |
| TWI429526B (zh) * | 2011-12-15 | 2014-03-11 | Ind Tech Res Inst | 水氣阻障複合膜及封裝結構 |
| US20130337259A1 (en) * | 2012-06-14 | 2013-12-19 | E I Du Pont De Nemours And Company | Gas permeation barrier material |
| TWI592310B (zh) * | 2012-10-18 | 2017-07-21 | 凸版印刷股份有限公司 | 積層體、阻氣薄膜及其製造方法 |
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2015
- 2015-04-17 JP JP2015085116A patent/JP6657588B2/ja active Active
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2016
- 2016-04-15 CN CN202111158968.3A patent/CN113897594A/zh active Pending
- 2016-04-15 WO PCT/JP2016/002037 patent/WO2016166986A1/ja not_active Ceased
- 2016-04-15 KR KR1020177032885A patent/KR102450786B1/ko active Active
- 2016-04-15 EP EP16779780.2A patent/EP3284591B1/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013015417A1 (ja) | 2011-07-28 | 2013-01-31 | 凸版印刷株式会社 | 積層体、ガスバリアフィルム、積層体の製造方法、及び積層体製造装置 |
| WO2013035689A1 (ja) | 2011-09-07 | 2013-03-14 | 東レ株式会社 | ガスバリア性フィルム |
| WO2014156932A1 (ja) | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | 積層体、バリアフィルム、及びこれらの製造方法 |
| WO2014156888A1 (ja) * | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | 積層体及びガスバリアフィルム |
Also Published As
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| JP2016203431A (ja) | 2016-12-08 |
| KR20170137855A (ko) | 2017-12-13 |
| US11090917B2 (en) | 2021-08-17 |
| CN107428125A (zh) | 2017-12-01 |
| EP3284591A1 (en) | 2018-02-21 |
| US20180037017A1 (en) | 2018-02-08 |
| WO2016166986A1 (ja) | 2016-10-20 |
| EP3284591A4 (en) | 2019-04-24 |
| CN113897594A (zh) | 2022-01-07 |
| JP6657588B2 (ja) | 2020-03-04 |
| EP3284591B1 (en) | 2025-04-30 |
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