KR102445265B1 - 기판 핸들링 및 가열 시스템 - Google Patents

기판 핸들링 및 가열 시스템 Download PDF

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Publication number
KR102445265B1
KR102445265B1 KR1020177035175A KR20177035175A KR102445265B1 KR 102445265 B1 KR102445265 B1 KR 102445265B1 KR 1020177035175 A KR1020177035175 A KR 1020177035175A KR 20177035175 A KR20177035175 A KR 20177035175A KR 102445265 B1 KR102445265 B1 KR 102445265B1
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South Korea
Prior art keywords
substrate
led array
leds
disposed
alignment station
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Korean (ko)
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KR20180005204A (ko
Inventor
모건 디. 에반스
제이슨 엠. 샬러
디. 제프리 리셔
알라 모라디안
윌리엄 티. 위버
로버트 브렌트 보파트
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베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
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    • H01L21/67115—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • F26B3/30—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
    • H01L21/68—
    • H01L27/15—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing & Machinery (AREA)
  • Drying Of Semiconductors (AREA)
KR1020177035175A 2015-05-08 2016-04-26 기판 핸들링 및 가열 시스템 Active KR102445265B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/707,027 US10443934B2 (en) 2015-05-08 2015-05-08 Substrate handling and heating system
US14/707,027 2015-05-08
PCT/US2016/029326 WO2016182726A1 (en) 2015-05-08 2016-04-26 Substrate handling and heating system

Publications (2)

Publication Number Publication Date
KR20180005204A KR20180005204A (ko) 2018-01-15
KR102445265B1 true KR102445265B1 (ko) 2022-09-20

Family

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Family Applications (1)

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KR1020177035175A Active KR102445265B1 (ko) 2015-05-08 2016-04-26 기판 핸들링 및 가열 시스템

Country Status (6)

Country Link
US (1) US10443934B2 (https=)
JP (1) JP6783248B2 (https=)
KR (1) KR102445265B1 (https=)
CN (1) CN107636818B (https=)
TW (1) TWI705517B (https=)
WO (1) WO2016182726A1 (https=)

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US9899242B2 (en) * 2015-04-06 2018-02-20 Varian Semiconductor Equipment Associates, Inc. Device and method for substrate heating during transport
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧高温下のアニールチャンバ
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
SG11202001450UA (en) 2017-09-12 2020-03-30 Applied Materials Inc Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
EP4321649B1 (en) 2017-11-11 2025-08-20 Micromaterials LLC Gas delivery system for high pressure processing chamber
JP7330181B2 (ja) 2017-11-16 2023-08-21 アプライド マテリアルズ インコーポレイテッド 高圧蒸気アニール処理装置
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
WO2019147405A1 (en) * 2018-01-23 2019-08-01 Applied Materials, Inc. Methods and apparatus for wafer temperature measurement
SG11202008256WA (en) 2018-03-09 2020-09-29 Applied Materials Inc High pressure annealing process for metal containing materials
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10600662B2 (en) * 2018-07-20 2020-03-24 Varian Semiconductor Equipment Associates, Inc. Silicon carbide substrate heating
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US11109452B2 (en) 2019-11-14 2021-08-31 Applied Materials, Inc. Modular LED heater
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
CN114719750A (zh) * 2022-03-30 2022-07-08 北京烁科精微电子装备有限公司 一种晶圆切边位置检测装置

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JP2012195347A (ja) * 2011-03-15 2012-10-11 Tokyo Electron Ltd 熱処理装置

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JP2005032906A (ja) * 2003-07-10 2005-02-03 Nikon Corp ウェハローダ及び露光装置
JP2009076705A (ja) * 2007-09-21 2009-04-09 Tokyo Electron Ltd ロードロック装置および真空処理システム
JP2012195347A (ja) * 2011-03-15 2012-10-11 Tokyo Electron Ltd 熱処理装置

Also Published As

Publication number Publication date
TWI705517B (zh) 2020-09-21
CN107636818A (zh) 2018-01-26
JP6783248B2 (ja) 2020-11-11
CN107636818B (zh) 2021-09-07
KR20180005204A (ko) 2018-01-15
US20160329458A1 (en) 2016-11-10
JP2018522396A (ja) 2018-08-09
TW201642381A (zh) 2016-12-01
WO2016182726A1 (en) 2016-11-17
US10443934B2 (en) 2019-10-15

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