KR102420833B1 - 비구면 초점 수단 및 빔 확장기로 취성 재료를 절단하는 레이저 장치 - Google Patents
비구면 초점 수단 및 빔 확장기로 취성 재료를 절단하는 레이저 장치 Download PDFInfo
- Publication number
- KR102420833B1 KR102420833B1 KR1020197016889A KR20197016889A KR102420833B1 KR 102420833 B1 KR102420833 B1 KR 102420833B1 KR 1020197016889 A KR1020197016889 A KR 1020197016889A KR 20197016889 A KR20197016889 A KR 20197016889A KR 102420833 B1 KR102420833 B1 KR 102420833B1
- Authority
- KR
- South Korea
- Prior art keywords
- aspherical
- laser radiation
- laser
- clear aperture
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/30—Collimators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/352,385 | 2016-11-15 | ||
| US15/352,385 US10668561B2 (en) | 2016-11-15 | 2016-11-15 | Laser apparatus for cutting brittle material |
| PCT/US2017/061386 WO2018093732A1 (en) | 2016-11-15 | 2017-11-13 | Laser apparatus for cutting brittle material with aspheric focusing means and a beam expander |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190086703A KR20190086703A (ko) | 2019-07-23 |
| KR102420833B1 true KR102420833B1 (ko) | 2022-07-15 |
Family
ID=60473679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197016889A Active KR102420833B1 (ko) | 2016-11-15 | 2017-11-13 | 비구면 초점 수단 및 빔 확장기로 취성 재료를 절단하는 레이저 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10668561B2 (enExample) |
| EP (1) | EP3541565B1 (enExample) |
| JP (1) | JP7045372B2 (enExample) |
| KR (1) | KR102420833B1 (enExample) |
| CN (2) | CN114535782B (enExample) |
| WO (1) | WO2018093732A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| EP3169477B1 (en) | 2014-07-14 | 2020-01-29 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
| HUE055461T2 (hu) | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
| JP6654813B2 (ja) * | 2015-06-02 | 2020-02-26 | 川崎重工業株式会社 | 面取り加工装置および面取り加工方法 |
| EP3507057A1 (en) * | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
| CN113399816B (zh) | 2016-09-30 | 2023-05-16 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| CN110167891A (zh) | 2016-10-24 | 2019-08-23 | 康宁股份有限公司 | 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位 |
| EP3589084A1 (en) * | 2018-06-26 | 2020-01-01 | Ecole Polytechnique | Reflective optical system |
| JP7043999B2 (ja) * | 2018-07-11 | 2022-03-30 | 日本電信電話株式会社 | ハイブリッド光デバイスの溝作製方法およびハイブリッド光デバイス |
| US20200061750A1 (en) | 2018-08-22 | 2020-02-27 | Coherent Munich GmbH & Co. KG | Mitigating low surface quality |
| US10814433B2 (en) * | 2018-11-13 | 2020-10-27 | Vertiled Co. Limited | Laser based system for cutting transparent and semi-transparent substrates |
| DE102019219462A1 (de) * | 2019-12-12 | 2021-06-17 | Flabeg Deutschland Gmbh | Verfahren zum Schneiden eines Glaselements und Schneidsystem |
| US12158425B2 (en) * | 2019-12-19 | 2024-12-03 | Thermo Scientific Portable Analytical Instruments Inc. | Adjustable extended focus raman system |
| CN116457136B (zh) * | 2020-09-09 | 2025-09-16 | 康宁股份有限公司 | 用于透明工件的高角度激光加工的方法和光学组件 |
| JP2022098586A (ja) * | 2020-12-22 | 2022-07-04 | 大船企業日本株式会社 | プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法と、該プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法を実施してなるプリント基板レーザ加工装置 |
| TWI890886B (zh) * | 2021-11-04 | 2025-07-21 | 邱俊榮 | 使用空間光調製器的雷射切割方法與雷射切割裝置 |
| US11632179B1 (en) * | 2022-03-15 | 2023-04-18 | United States Of America As Represented By The Secretary Of The Navy | Remotely emitting confined electromagnetic radiation from laser-induced plasma filaments |
| KR102536286B1 (ko) * | 2022-12-20 | 2023-05-26 | ㈜ 엘에이티 | 레이저를 이용한 코팅층 제거방법 |
| WO2024197214A1 (en) | 2023-03-22 | 2024-09-26 | Carbon, Inc. | Combination additive and subtractive manufacturing methods and apparatus for light polymerizable resins |
| CN119634994B (zh) * | 2025-01-13 | 2025-11-04 | 北京理工大学 | 一种局部极化增强的非线性电离纳米刻写系统及方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015119076A (ja) * | 2013-12-19 | 2015-06-25 | 信越ポリマー株式会社 | 内部加工層形成単結晶部材およびその製造方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002113711A (ja) * | 2000-10-11 | 2002-04-16 | Murata Mfg Co Ltd | セラミックグリーンシートの加工方法及びそれに用いるレーザ加工装置 |
| US7994450B2 (en) * | 2002-01-07 | 2011-08-09 | International Business Machines Corporation | Debris minimization and improved spatial resolution in pulsed laser ablation of materials |
| WO2004083133A2 (en) * | 2003-03-21 | 2004-09-30 | Rorze Systems Corporation | Apparatus for cutting glass plate |
| EP2269765B1 (en) | 2003-07-18 | 2014-10-15 | Hamamatsu Photonics K.K. | Cut semiconductor chip |
| JP4698200B2 (ja) * | 2004-10-27 | 2011-06-08 | 日立造船株式会社 | レーザ加工方法およびレーザ加工装置 |
| JP2006216820A (ja) * | 2005-02-04 | 2006-08-17 | Advanced Lcd Technologies Development Center Co Ltd | レーザ加工方法、レーザ加工装置および結晶化装置 |
| JP5241525B2 (ja) * | 2009-01-09 | 2013-07-17 | 浜松ホトニクス株式会社 | レーザ加工装置 |
| CN102686354B (zh) * | 2009-03-20 | 2015-11-25 | 康宁股份有限公司 | 精密激光刻痕 |
| CN102639280A (zh) * | 2009-12-07 | 2012-08-15 | Jp赛席尔联合股份有限公司 | 激光加工及切割系统与方法 |
| US20120234807A1 (en) | 2009-12-07 | 2012-09-20 | J.P. Sercel Associates Inc. | Laser scribing with extended depth affectation into a workplace |
| US10191191B2 (en) * | 2014-04-16 | 2019-01-29 | Beam Engineering For Advanced Measurements Co. | Diffractive waveplate lenses and applications |
| US8836941B2 (en) * | 2010-02-10 | 2014-09-16 | Imra America, Inc. | Method and apparatus to prepare a substrate for molecular detection |
| DE102010020183B4 (de) * | 2010-05-11 | 2013-07-11 | Precitec Kg | Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes |
| WO2012052985A1 (en) * | 2010-10-22 | 2012-04-26 | Highcon Ltd | Method and apparatus for laser cutting |
| TW201417928A (zh) | 2012-07-30 | 2014-05-16 | Raydiance Inc | 具訂製邊形及粗糙度之脆性材料切割 |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| CN103111755A (zh) * | 2013-02-01 | 2013-05-22 | 武汉帝尔激光科技有限公司 | 一种双焦点激光加工系统 |
| EP2969375B1 (en) * | 2013-03-15 | 2018-09-12 | Kinestral Technologies, Inc. | Laser cutting strengthened glass |
| US9102007B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| US11053156B2 (en) * | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| US20150165563A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers |
| US9676167B2 (en) * | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| EP3205379A4 (en) * | 2014-10-10 | 2018-01-24 | Fujitsu Limited | Skill determination program, skill determination method, skill determination device, and server |
| JP6499300B2 (ja) | 2014-10-13 | 2019-04-10 | エバナ テクノロジーズ ユーエービー | スパイク状の損傷構造を形成して基板を劈開または切断するレーザー加工方法 |
| JP6104354B2 (ja) | 2014-12-16 | 2017-03-29 | 旭硝子株式会社 | 貫通孔形成方法、貫通孔形成装置、および貫通孔を有するガラス基板の製造方法 |
| US20170313617A1 (en) * | 2016-04-27 | 2017-11-02 | Coherent, Inc. | Method and apparatus for laser-cutting of transparent materials |
-
2016
- 2016-11-15 US US15/352,385 patent/US10668561B2/en active Active
-
2017
- 2017-11-13 WO PCT/US2017/061386 patent/WO2018093732A1/en not_active Ceased
- 2017-11-13 EP EP17804775.9A patent/EP3541565B1/en active Active
- 2017-11-13 KR KR1020197016889A patent/KR102420833B1/ko active Active
- 2017-11-13 CN CN202210239106.1A patent/CN114535782B/zh active Active
- 2017-11-13 JP JP2019524886A patent/JP7045372B2/ja active Active
- 2017-11-13 CN CN201780069421.1A patent/CN109963683B/zh active Active
-
2020
- 2020-04-28 US US16/860,300 patent/US11548093B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015119076A (ja) * | 2013-12-19 | 2015-06-25 | 信越ポリマー株式会社 | 内部加工層形成単結晶部材およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018093732A8 (en) | 2019-05-23 |
| WO2018093732A1 (en) | 2018-05-24 |
| EP3541565A1 (en) | 2019-09-25 |
| CN109963683B (zh) | 2022-04-12 |
| US11548093B2 (en) | 2023-01-10 |
| EP3541565B1 (en) | 2021-09-15 |
| US20180133837A1 (en) | 2018-05-17 |
| US10668561B2 (en) | 2020-06-02 |
| JP7045372B2 (ja) | 2022-03-31 |
| CN114535782A (zh) | 2022-05-27 |
| KR20190086703A (ko) | 2019-07-23 |
| US20200254564A1 (en) | 2020-08-13 |
| CN114535782B (zh) | 2024-08-13 |
| CN109963683A (zh) | 2019-07-02 |
| JP2020500810A (ja) | 2020-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102420833B1 (ko) | 비구면 초점 수단 및 빔 확장기로 취성 재료를 절단하는 레이저 장치 | |
| KR102791929B1 (ko) | 투명한 워크피스의 고각 레이저 처리를 위한 위상-수정된 준-비-회절 레이저 빔 | |
| CN111065485B (zh) | 使用无焦光束调整组件激光加工透明工件的设备和方法 | |
| KR102705403B1 (ko) | 투명 작업편의 레이저 처리의 능동적 제어 | |
| CN111936434B (zh) | 透明工件堆叠体的选择性激光加工 | |
| RU2689018C2 (ru) | Устройство для проецирования маски пучком фемтосекундного и пикосекундного лазера, содержащее ограничитель, маску и системы линз | |
| EP2859984B1 (en) | A method of laser processing a transparent material | |
| KR102582719B1 (ko) | 투명 워크피스의 동시 다중 레이저 처리하기 위한 기기 및 방법 | |
| US9873628B1 (en) | Filamentary cutting of brittle materials using a picosecond pulsed laser | |
| JP2020507476A (ja) | 移相焦線を使用して透明な被加工物をレーザ加工する装置および方法 | |
| WO2023009331A1 (en) | Phase modified quasi-non-diffracting laser beams for simultaneous high angle laser processing of transparent workpieces | |
| US12290880B2 (en) | Curved quasi-non-diffracting laser beams for laser processing of transparent workpieces | |
| TWI834649B (zh) | 使用脈衝雷射光束焦線及流體膜來雷射處理粗糙透明加工件的方法 | |
| KR20210024008A (ko) | 하나 이상의 투명 워크피스 및 블랙 매트릭스 층을 가진 기판 스택을 레이저 가공하는 방법 | |
| CN116457136B (zh) | 用于透明工件的高角度激光加工的方法和光学组件 | |
| KR20230175254A (ko) | 레이저 빔의 라인 초점에 의해 기판에 도입되는 에너지의 분포를 제어하기 위한 방법, 및 기판 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20190612 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20201106 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20211019 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20220622 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20220711 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20220712 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20250616 Start annual number: 4 End annual number: 4 |