JP7045372B2 - 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置 - Google Patents

非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置 Download PDF

Info

Publication number
JP7045372B2
JP7045372B2 JP2019524886A JP2019524886A JP7045372B2 JP 7045372 B2 JP7045372 B2 JP 7045372B2 JP 2019524886 A JP2019524886 A JP 2019524886A JP 2019524886 A JP2019524886 A JP 2019524886A JP 7045372 B2 JP7045372 B2 JP 7045372B2
Authority
JP
Japan
Prior art keywords
aspherical
laser
lens
laser radiation
effective aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019524886A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020500810A5 (enExample
JP2020500810A (ja
Inventor
マイケル アール． グリーンバーグ，
デイビッド エム． ガウディオシ，
ジョヘン ディール，
Original Assignee
コヒレント， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コヒレント， インコーポレイテッド filed Critical コヒレント， インコーポレイテッド
Publication of JP2020500810A publication Critical patent/JP2020500810A/ja
Publication of JP2020500810A5 publication Critical patent/JP2020500810A5/ja
Application granted granted Critical
Publication of JP7045372B2 publication Critical patent/JP7045372B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30—Collimators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2019524886A 2016-11-15 2017-11-13 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置 Active JP7045372B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/352,385 2016-11-15
US15/352,385 US10668561B2 (en) 2016-11-15 2016-11-15 Laser apparatus for cutting brittle material
PCT/US2017/061386 WO2018093732A1 (en) 2016-11-15 2017-11-13 Laser apparatus for cutting brittle material with aspheric focusing means and a beam expander

Publications (3)

Publication Number Publication Date
JP2020500810A JP2020500810A (ja) 2020-01-16
JP2020500810A5 JP2020500810A5 (enExample) 2020-10-15
JP7045372B2 true JP7045372B2 (ja) 2022-03-31

Family

ID=60473679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019524886A Active JP7045372B2 (ja) 2016-11-15 2017-11-13 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置

Country Status (6)

Country Link
US (2) US10668561B2 (enExample)
EP (1) EP3541565B1 (enExample)
JP (1) JP7045372B2 (enExample)
KR (1) KR102420833B1 (enExample)
CN (2) CN114535782B (enExample)
WO (1) WO2018093732A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
EP3169477B1 (en) 2014-07-14 2020-01-29 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
JP6654813B2 (ja) * 2015-06-02 2020-02-26 川崎重工業株式会社 面取り加工装置および面取り加工方法
EP3507057A1 (en) * 2016-08-30 2019-07-10 Corning Incorporated Laser processing of transparent materials
CN113399816B (zh) 2016-09-30 2023-05-16 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
CN110167891A (zh) 2016-10-24 2019-08-23 康宁股份有限公司 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位
EP3589084A1 (en) * 2018-06-26 2020-01-01 Ecole Polytechnique Reflective optical system
JP7043999B2 (ja) * 2018-07-11 2022-03-30 日本電信電話株式会社 ハイブリッド光デバイスの溝作製方法およびハイブリッド光デバイス
US20200061750A1 (en) 2018-08-22 2020-02-27 Coherent Munich GmbH & Co. KG Mitigating low surface quality
US10814433B2 (en) * 2018-11-13 2020-10-27 Vertiled Co. Limited Laser based system for cutting transparent and semi-transparent substrates
DE102019219462A1 (de) * 2019-12-12 2021-06-17 Flabeg Deutschland Gmbh Verfahren zum Schneiden eines Glaselements und Schneidsystem
US12158425B2 (en) * 2019-12-19 2024-12-03 Thermo Scientific Portable Analytical Instruments Inc. Adjustable extended focus raman system
CN116457136B (zh) * 2020-09-09 2025-09-16 康宁股份有限公司 用于透明工件的高角度激光加工的方法和光学组件
JP2022098586A (ja) * 2020-12-22 2022-07-04 大船企業日本株式会社 プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法と、該プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法を実施してなるプリント基板レーザ加工装置
TWI890886B (zh) * 2021-11-04 2025-07-21 邱俊榮 使用空間光調製器的雷射切割方法與雷射切割裝置
US11632179B1 (en) * 2022-03-15 2023-04-18 United States Of America As Represented By The Secretary Of The Navy Remotely emitting confined electromagnetic radiation from laser-induced plasma filaments
KR102536286B1 (ko) * 2022-12-20 2023-05-26 ㈜ 엘에이티 레이저를 이용한 코팅층 제거방법
WO2024197214A1 (en) 2023-03-22 2024-09-26 Carbon, Inc. Combination additive and subtractive manufacturing methods and apparatus for light polymerizable resins
CN119634994B (zh) * 2025-01-13 2025-11-04 北京理工大学 一种局部极化增强的非线性电离纳米刻写系统及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119076A (ja) 2013-12-19 2015-06-25 信越ポリマー株式会社 内部加工層形成単結晶部材およびその製造方法
JP2016509540A (ja) 2013-01-15 2016-03-31 コーニング レーザー テクノロジーズ ゲーエムベーハーＣＯＲＮＩＮＧ ＬＡＳＥＲ ＴＥＣＨＮＯＬＯＧＩＥＳ ＧｍｂＨ レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置
JP2016113358A (ja) 2014-12-16 2016-06-23 旭硝子株式会社 貫通孔形成方法、貫通孔形成装置、および貫通孔を有するガラス基板の製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002113711A (ja) * 2000-10-11 2002-04-16 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びそれに用いるレーザ加工装置
US7994450B2 (en) * 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
WO2004083133A2 (en) * 2003-03-21 2004-09-30 Rorze Systems Corporation Apparatus for cutting glass plate
EP2269765B1 (en) 2003-07-18 2014-10-15 Hamamatsu Photonics K.K. Cut semiconductor chip
JP4698200B2 (ja) * 2004-10-27 2011-06-08 日立造船株式会社 レーザ加工方法およびレーザ加工装置
JP2006216820A (ja) * 2005-02-04 2006-08-17 Advanced Lcd Technologies Development Center Co Ltd レーザ加工方法、レーザ加工装置および結晶化装置
JP5241525B2 (ja) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
CN102686354B (zh) * 2009-03-20 2015-11-25 康宁股份有限公司 精密激光刻痕
CN102639280A (zh) * 2009-12-07 2012-08-15 Jp赛席尔联合股份有限公司 激光加工及切割系统与方法
US20120234807A1 (en) 2009-12-07 2012-09-20 J.P. Sercel Associates Inc. Laser scribing with extended depth affectation into a workplace
US10191191B2 (en) * 2014-04-16 2019-01-29 Beam Engineering For Advanced Measurements Co. Diffractive waveplate lenses and applications
US8836941B2 (en) * 2010-02-10 2014-09-16 Imra America, Inc. Method and apparatus to prepare a substrate for molecular detection
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
WO2012052985A1 (en) * 2010-10-22 2012-04-26 Highcon Ltd Method and apparatus for laser cutting
TW201417928A (zh) 2012-07-30 2014-05-16 Raydiance Inc 具訂製邊形及粗糙度之脆性材料切割
CN103111755A (zh) * 2013-02-01 2013-05-22 武汉帝尔激光科技有限公司 一种双焦点激光加工系统
EP2969375B1 (en) * 2013-03-15 2018-09-12 Kinestral Technologies, Inc. Laser cutting strengthened glass
US9102007B2 (en) * 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
US11053156B2 (en) * 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US20150165563A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US9676167B2 (en) * 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
EP3205379A4 (en) * 2014-10-10 2018-01-24 Fujitsu Limited Skill determination program, skill determination method, skill determination device, and server
JP6499300B2 (ja) 2014-10-13 2019-04-10 エバナ テクノロジーズ ユーエービー スパイク状の損傷構造を形成して基板を劈開または切断するレーザー加工方法
US20170313617A1 (en) * 2016-04-27 2017-11-02 Coherent, Inc. Method and apparatus for laser-cutting of transparent materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016509540A (ja) 2013-01-15 2016-03-31 コーニング レーザー テクノロジーズ ゲーエムベーハーＣＯＲＮＩＮＧ ＬＡＳＥＲ ＴＥＣＨＮＯＬＯＧＩＥＳ ＧｍｂＨ レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置
JP2015119076A (ja) 2013-12-19 2015-06-25 信越ポリマー株式会社 内部加工層形成単結晶部材およびその製造方法
JP2016113358A (ja) 2014-12-16 2016-06-23 旭硝子株式会社 貫通孔形成方法、貫通孔形成装置、および貫通孔を有するガラス基板の製造方法

Also Published As

Publication number Publication date
WO2018093732A8 (en) 2019-05-23
WO2018093732A1 (en) 2018-05-24
EP3541565A1 (en) 2019-09-25
CN109963683B (zh) 2022-04-12
US11548093B2 (en) 2023-01-10
EP3541565B1 (en) 2021-09-15
US20180133837A1 (en) 2018-05-17
US10668561B2 (en) 2020-06-02
CN114535782A (zh) 2022-05-27
KR20190086703A (ko) 2019-07-23
US20200254564A1 (en) 2020-08-13
CN114535782B (zh) 2024-08-13
CN109963683A (zh) 2019-07-02
KR102420833B1 (ko) 2022-07-15
JP2020500810A (ja) 2020-01-16

Similar Documents

Publication Publication Date Title
JP7045372B2 (ja) 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置
US11130701B2 (en) Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102791929B1 (ko) 투명한 워크피스의 고각 레이저 처리를 위한 위상-수정된 준-비-회절 레이저 빔
CN111936434B (zh) 透明工件堆叠体的选择性激光加工
RU2689018C2 (ru) Устройство для проецирования маски пучком фемтосекундного и пикосекундного лазера, содержащее ограничитель, маску и системы линз
CN105555463B (zh) 用具有波长和所选每脉冲能量的脉冲激光器对眼科镜片作标记的装置和方法
US20230036386A1 (en) Phase modified quasi-non-diffracting laser beams for simultaneous high angle laser processing of transparent workpieces
US20050226287A1 (en) Femtosecond laser processing system with process parameters, controls and feedback
JP2020507476A (ja) 移相焦線を使用して透明な被加工物をレーザ加工する装置および方法
CN113056345B (zh) 用于对透明基板改性的系统和方法
JP2021527616A (ja) 透明被加工物のアクティブ制御型レーザ加工
US12290880B2 (en) Curved quasi-non-diffracting laser beams for laser processing of transparent workpieces
TWI834649B (zh) 使用脈衝雷射光束焦線及流體膜來雷射處理粗糙透明加工件的方法
US20200039005A1 (en) Device and method for laser-based separation of a transparent, brittle workpiece
CN102837125A (zh) 激光加工装置
CN112334420A (zh) 激光加工具有一个或多个透明工件和黑色基质层的基材堆叠体的方法
CN116457136B (zh) 用于透明工件的高角度激光加工的方法和光学组件
CN120858001A (zh) 激光加工装置及使用该装置形成激光光束的方法
Hellstern et al. Optical tools for laser machining along six orders of magnitude
JP2023136442A (ja) 改質領域形成方法、貫通孔形成方法、集光レンズ装置及び改質領域を有する物品の製造方法
KR20250020673A (ko) 가공편을 가공하기 위한 방법 및 장치
CN117957086A (zh) 用于透明工件的同步大角度激光加工的相位修改准非衍射激光束

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200904

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200904

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210924

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20211210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220307

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220317

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220318

R150 Certificate of patent or registration of utility model

Ref document number: 7045372

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250