JP2020500810A5 - - Google Patents

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Publication number
JP2020500810A5
JP2020500810A5 JP2019524886A JP2019524886A JP2020500810A5 JP 2020500810 A5 JP2020500810 A5 JP 2020500810A5 JP 2019524886 A JP2019524886 A JP 2019524886A JP 2019524886 A JP2019524886 A JP 2019524886A JP 2020500810 A5 JP2020500810 A5 JP 2020500810A5
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JP
Japan
Prior art keywords
laser
aspherical
effective aperture
focusing lens
laser radiation
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JP2019524886A
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English (en)
Japanese (ja)
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JP2020500810A (ja
JP7045372B2 (ja
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Priority claimed from US15/352,385 external-priority patent/US10668561B2/en
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Publication of JP2020500810A publication Critical patent/JP2020500810A/ja
Publication of JP2020500810A5 publication Critical patent/JP2020500810A5/ja
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JP2019524886A 2016-11-15 2017-11-13 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置 Active JP7045372B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/352,385 US10668561B2 (en) 2016-11-15 2016-11-15 Laser apparatus for cutting brittle material
US15/352,385 2016-11-15
PCT/US2017/061386 WO2018093732A1 (en) 2016-11-15 2017-11-13 Laser apparatus for cutting brittle material with aspheric focusing means and a beam expander

Publications (3)

Publication Number Publication Date
JP2020500810A JP2020500810A (ja) 2020-01-16
JP2020500810A5 true JP2020500810A5 (enExample) 2020-10-15
JP7045372B2 JP7045372B2 (ja) 2022-03-31

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JP2019524886A Active JP7045372B2 (ja) 2016-11-15 2017-11-13 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置

Country Status (6)

Country Link
US (2) US10668561B2 (enExample)
EP (1) EP3541565B1 (enExample)
JP (1) JP7045372B2 (enExample)
KR (1) KR102420833B1 (enExample)
CN (2) CN114535782B (enExample)
WO (1) WO2018093732A1 (enExample)

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TWI890886B (zh) * 2021-11-04 2025-07-21 邱俊榮 使用空間光調製器的雷射切割方法與雷射切割裝置
US11632179B1 (en) * 2022-03-15 2023-04-18 United States Of America As Represented By The Secretary Of The Navy Remotely emitting confined electromagnetic radiation from laser-induced plasma filaments
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