JP2020500810A5 - - Google Patents

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Publication number
JP2020500810A5
JP2020500810A5 JP2019524886A JP2019524886A JP2020500810A5 JP 2020500810 A5 JP2020500810 A5 JP 2020500810A5 JP 2019524886 A JP2019524886 A JP 2019524886A JP 2019524886 A JP2019524886 A JP 2019524886A JP 2020500810 A5 JP2020500810 A5 JP 2020500810A5
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JP
Japan
Prior art keywords
laser
aspherical
effective aperture
focusing lens
laser radiation
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JP2019524886A
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English (en)
Japanese (ja)
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JP7045372B2 (ja
JP2020500810A (ja
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Priority claimed from US15/352,385 external-priority patent/US10668561B2/en
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JP2019524886A 2016-11-15 2017-11-13 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置 Active JP7045372B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/352,385 2016-11-15
US15/352,385 US10668561B2 (en) 2016-11-15 2016-11-15 Laser apparatus for cutting brittle material
PCT/US2017/061386 WO2018093732A1 (en) 2016-11-15 2017-11-13 Laser apparatus for cutting brittle material with aspheric focusing means and a beam expander

Publications (3)

Publication Number Publication Date
JP2020500810A JP2020500810A (ja) 2020-01-16
JP2020500810A5 true JP2020500810A5 (enExample) 2020-10-15
JP7045372B2 JP7045372B2 (ja) 2022-03-31

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JP2019524886A Active JP7045372B2 (ja) 2016-11-15 2017-11-13 非球面集束手段およびビーム拡大器を用いて脆性材料を切断するためのレーザ装置

Country Status (6)

Country Link
US (2) US10668561B2 (enExample)
EP (1) EP3541565B1 (enExample)
JP (1) JP7045372B2 (enExample)
KR (1) KR102420833B1 (enExample)
CN (2) CN114535782B (enExample)
WO (1) WO2018093732A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
JP2017530867A (ja) 2014-07-14 2017-10-19 コーニング インコーポレイテッド 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
JP6654813B2 (ja) * 2015-06-02 2020-02-26 川崎重工業株式会社 面取り加工装置および面取り加工方法
US10522963B2 (en) * 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
EP3848333B1 (en) 2016-10-24 2025-12-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
EP3589084A1 (en) 2018-06-26 2020-01-01 Ecole Polytechnique Reflective optical system
JP7043999B2 (ja) * 2018-07-11 2022-03-30 日本電信電話株式会社 ハイブリッド光デバイスの溝作製方法およびハイブリッド光デバイス
US20200061750A1 (en) 2018-08-22 2020-02-27 Coherent Munich GmbH & Co. KG Mitigating low surface quality
TW202023735A (zh) * 2018-11-13 2020-07-01 香港商準晶科技有限公司 用於切割透明和半透明基板的基於激光的系統
DE102019219462A1 (de) * 2019-12-12 2021-06-17 Flabeg Deutschland Gmbh Verfahren zum Schneiden eines Glaselements und Schneidsystem
EP4078270A4 (en) * 2019-12-19 2024-01-03 Thermo Scientific Portable Analytical Instruments Inc. Adjustable extended focus raman system
KR20230065304A (ko) * 2020-09-09 2023-05-11 코닝 인코포레이티드 투명 작업편의 고각도 레이저 처리를 위한 방법 및 광학 어셈블리
JP2022098586A (ja) * 2020-12-22 2022-07-04 大船企業日本株式会社 プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法と、該プリント基板レーザ加工装置に装着されるアパーチャにおける加工点パワーの調整方法を実施してなるプリント基板レーザ加工装置
EP4357307A4 (en) * 2021-06-16 2025-07-09 Agc Inc METHOD FOR PRODUCING A PLATE-SHAPED MEMBER AND PLATE-SHAPED MEMBER
TWI890886B (zh) * 2021-11-04 2025-07-21 邱俊榮 使用空間光調製器的雷射切割方法與雷射切割裝置
US11632179B1 (en) * 2022-03-15 2023-04-18 United States Of America As Represented By The Secretary Of The Navy Remotely emitting confined electromagnetic radiation from laser-induced plasma filaments
KR102536286B1 (ko) * 2022-12-20 2023-05-26 ㈜ 엘에이티 레이저를 이용한 코팅층 제거방법
WO2024197214A1 (en) 2023-03-22 2024-09-26 Carbon, Inc. Combination additive and subtractive manufacturing methods and apparatus for light polymerizable resins
CN119306387B (zh) * 2024-11-11 2026-03-27 中国建筑材料科学研究总院有限公司 超薄玻璃切割方法及切割装置
CN119634994B (zh) * 2025-01-13 2025-11-04 北京理工大学 一种局部极化增强的非线性电离纳米刻写系统及方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002113711A (ja) * 2000-10-11 2002-04-16 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びそれに用いるレーザ加工装置
US7994450B2 (en) * 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
WO2004083133A2 (en) * 2003-03-21 2004-09-30 Rorze Systems Corporation Apparatus for cutting glass plate
WO2005007335A1 (ja) 2003-07-18 2005-01-27 Hamamatsu Photonics K.K. レーザ加工方法、レーザ加工装置、及び加工生産物
JP4698200B2 (ja) * 2004-10-27 2011-06-08 日立造船株式会社 レーザ加工方法およびレーザ加工装置
JP2006216820A (ja) * 2005-02-04 2006-08-17 Advanced Lcd Technologies Development Center Co Ltd レーザ加工方法、レーザ加工装置および結晶化装置
JP5241525B2 (ja) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
JP2012521339A (ja) * 2009-03-20 2012-09-13 コーニング インコーポレイテッド 精密レーザ罫書き
US20120234807A1 (en) 2009-12-07 2012-09-20 J.P. Sercel Associates Inc. Laser scribing with extended depth affectation into a workplace
CN102639280A (zh) * 2009-12-07 2012-08-15 Jp赛席尔联合股份有限公司 激光加工及切割系统与方法
US10191191B2 (en) * 2014-04-16 2019-01-29 Beam Engineering For Advanced Measurements Co. Diffractive waveplate lenses and applications
US8836941B2 (en) * 2010-02-10 2014-09-16 Imra America, Inc. Method and apparatus to prepare a substrate for molecular detection
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
WO2012052985A1 (en) * 2010-10-22 2012-04-26 Highcon Ltd Method and apparatus for laser cutting
TW201417928A (zh) 2012-07-30 2014-05-16 Raydiance Inc 具訂製邊形及粗糙度之脆性材料切割
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
CN103111755A (zh) * 2013-02-01 2013-05-22 武汉帝尔激光科技有限公司 一种双焦点激光加工系统
EP3473372B1 (en) * 2013-03-15 2021-01-27 Kinestral Technologies, Inc. Method for cutting strengthened glass
US20150034613A1 (en) 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
US11053156B2 (en) * 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US20150165563A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US9676167B2 (en) * 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
JP2015119076A (ja) 2013-12-19 2015-06-25 信越ポリマー株式会社 内部加工層形成単結晶部材およびその製造方法
CN106794371B (zh) * 2014-10-10 2019-09-03 富士通株式会社 技能判定方法、技能判定装置以及服务器
LT3206829T (lt) 2014-10-13 2019-03-12 Evana Technologies, Uab Lazerinio apdorojimo būdas perskelti arba perpjauti ruošinį, formuojant "adatos" formos pažeidimus
JP6104354B2 (ja) * 2014-12-16 2017-03-29 旭硝子株式会社 貫通孔形成方法、貫通孔形成装置、および貫通孔を有するガラス基板の製造方法
US20170313617A1 (en) * 2016-04-27 2017-11-02 Coherent, Inc. Method and apparatus for laser-cutting of transparent materials

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