KR102408302B1 - 리드 프레임 및 절연 재료를 포함하는 발광 디바이스 - Google Patents

리드 프레임 및 절연 재료를 포함하는 발광 디바이스 Download PDF

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Publication number
KR102408302B1
KR102408302B1 KR1020207004530A KR20207004530A KR102408302B1 KR 102408302 B1 KR102408302 B1 KR 102408302B1 KR 1020207004530 A KR1020207004530 A KR 1020207004530A KR 20207004530 A KR20207004530 A KR 20207004530A KR 102408302 B1 KR102408302 B1 KR 102408302B1
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South Korea
Prior art keywords
lead frame
molding
led
pillar
forming
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Korean (ko)
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KR20200033889A (ko
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수 리
투이 부.
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루미레즈 엘엘씨
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Priority claimed from US15/652,603 external-priority patent/US10381534B2/en
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    • H01L33/62—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H01L23/485—
    • H01L23/49541—
    • H01L33/486—
    • H01L33/54—
    • H01L33/60—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H01L2933/0033—
    • H01L2933/0066—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
KR1020207004530A 2017-07-18 2018-07-12 리드 프레임 및 절연 재료를 포함하는 발광 디바이스 Active KR102408302B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/652,603 US10381534B2 (en) 2017-07-18 2017-07-18 Light emitting device including a lead frame and an insulating material
US15/652,603 2017-07-18
EP17184498 2017-08-02
EP17184498.8 2017-08-02
PCT/US2018/041774 WO2019018193A1 (en) 2017-07-18 2018-07-12 LIGHT EMITTING DEVICE COMPRISING A CONNECTION GRID AND INSULATING MATERIAL

Publications (2)

Publication Number Publication Date
KR20200033889A KR20200033889A (ko) 2020-03-30
KR102408302B1 true KR102408302B1 (ko) 2022-06-14

Family

ID=63047471

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207004530A Active KR102408302B1 (ko) 2017-07-18 2018-07-12 리드 프레임 및 절연 재료를 포함하는 발광 디바이스

Country Status (6)

Country Link
EP (2) EP4583672A3 (https=)
JP (2) JP2020527864A (https=)
KR (1) KR102408302B1 (https=)
CN (1) CN111357124A (https=)
TW (1) TWI832819B (https=)
WO (1) WO2019018193A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11335842B2 (en) * 2018-02-14 2022-05-17 Maven Optronics Co., Ltd. Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same
JP2020167366A (ja) * 2019-02-26 2020-10-08 ローム株式会社 半導体発光装置および半導体発光装置の製造方法
DE102020107409B4 (de) * 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement
CN114628263B (zh) * 2022-05-13 2022-08-05 威海三维曲板智能装备有限公司 一种光电混合封装结构及其制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070126020A1 (en) 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
JP2011155120A (ja) 2010-01-27 2011-08-11 Toppan Printing Co Ltd Ｌｅｄ発光素子用リードフレーム基板の製造方法
JP2012033724A (ja) * 2010-07-30 2012-02-16 Dainippon Printing Co Ltd 樹脂付リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
JP2013219104A (ja) 2012-04-05 2013-10-24 Toppan Printing Co Ltd Ｌｅｄ用リードフレームおよびその製造方法
US20130343067A1 (en) * 2011-02-28 2013-12-26 Nichia Corporation Light emitting device
JP2014031436A (ja) * 2012-08-03 2014-02-20 Shin Etsu Chem Co Ltd 硬化性樹脂組成物、その硬化物及びそれを用いた光半導体デバイス
US20150349225A1 (en) 2014-05-29 2015-12-03 Lg Innotek Co., Ltd. Light emitting device package

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3830762A (en) * 1973-08-24 1974-08-20 Us Agriculture Polysaccharide-containing elastomers
KR100867515B1 (ko) * 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
US8044418B2 (en) * 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
MX2010013220A (es) * 2008-07-24 2011-03-29 Ind Negromex S A De C V Procedimientos para elaborar silano, silice hidrofobizado, lote maestro de silice y productos de caucho.
US8044420B2 (en) * 2009-01-15 2011-10-25 Advanced Semiconductor Engineering, Inc. Light emitting diode package structure
KR101047603B1 (ko) * 2009-03-10 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
JP2010212508A (ja) * 2009-03-11 2010-09-24 Sony Corp 発光素子実装用パッケージ、発光装置、バックライトおよび液晶表示装置
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
KR101303168B1 (ko) * 2011-07-26 2013-09-09 안상정 반도체 발광부 연결체
JP5818149B2 (ja) * 2011-09-09 2015-11-18 大日本印刷株式会社 樹脂付リードフレーム、半導体装置、照明装置、樹脂付リードフレームの製造方法および半導体装置の製造方法
KR20130098048A (ko) * 2012-02-27 2013-09-04 엘지이노텍 주식회사 발광소자 패키지
CN104124237A (zh) * 2013-04-26 2014-10-29 光明半导体（天津）有限公司 发光二极管封装件及其制造方法
JP6176101B2 (ja) * 2013-12-17 2017-08-09 日亜化学工業株式会社 樹脂パッケージ及び発光装置
KR102409220B1 (ko) * 2014-01-07 2022-06-16 루미리즈 홀딩 비.브이. 발광 디바이스 패키지
CN106062063A (zh) * 2014-02-27 2016-10-26 纳幕尔杜邦公司 微浆-弹性体母料和基于其的复合物
JP6262578B2 (ja) * 2014-03-18 2018-01-17 スタンレー電気株式会社 発光装置
EP3237454B1 (en) * 2014-12-22 2020-08-12 DuPont Industrial Biosciences USA, LLC Polymeric blend containing poly alpha-1,3-glucan
JP6056914B2 (ja) * 2015-07-07 2017-01-11 大日本印刷株式会社 樹脂付リードフレーム、半導体装置および照明装置
WO2018081263A1 (en) * 2016-10-28 2018-05-03 E. I. Du Pont De Nemours And Company Rubber compositions comprising polysaccharides

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070126020A1 (en) 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
JP2011155120A (ja) 2010-01-27 2011-08-11 Toppan Printing Co Ltd Ｌｅｄ発光素子用リードフレーム基板の製造方法
JP2012033724A (ja) * 2010-07-30 2012-02-16 Dainippon Printing Co Ltd 樹脂付リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
US20130343067A1 (en) * 2011-02-28 2013-12-26 Nichia Corporation Light emitting device
JP2013219104A (ja) 2012-04-05 2013-10-24 Toppan Printing Co Ltd Ｌｅｄ用リードフレームおよびその製造方法
JP2014031436A (ja) * 2012-08-03 2014-02-20 Shin Etsu Chem Co Ltd 硬化性樹脂組成物、その硬化物及びそれを用いた光半導体デバイス
US20150349225A1 (en) 2014-05-29 2015-12-03 Lg Innotek Co., Ltd. Light emitting device package

Also Published As

Publication number Publication date
JP2020527864A (ja) 2020-09-10
KR20200033889A (ko) 2020-03-30
JP7605400B2 (ja) 2024-12-24
TWI832819B (zh) 2024-02-21
EP3656001A1 (en) 2020-05-27
TW201916413A (zh) 2019-04-16
EP4583672A2 (en) 2025-07-09
JP2023090921A (ja) 2023-06-29
CN111357124A (zh) 2020-06-30
EP4583672A3 (en) 2025-09-24
WO2019018193A1 (en) 2019-01-24

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