CN111357124A - 包括引线框和绝缘材料的发光器件 - Google Patents

包括引线框和绝缘材料的发光器件 Download PDF

Info

Publication number
CN111357124A
CN111357124A CN201880060567.4A CN201880060567A CN111357124A CN 111357124 A CN111357124 A CN 111357124A CN 201880060567 A CN201880060567 A CN 201880060567A CN 111357124 A CN111357124 A CN 111357124A
Authority
CN
China
Prior art keywords
leadframe
molding
post
led
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880060567.4A
Other languages
English (en)
Chinese (zh)
Inventor
李舒
T.于
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds LLC
Original Assignee
Lumileds LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/652,603 external-priority patent/US10381534B2/en
Application filed by Lumileds LLC filed Critical Lumileds LLC
Publication of CN111357124A publication Critical patent/CN111357124A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
CN201880060567.4A 2017-07-18 2018-07-12 包括引线框和绝缘材料的发光器件 Pending CN111357124A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/652,603 US10381534B2 (en) 2017-07-18 2017-07-18 Light emitting device including a lead frame and an insulating material
US15/652603 2017-07-18
EP17184498 2017-08-02
EP17184498.8 2017-08-02
PCT/US2018/041774 WO2019018193A1 (en) 2017-07-18 2018-07-12 LIGHT EMITTING DEVICE COMPRISING A CONNECTION GRID AND INSULATING MATERIAL

Publications (1)

Publication Number Publication Date
CN111357124A true CN111357124A (zh) 2020-06-30

Family

ID=63047471

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880060567.4A Pending CN111357124A (zh) 2017-07-18 2018-07-12 包括引线框和绝缘材料的发光器件

Country Status (6)

Country Link
EP (2) EP4583672A3 (https=)
JP (2) JP2020527864A (https=)
KR (1) KR102408302B1 (https=)
CN (1) CN111357124A (https=)
TW (1) TWI832819B (https=)
WO (1) WO2019018193A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11335842B2 (en) * 2018-02-14 2022-05-17 Maven Optronics Co., Ltd. Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same
JP2020167366A (ja) * 2019-02-26 2020-10-08 ローム株式会社 半導体発光装置および半導体発光装置の製造方法
DE102020107409B4 (de) * 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement
CN114628263B (zh) * 2022-05-13 2022-08-05 威海三维曲板智能装备有限公司 一种光电混合封装结构及其制造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101834258A (zh) * 2009-03-11 2010-09-15 索尼公司 发光元件的安装用封装、发光装置、背光和液晶显示装置
CN101834256A (zh) * 2009-03-10 2010-09-15 Lg伊诺特有限公司 发光器件封装
JP2013058695A (ja) * 2011-09-09 2013-03-28 Dainippon Printing Co Ltd 樹脂付リードフレーム、半導体装置、照明装置、樹脂付リードフレームの製造方法および半導体装置の製造方法
US20130343067A1 (en) * 2011-02-28 2013-12-26 Nichia Corporation Light emitting device
JP2014031436A (ja) * 2012-08-03 2014-02-20 Shin Etsu Chem Co Ltd 硬化性樹脂組成物、その硬化物及びそれを用いた光半導体デバイス
CN104247057A (zh) * 2012-02-27 2014-12-24 Lg伊诺特有限公司 发光器件封装
JP2015119011A (ja) * 2013-12-17 2015-06-25 日亜化学工業株式会社 樹脂パッケージ及び発光装置
US20150349225A1 (en) * 2014-05-29 2015-12-03 Lg Innotek Co., Ltd. Light emitting device package
CN105830240A (zh) * 2014-01-07 2016-08-03 皇家飞利浦有限公司 发光器件封装

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3830762A (en) * 1973-08-24 1974-08-20 Us Agriculture Polysaccharide-containing elastomers
KR100867515B1 (ko) * 2004-12-06 2008-11-07 삼성전기주식회사 발광소자 패키지
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
US8044418B2 (en) * 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
MX2010013220A (es) * 2008-07-24 2011-03-29 Ind Negromex S A De C V Procedimientos para elaborar silano, silice hidrofobizado, lote maestro de silice y productos de caucho.
US8044420B2 (en) * 2009-01-15 2011-10-25 Advanced Semiconductor Engineering, Inc. Light emitting diode package structure
JP5509878B2 (ja) * 2010-01-27 2014-06-04 凸版印刷株式会社 Ｌｅｄ発光素子用リードフレーム基板の製造方法
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
JP5618189B2 (ja) * 2010-07-30 2014-11-05 大日本印刷株式会社 樹脂付リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
KR101303168B1 (ko) * 2011-07-26 2013-09-09 안상정 반도체 발광부 연결체
JP2013219104A (ja) * 2012-04-05 2013-10-24 Toppan Printing Co Ltd Ｌｅｄ用リードフレームおよびその製造方法
CN104124237A (zh) * 2013-04-26 2014-10-29 光明半导体（天津）有限公司 发光二极管封装件及其制造方法
CN106062063A (zh) * 2014-02-27 2016-10-26 纳幕尔杜邦公司 微浆-弹性体母料和基于其的复合物
JP6262578B2 (ja) * 2014-03-18 2018-01-17 スタンレー電気株式会社 発光装置
EP3237454B1 (en) * 2014-12-22 2020-08-12 DuPont Industrial Biosciences USA, LLC Polymeric blend containing poly alpha-1,3-glucan
JP6056914B2 (ja) * 2015-07-07 2017-01-11 大日本印刷株式会社 樹脂付リードフレーム、半導体装置および照明装置
WO2018081263A1 (en) * 2016-10-28 2018-05-03 E. I. Du Pont De Nemours And Company Rubber compositions comprising polysaccharides

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101834256A (zh) * 2009-03-10 2010-09-15 Lg伊诺特有限公司 发光器件封装
CN101834258A (zh) * 2009-03-11 2010-09-15 索尼公司 发光元件的安装用封装、发光装置、背光和液晶显示装置
US20130343067A1 (en) * 2011-02-28 2013-12-26 Nichia Corporation Light emitting device
JP2013058695A (ja) * 2011-09-09 2013-03-28 Dainippon Printing Co Ltd 樹脂付リードフレーム、半導体装置、照明装置、樹脂付リードフレームの製造方法および半導体装置の製造方法
CN104247057A (zh) * 2012-02-27 2014-12-24 Lg伊诺特有限公司 发光器件封装
JP2014031436A (ja) * 2012-08-03 2014-02-20 Shin Etsu Chem Co Ltd 硬化性樹脂組成物、その硬化物及びそれを用いた光半導体デバイス
JP2015119011A (ja) * 2013-12-17 2015-06-25 日亜化学工業株式会社 樹脂パッケージ及び発光装置
CN105830240A (zh) * 2014-01-07 2016-08-03 皇家飞利浦有限公司 发光器件封装
US20150349225A1 (en) * 2014-05-29 2015-12-03 Lg Innotek Co., Ltd. Light emitting device package

Also Published As

Publication number Publication date
JP2020527864A (ja) 2020-09-10
KR20200033889A (ko) 2020-03-30
JP7605400B2 (ja) 2024-12-24
TWI832819B (zh) 2024-02-21
EP3656001A1 (en) 2020-05-27
KR102408302B1 (ko) 2022-06-14
TW201916413A (zh) 2019-04-16
EP4583672A2 (en) 2025-07-09
JP2023090921A (ja) 2023-06-29
EP4583672A3 (en) 2025-09-24
WO2019018193A1 (en) 2019-01-24

Similar Documents

Publication Publication Date Title
JP7605400B2 (ja) リードフレーム及び絶縁材料を含む発光デバイス
US10847680B2 (en) Light emitting device package
KR101760545B1 (ko) 수지 부착 리드 프레임 및 그 제조 방법, 및 리드 프레임
CN103718314B (zh) 发光装置
US8044423B2 (en) Light emitting device package
US20110241028A1 (en) Light emitting device and light unit having the same
JP5922326B2 (ja) Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
US20150171282A1 (en) Resin package and light emitting device
US11081630B2 (en) Light emitting device package with a coating layer
CN101874311B (zh) 发光器件封装
CN111837245A (zh) 发光器件封装
US10381534B2 (en) Light emitting device including a lead frame and an insulating material
TWI521745B (zh) 發光二極體封裝結構及其製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination