JP2020527864A - リードフレーム及び絶縁材料を含む発光デバイス - Google Patents

リードフレーム及び絶縁材料を含む発光デバイス Download PDF

Info

Publication number
JP2020527864A
JP2020527864A JP2020502262A JP2020502262A JP2020527864A JP 2020527864 A JP2020527864 A JP 2020527864A JP 2020502262 A JP2020502262 A JP 2020502262A JP 2020502262 A JP2020502262 A JP 2020502262A JP 2020527864 A JP2020527864 A JP 2020527864A
Authority
JP
Japan
Prior art keywords
lead frame
pillar
led
frame portion
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020502262A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020527864A5 (https=
Inventor
リー，シュー
ヴゥ，トゥイ
Original Assignee
ルミレッズ リミテッド ライアビリティ カンパニー
ルミレッズ リミテッド ライアビリティ カンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/652,603 external-priority patent/US10381534B2/en
Application filed by ルミレッズ リミテッド ライアビリティ カンパニー, ルミレッズ リミテッド ライアビリティ カンパニー filed Critical ルミレッズ リミテッド ライアビリティ カンパニー
Publication of JP2020527864A publication Critical patent/JP2020527864A/ja
Publication of JP2020527864A5 publication Critical patent/JP2020527864A5/ja
Priority to JP2023077765A priority Critical patent/JP7605400B2/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
JP2020502262A 2017-07-18 2018-07-12 リードフレーム及び絶縁材料を含む発光デバイス Pending JP2020527864A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023077765A JP7605400B2 (ja) 2017-07-18 2023-05-10 リードフレーム及び絶縁材料を含む発光デバイス

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/652,603 US10381534B2 (en) 2017-07-18 2017-07-18 Light emitting device including a lead frame and an insulating material
US15/652,603 2017-07-18
EP17184498 2017-08-02
EP17184498.8 2017-08-02
PCT/US2018/041774 WO2019018193A1 (en) 2017-07-18 2018-07-12 LIGHT EMITTING DEVICE COMPRISING A CONNECTION GRID AND INSULATING MATERIAL

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023077765A Division JP7605400B2 (ja) 2017-07-18 2023-05-10 リードフレーム及び絶縁材料を含む発光デバイス

Publications (2)

Publication Number Publication Date
JP2020527864A true JP2020527864A (ja) 2020-09-10
JP2020527864A5 JP2020527864A5 (https=) 2021-08-19

Family

ID=63047471

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020502262A Pending JP2020527864A (ja) 2017-07-18 2018-07-12 リードフレーム及び絶縁材料を含む発光デバイス
JP2023077765A Active JP7605400B2 (ja) 2017-07-18 2023-05-10 リードフレーム及び絶縁材料を含む発光デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023077765A Active JP7605400B2 (ja) 2017-07-18 2023-05-10 リードフレーム及び絶縁材料を含む発光デバイス

Country Status (6)

Country Link
EP (2) EP4583672A3 (https=)
JP (2) JP2020527864A (https=)
KR (1) KR102408302B1 (https=)
CN (1) CN111357124A (https=)
TW (1) TWI832819B (https=)
WO (1) WO2019018193A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11335842B2 (en) * 2018-02-14 2022-05-17 Maven Optronics Co., Ltd. Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same
JP2020167366A (ja) * 2019-02-26 2020-10-08 ローム株式会社 半導体発光装置および半導体発光装置の製造方法
DE102020107409B4 (de) * 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement
CN114628263B (zh) * 2022-05-13 2022-08-05 威海三维曲板智能装备有限公司 一种光电混合封装结构及其制造方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165542A (ja) * 2004-12-06 2006-06-22 Samsung Electro Mech Co Ltd 発光素子パッケージ
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
JP2008182242A (ja) * 2007-01-24 2008-08-07 Cree Inc 固体発光デバイス用のリード・フレーム・ベースのパッケージと固体発光デバイス用のリード・フレーム・ベースのパッケージを形成する方法
JP2012033724A (ja) * 2010-07-30 2012-02-16 Dainippon Printing Co Ltd 樹脂付リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
WO2012117974A1 (ja) * 2011-02-28 2012-09-07 日亜化学工業株式会社 発光装置
JP2013058695A (ja) * 2011-09-09 2013-03-28 Dainippon Printing Co Ltd 樹脂付リードフレーム、半導体装置、照明装置、樹脂付リードフレームの製造方法および半導体装置の製造方法
JP2014031436A (ja) * 2012-08-03 2014-02-20 Shin Etsu Chem Co Ltd 硬化性樹脂組成物、その硬化物及びそれを用いた光半導体デバイス
US20140175472A1 (en) * 2011-07-26 2014-06-26 Sang Jeong An Semiconductor Light Emitting Unit Connected Body
CN104124237A (zh) * 2013-04-26 2014-10-29 光明半导体（天津）有限公司 发光二极管封装件及其制造方法
JP2015119011A (ja) * 2013-12-17 2015-06-25 日亜化学工業株式会社 樹脂パッケージ及び発光装置
JP2015177151A (ja) * 2014-03-18 2015-10-05 スタンレー電気株式会社 発光装置
US20150349225A1 (en) * 2014-05-29 2015-12-03 Lg Innotek Co., Ltd. Light emitting device package

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3830762A (en) * 1973-08-24 1974-08-20 Us Agriculture Polysaccharide-containing elastomers
MX2010013220A (es) * 2008-07-24 2011-03-29 Ind Negromex S A De C V Procedimientos para elaborar silano, silice hidrofobizado, lote maestro de silice y productos de caucho.
US8044420B2 (en) * 2009-01-15 2011-10-25 Advanced Semiconductor Engineering, Inc. Light emitting diode package structure
KR101047603B1 (ko) * 2009-03-10 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
JP2010212508A (ja) * 2009-03-11 2010-09-24 Sony Corp 発光素子実装用パッケージ、発光装置、バックライトおよび液晶表示装置
JP5509878B2 (ja) * 2010-01-27 2014-06-04 凸版印刷株式会社 Ｌｅｄ発光素子用リードフレーム基板の製造方法
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
KR20130098048A (ko) * 2012-02-27 2013-09-04 엘지이노텍 주식회사 발광소자 패키지
JP2013219104A (ja) * 2012-04-05 2013-10-24 Toppan Printing Co Ltd Ｌｅｄ用リードフレームおよびその製造方法
KR102409220B1 (ko) * 2014-01-07 2022-06-16 루미리즈 홀딩 비.브이. 발광 디바이스 패키지
CN106062063A (zh) * 2014-02-27 2016-10-26 纳幕尔杜邦公司 微浆-弹性体母料和基于其的复合物
EP3237454B1 (en) * 2014-12-22 2020-08-12 DuPont Industrial Biosciences USA, LLC Polymeric blend containing poly alpha-1,3-glucan
JP6056914B2 (ja) * 2015-07-07 2017-01-11 大日本印刷株式会社 樹脂付リードフレーム、半導体装置および照明装置
WO2018081263A1 (en) * 2016-10-28 2018-05-03 E. I. Du Pont De Nemours And Company Rubber compositions comprising polysaccharides

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165542A (ja) * 2004-12-06 2006-06-22 Samsung Electro Mech Co Ltd 発光素子パッケージ
US20070126020A1 (en) * 2005-12-03 2007-06-07 Cheng Lin High-power LED chip packaging structure and fabrication method thereof
JP2008182242A (ja) * 2007-01-24 2008-08-07 Cree Inc 固体発光デバイス用のリード・フレーム・ベースのパッケージと固体発光デバイス用のリード・フレーム・ベースのパッケージを形成する方法
JP2012033724A (ja) * 2010-07-30 2012-02-16 Dainippon Printing Co Ltd 樹脂付リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
WO2012117974A1 (ja) * 2011-02-28 2012-09-07 日亜化学工業株式会社 発光装置
US20140175472A1 (en) * 2011-07-26 2014-06-26 Sang Jeong An Semiconductor Light Emitting Unit Connected Body
JP2013058695A (ja) * 2011-09-09 2013-03-28 Dainippon Printing Co Ltd 樹脂付リードフレーム、半導体装置、照明装置、樹脂付リードフレームの製造方法および半導体装置の製造方法
JP2014031436A (ja) * 2012-08-03 2014-02-20 Shin Etsu Chem Co Ltd 硬化性樹脂組成物、その硬化物及びそれを用いた光半導体デバイス
CN104124237A (zh) * 2013-04-26 2014-10-29 光明半导体（天津）有限公司 发光二极管封装件及其制造方法
JP2015119011A (ja) * 2013-12-17 2015-06-25 日亜化学工業株式会社 樹脂パッケージ及び発光装置
JP2015177151A (ja) * 2014-03-18 2015-10-05 スタンレー電気株式会社 発光装置
US20150349225A1 (en) * 2014-05-29 2015-12-03 Lg Innotek Co., Ltd. Light emitting device package

Also Published As

Publication number Publication date
KR20200033889A (ko) 2020-03-30
JP7605400B2 (ja) 2024-12-24
TWI832819B (zh) 2024-02-21
EP3656001A1 (en) 2020-05-27
KR102408302B1 (ko) 2022-06-14
TW201916413A (zh) 2019-04-16
EP4583672A2 (en) 2025-07-09
JP2023090921A (ja) 2023-06-29
CN111357124A (zh) 2020-06-30
EP4583672A3 (en) 2025-09-24
WO2019018193A1 (en) 2019-01-24

Similar Documents

Publication Publication Date Title
JP7605400B2 (ja) リードフレーム及び絶縁材料を含む発光デバイス
KR101760545B1 (ko) 수지 부착 리드 프레임 및 그 제조 방법, 및 리드 프레임
US8569782B2 (en) Optoelectronic semiconductor component
JP5922326B2 (ja) Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
US20160118549A1 (en) Light emitting device package
US11081630B2 (en) Light emitting device package with a coating layer
TW201208152A (en) Surface-mountable optoelectronic component and method of manufacturing a surface-mountable optoelectronic component
US8772793B2 (en) Light emitting diodes and method for manufacturing the same
CN102856468B (zh) 发光二极管封装结构及其制造方法
CN111837245A (zh) 发光器件封装
CN103843164A (zh) 光电半导体组件
JP5455720B2 (ja) 光半導体パッケージおよび光半導体装置
TWI505511B (zh) 發光二極體封裝結構
US10381534B2 (en) Light emitting device including a lead frame and an insulating material
TWI481079B (zh) 發光二極體封裝結構的製造方法
US20120139002A1 (en) Led package structure and method for manufacturing the same
KR102136373B1 (ko) 발광소자 패키지용 리드 프레임, 리드 프레임의 제조 방법 및 발광소자 패키지의 제조 방법
KR20150008627A (ko) 고 반사성 와이어를 포함하는 발광 장치
TW201515285A (zh) 發光二極體封裝結構及其製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200319

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210709

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210709

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220325

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220412

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220628

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220906

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221122

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230110