KR102390526B1 - 봉지체의 제조 방법, 및 적층체 - Google Patents

봉지체의 제조 방법, 및 적층체 Download PDF

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Publication number
KR102390526B1
KR102390526B1 KR1020170040093A KR20170040093A KR102390526B1 KR 102390526 B1 KR102390526 B1 KR 102390526B1 KR 1020170040093 A KR1020170040093 A KR 1020170040093A KR 20170040093 A KR20170040093 A KR 20170040093A KR 102390526 B1 KR102390526 B1 KR 102390526B1
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KR
South Korea
Prior art keywords
separation layer
layer
encapsulant
adhesive layer
resin
Prior art date
Application number
KR1020170040093A
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English (en)
Korean (ko)
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KR20170130279A (ko
Inventor
기미히로 나카다
야스마사 이와타
Original Assignee
도오꾜오까고오교 가부시끼가이샤
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Publication of KR20170130279A publication Critical patent/KR20170130279A/ko
Application granted granted Critical
Publication of KR102390526B1 publication Critical patent/KR102390526B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
KR1020170040093A 2016-05-18 2017-03-29 봉지체의 제조 방법, 및 적층체 KR102390526B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016099971A JP6691816B2 (ja) 2016-05-18 2016-05-18 封止体の製造方法
JPJP-P-2016-099971 2016-05-18

Publications (2)

Publication Number Publication Date
KR20170130279A KR20170130279A (ko) 2017-11-28
KR102390526B1 true KR102390526B1 (ko) 2022-04-25

Family

ID=60416648

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170040093A KR102390526B1 (ko) 2016-05-18 2017-03-29 봉지체의 제조 방법, 및 적층체

Country Status (3)

Country Link
JP (1) JP6691816B2 (ja)
KR (1) KR102390526B1 (ja)
TW (1) TWI734767B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7004566B2 (ja) * 2017-12-28 2022-01-21 東京応化工業株式会社 積層体及びその製造方法、並びに電子部品の製造方法
JP6991673B2 (ja) * 2018-02-27 2022-01-12 株式会社ディスコ 剥離方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042829A (ja) * 2005-08-03 2007-02-15 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュールと電子部品内蔵基板およびそれらの製造方法
US20100203296A1 (en) * 2009-02-10 2010-08-12 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
JP2014090123A (ja) * 2012-10-31 2014-05-15 Nitto Denko Corp 半導体装置の製造方法、及び、接着シート
JP2014166653A (ja) * 2013-02-28 2014-09-11 Toray Eng Co Ltd 配線基板の電極高さ均一化方法およびこれを用いた配線基板
WO2015199030A1 (ja) * 2014-06-26 2015-12-30 凸版印刷株式会社 配線基板、半導体装置及び半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5189665B2 (ja) 2010-08-09 2013-04-24 株式会社ディスコ ウエハレベルパッケージ構造およびその製造方法
JP5803276B2 (ja) 2011-05-26 2015-11-04 富士通株式会社 半導体装置の製造方法
JP5810957B2 (ja) 2012-02-17 2015-11-11 富士通株式会社 半導体装置の製造方法及び電子装置の製造方法
JP6006569B2 (ja) * 2012-07-23 2016-10-12 東京応化工業株式会社 積層体及び積層体の製造方法
WO2014050662A1 (ja) * 2012-09-28 2014-04-03 日東電工株式会社 半導体装置の製造方法、及び、接着シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042829A (ja) * 2005-08-03 2007-02-15 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュールと電子部品内蔵基板およびそれらの製造方法
US20100203296A1 (en) * 2009-02-10 2010-08-12 Industrial Technology Research Institute Transferring structure for flexible electronic device and method for fabricating flexible electronic device
JP2014090123A (ja) * 2012-10-31 2014-05-15 Nitto Denko Corp 半導体装置の製造方法、及び、接着シート
JP2014166653A (ja) * 2013-02-28 2014-09-11 Toray Eng Co Ltd 配線基板の電極高さ均一化方法およびこれを用いた配線基板
WO2015199030A1 (ja) * 2014-06-26 2015-12-30 凸版印刷株式会社 配線基板、半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW201804540A (zh) 2018-02-01
JP2017208453A (ja) 2017-11-24
KR20170130279A (ko) 2017-11-28
JP6691816B2 (ja) 2020-05-13
TWI734767B (zh) 2021-08-01

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