KR102390526B1 - A sealing body manufacturing method, and a laminate - Google Patents

Abstract

(Project) When the sealing body is formed on a support body, the manufacturing method of the sealing body which can prevent that the separation layer formed in the support body peels, and providing a laminated body.
(Solution) The manufacturing method of the sealing body includes the process of forming the separation layer 2 which changes in quality by irradiating light on one flat part 1a of the support body 1, The peripheral part of the support body 1 ( 1b) a step of removing the separation layer (2) formed on the entire periphery, and a step of forming an adhesive layer (3) on the surface of the support body (1) on the side from which the separation layer on the entire periphery of the peripheral portion (1b) has been removed; , a step of forming the encapsulant 7 on the adhesive layer 3 .

Description

The manufacturing method of a sealing body, and a laminated body {A SEALING BODY MANUFACTURING METHOD, AND A LAMINATE}

This invention relates to the manufacturing method of a sealing body, and a laminated body.

Recently, a fan-out type WLP (Fan-Out Wafer Level Package) technology has been developed in order to realize integration, miniaturization, and the like of semiconductor devices. In the fan-out type WLP technique, (i) once, on a support, a resin wafer (similar wafer) in which a plurality of chips are sealed with a resin is formed, then the support is removed from the resin wafer, and then the resin wafer A method of forming a sealing body by forming a wiring layer with respect to (Patent Documents 1 to 3), and (ii) a method of forming a sealing body by removing the support after forming a wiring layer and a resin wafer on a support (Non-Patent Literature) 1) is known, and the latter attracts attention from the viewpoint that high-density wiring is possible.

Japanese Patent Application Laid-Open No. 2012-248598 (published on December 13, 2012) Japanese Patent Application Laid-Open No. 2012-60100 (published on March 22, 2012) Japanese Patent Laid-Open No. 2013-168594 (published on August 29, 2013)

Yoichiro Kurita, "Development of an ultra-small package that realizes high-reliability and high-density wiring by RDL-first method, a new process of FO-WLP", [online], RENESAS EDGE, [Searched on January 6, 2008], Internet ＜ URL: http://japan.renesas.com/media/edge_ol/r_and_d/01/r70pf0030jj0101_edge.pdf>

The present inventors are examining, based on their own knowledge, that, in the fan-out type WLP technique, a separation layer that is altered by irradiating light is formed on the support in advance as a structure for removing the support at a desired timing. As a result, in the method of forming a sealing body (wiring layer and resin wafer) on a support like Non-Patent Document 1, a process for forming a wiring layer on a support (for example, lithography processing, etc.) is performed. Therefore, it was found that the problem that the separation layer formed on the support peels off may occur due to the influence of the treatment (eg, the influence of a chemical solution used for the treatment).

The present invention has been made in view of the above problems, and when the encapsulant is formed on the support, a method for producing an encapsulant capable of preventing peeling of the separation layer formed on the support, and a laminate Its main purpose is to provide

In order to solve the above problems, the manufacturing method of the encapsulant according to the present invention,

A method for manufacturing an encapsulant comprising: a wiring layer; an element mounted on the wiring layer; and an encapsulant for encapsulating the element;

A separation layer forming step of forming a separation layer that is altered by irradiating light on one flat portion of the light-transmitting support;

a separation layer peripheral portion removing step of removing the separation layer formed around the entire peripheral portion of the support;

an adhesive layer forming step of forming an adhesive layer on the side of the support from which the separation layer has been removed from the entire periphery of the support;

and an encapsulant forming step of forming the encapsulant on the adhesive layer.

In addition, the laminate according to the present invention,

A support that transmits light, and

A separation layer that is altered by irradiating light, and

adhesive layer,

The encapsulant is laminated in this order,

The encapsulant includes a wiring layer, an element mounted on the wiring layer, and a sealing material encapsulating the element,

The separation layer is covered with the adhesive layer except for a portion in contact with the support.

ADVANTAGE OF THE INVENTION According to this invention, when forming the sealing body on a support body, the manufacturing method of the sealing body which can prevent that the separation layer formed in the support body peels, and a laminated body can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows each process of the manufacturing method of the sealing body which concerns on Embodiment 1 of this invention.
It is a figure which shows each process of the manufacturing method of the sealing body which concerns on Embodiment 2 of this invention.

A method for manufacturing an encapsulant according to the present invention is a method for manufacturing an encapsulant comprising a wiring layer, an element mounted on the wiring layer, and an encapsulant for encapsulating the element. A separation layer forming step of forming a separation layer altered by irradiating light on one flat portion of the support; a separation layer peripheral portion removing step of removing the separation layer formed around the entire periphery of the support; It includes an adhesive layer forming step of forming an adhesive layer on the surface on the side from which the separation layer has been removed around the entire periphery, and a sealing body forming step of forming the sealing body on the adhesive layer.

According to the above configuration, after removing the separation layer formed around the entire periphery of the support body, the separation layer is protected by the adhesive layer by forming an adhesive layer on the side of the support from which the separation layer around the entire periphery is removed. can do. Accordingly, in the encapsulation forming step, it is possible to prevent the support from peeling due to erosion of the separation layer by a chemical solution or the like.

[Embodiment 1]

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining each process of the manufacturing method of the sealing body which concerns on one Embodiment (Embodiment 1) of this invention. In the manufacturing method of the encapsulant according to the first embodiment, the separation layer forming step, the separation layer peripheral portion removal step, the adhesive layer forming step, the encapsulation body forming step, the adhesive layer removing step, the light irradiation step, the separation step and the removing step are performed in this order. Conduct.

(Separation layer formation process)

As shown in Fig. 1(a), in the separation layer forming step, light is applied to one flat portion 1a of the support 1 that transmits light, for example, by a chemical vapor deposition (CVD) method or the like. By irradiating the separated layer (2) is formed. In addition, "one plane part" refers to one of the plane parts which the support body 1 has. In addition, the "flat part" may have the fine unevenness|corrugation of the grade which can be seen as substantially flat. The details of the support body 1 and the separation layer 2 and the details of the formation procedure of the separation layer 2 will be described later.

(Removing the peripheral portion of the separation layer)

As shown in Fig. 1(b), in the separation layer peripheral portion removal step, for example, by EBR (Edge Bead Removal) treatment, the separation layer formed around the entire circumference of the peripheral portion 1b of the support 1 ( 2) is removed. The peripheral portion 1b is a peripheral portion of the flat portion 1a. As a result, as shown in FIG. 1B , on the flat portion 1a, the separation layer 2 is formed in a portion surrounded by the peripheral portion 1b from which the separation layer 2 has been removed. do. The details of the EBR process will be described later.

(Adhesive layer formation process)

As shown in Fig. 1(c), in the adhesive layer forming step, the adhesive layer 3 is formed on the side of the support body 1 from which the separation layer 2 is removed around the peripheral portion 1b. . The adhesive layer 3 can be formed by apply|coating an adhesive agent by methods, such as spin coating, dipping, a roller blade, spray application|coating, slit application|coating, for example. Thereby, since the adhesive layer 3 is formed on the peripheral part 1b which surrounds the separation layer 2, and the separation layer 2, the separation layer 2 is covered by the adhesive layer 3 become a state Thereby, the separation layer 2 can be protected. The detail of the adhesive agent for forming the contact bonding layer 3 is mentioned later.

(Encapsulation Forming Process)

As shown to Fig.1 (d) - (g), in the sealing body formation process, the sealing body 7 is formed on the contact bonding layer 3 . In this embodiment, in a sealing body formation process, a wiring layer formation process, a mounting process, a sealing process, and a thinning process are implemented in this order.

As shown in FIG. 1(d) , in the wiring layer forming step, the wiring layer 4 is formed on the adhesive layer 3 .

In one embodiment, in the order of formation of the wiring layer 4 , first, a dielectric layer such as a silicon oxide (SiOx) or a photosensitive resin is formed on the adhesive layer 3 . The dielectric layer made of silicon oxide can be formed by, for example, a sputtering method, a vacuum vapor deposition method, or the like. The dielectric layer made of the photosensitive resin can be formed by, for example, applying the photosensitive resin by a method such as spin coating, dipping, roller blade, spray coating, or slit coating.

Then, wiring is formed in the dielectric layer with a conductor such as a metal. As a method of forming the wiring, for example, a lithographic process such as photolithography (resist lithography) or a known semiconductor process method such as an etching process can be used.

As shown in FIG.1(e), the element 5 is mounted on the wiring layer 4 in a mounting process. Mounting of the element 5 on the wiring layer 4 can be performed using a chip mounter etc., for example.

As shown in FIG.1(f), in a sealing process, the element 5 is sealed with the sealing material 6. As shown in FIG. The sealing material 6 may be injection-molded using a molding die, for example, and may be apply|coated by methods, such as spin coating, dipping, a roller blade, spray application|coating, and slit application|coating.

As shown in FIG.1(g), in a thinning process, the sealing material 6 is thinned. The sealing material 6 may be thinned to the thickness equivalent to the element 5, for example.

By the above, on the support body 1, the sealing body 7 can be formed smoothly. At this time, for example, a chemical may be used in a lithography process for forming wiring, an etching process, or the like. Since the separation layer 2 often lacks chemical resistance, when the separation layer 2 comes into contact with a chemical solution, the separation layer 2 may peel. However, according to the present embodiment, since the separation layer 2 is protected by the adhesive layer 3 , it is possible to avoid contact of the chemical solution with the separation layer 2 . Moreover, by protecting the separation layer 2 with the adhesive layer 3, the separation layer 2 can be protected also from a chemical|medical solution other than a chemical|medical solution. Thereby, it can prevent that the separation layer 2 peels during a sealing body formation process. Further, according to the adhesive layer 3, for example, in the wiring layer forming step, even when an oxide film or a metal layer for constituting the wiring layer 4 is attached to the vicinity of the end of the support body 1, the adhesive layer 3 ), it is possible to easily remove the oxide film, the metal layer, or the like from the support body 1, and reuse of the support body 1 can be made possible without requiring special washing.

In addition, the laminate 8 shown in Fig. 1 (g) obtained by the above process includes a support 1 that transmits light, a separation layer 2 that is altered by irradiating light with light, and an adhesive layer 3 and , the encapsulant 7 is laminated in this order, and the encapsulant 7 includes a wiring layer 4 , an element 5 mounted on the wiring layer 4 , and a sealing material for sealing the element 5 . (6) is provided, and the separation layer (2) is covered with the adhesive layer (3) except for the portion in contact with the support body (1). Such a laminated body 8 is manufactured only in the process of the manufacturing method of the sealing body which concerns on this invention, In order to manufacture the isolated sealing body 7, it can be used suitably.

(Adhesive layer removal process)

As shown in Fig. 1(h) , in the adhesive layer removal step, the adhesive layer 3 formed around the entire periphery of the peripheral portion 1b of the support body 1 is removed, for example, by EBR treatment. The details of the EBR process will be described later. Of the adhesive layer 3, the portion formed around the entire periphery of the peripheral portion 1b of the support 1 adheres the support 1 and the encapsulant 7 without the separation layer 2 interposed therebetween. By removing a part, when the separation layer 2 is altered in quality, the support body 1 and the sealing body 7 can be isolate|separated smoothly.

In particular, by removing the adhesive layer 3 formed outside the outer peripheral edge portion 2a of the separation layer 2 formed on the support body 1, the support body 1 and the sealing body 7 are necessarily separated. Since it can be set as the state adhere|attached through (2), when the separation layer 2 is altered in quality, the support body 1 and the sealing body 7 can be isolate|separated more smoothly.

(Light irradiation process)

As shown to Fig.1 (i), in a light irradiation process, the separation layer 2 is altered by irradiating light L to the separation layer 2 through the support body 1 . The type and wavelength of the irradiated light L may be appropriately selected according to the transmittance of the support 1 and the material of the separation layer 2, for example, a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, Solid lasers such as LD lasers and fiber lasers, liquid lasers such as dye lasers, gas lasers such as CO ₂ lasers, excimer lasers, Ar lasers, and He-Ne lasers, laser light such as semiconductor lasers and free electron lasers, or Laser light may be used. Thereby, the separation layer 2 can be altered in quality, and the support 1 and the sealing body 7 can be easily separated from each other.

In addition, examples of laser light irradiation conditions in the case of laser light irradiation include, but are not limited to, the following conditions: The average output value of laser light is preferably 1.0 W or more and 5.0 W or less, and 3.0 W or more and 4.0 W or less are more preferable; It is preferable that they are 20 kHz or more and 60 kHz or less, and, as for the repetition frequency of a laser beam, it is more preferable that they are 30 kHz or more and 50 kHz or less; It is preferable that the scanning speed of a laser beam is 100 mm/s or more and 10000 mm/s or less.

(separation process)

As shown in FIG.1(j), in a separation process, the support body 1 and the sealing body 7 are isolate|separated. For example, by applying a force in a direction in which the support body 1 and the sealing body 7 move away from each other, the support body 1 and the sealing body 7 are isolate|separated. For example, in a state in which one of the support body 1 and the sealing body 7 is fixed to the stage, the other is lifted while being sucked and held by a separation plate provided with a suction pad such as a bellows pad, whereby the support body 1 is and the encapsulant 7 can be separated.

(removal process)

As shown in FIG.1(k), in a removal process, the adhesive layer 3 and the separation layer 2 which remain in the sealing body 7 from which the support body 1 wasolate|separated are removed. For example, a washing step of removing the residues of the adhesive layer 3 and the separation layer 2 with a washing solution containing an organic solvent or the like is performed. As the cleaning liquid, for example, a solvent for diluting an adhesive described later, a solvent showing alkalinity (particularly, an amine compound), etc. can be used, but it is not limited thereto.

By the above, the isolated sealing body 7 can be obtained.

Moreover, you may perform processes, such as solder ball formation and a dicing process, with respect to the sealing body 7 further. Moreover, you may laminate|stack another element on the sealing body 7 further.

In addition, in the adhesive removal process (refer FIG. 1(h)), in order to remove preferably the outer peripheral part of the adhesive layer 3 (outside of the separation layer 2), the outer diameter of the sealing body 7 is the support body ( It is preferably smaller than the outer diameter of 1). For this purpose, for example, (i) by making the outer diameter of the mold for molding of the sealing body 7 smaller than the support body, the sealing body 7 is molded smaller than the support body outer diameter, or (ii) the sealing body 7 After the molding, in order to make it smaller than the outer diameter of the support body, it is preferable to perform a full cut trim on the sealing body 7 .

[EBR processing]

In one embodiment, (A) in the separation layer peripheral portion removing step, EBR treatment for removing the separation layer 2 formed around the entire peripheral portion 1b of the support body 1, and (B) the adhesive layer In the removal step, the EBR treatment for removing the adhesive layer 3 formed on the entire circumference of the peripheral portion 1b of the support 1 is, for example, (i) a method of dissolving and removing with a solvent, (ii) A method of physically cutting and removing using a cutter or a blade etc., (iii) a method of removing by ashing under atmospheric pressure, etc. are mentioned. Among these, the method of removing with a solvent from a viewpoint of intensity|strength and practicality is preferable.

The solvent used in the method of removing with a solvent is not particularly limited as long as it can dissolve the separation layer 2 or the adhesive layer 3 to be removed, and those skilled in the art will appropriately select it according to the composition of the removal target. can For example, for the adhesive layer 3 formed using a hydrocarbon-based adhesive, terpene-based solvents such as p-mentane and d-limonene can be used as solvents, and formed using an acrylic or maleimide-based adhesive For the adhesive layer 3, propylene glycol monomethyl ether acetate, cyclohexanone, 2-heptanone, ethyl acetate, methyl ethyl ketone, etc. can be used as a solvent.

For the separation layer 2, for example, an alkaline solvent, particularly an amine compound, can be used, and primary, secondary and tertiary aliphatic amines, alicyclic amines, and aromatic amines can be used. , or at least one compound selected from the group consisting of heterocyclic amines can be used, and among these organic amine compounds, monoethanolamine, 2-(2-aminoethoxy)ethanol, and 2-ethylamino Alkanolamines, such as ethanol and 2-methylamino ethanol (MMA), are used preferably. The stripper may be used by mixing the above-mentioned amine compound with another solvent, or may be used by mixing the solvent described in the (dilution solvent) section to be described later.

As a method of supplying a solvent, the method of supplying a solvent to a removal object by ejection of a solvent, and the method of immersing a removal object in a solvent are mentioned, for example.

As a method of supplying a solvent to a removal object by ejection of a solvent, in order to supply a solvent uniformly, the method of supplying a solvent to a removal object, rotating the support body 1, is preferable. As a method of supplying the solvent while rotating the support body 1 , for example, a nozzle for ejecting the solvent is disposed directly above the peripheral portion 1b of the support body 1 , and the solvent is disposed on the support body 1 . ), the method of rotating the support body 1 using a spinner, dripping just outside of the peripheral part 1b is mentioned. Thereby, the solvent can be supplied just outside the periphery of the peripheral part 1b of the support body 1 . In addition, there is no restriction|limiting in the number of the nozzles to arrange|position, What is necessary is just one or more.

In the above method involving rotation of the support 1 and the ejection of the solvent, the rotational speed of the support 1, the flow rate of the solvent when the solvent is supplied from the nozzle, and the supply time of the solvent are the composition of the removal target, the removal Although it may be different depending on the thickness of the object, the kind of solvent used, and the degree of removal, those skilled in the art can examine and determine the optimal conditions without difficulty.

Moreover, it is preferable to dry the support body 1 etc. after melt|dissolution of the removal object with a solvent. By passing through a drying process, the solvent which penetrated into the separation layer 2 or the contact bonding layer 3 which is not an unnecessary solvent and the part to be removed can be removed.

As a drying method, hair drying by rotating the support body 1 using a spinner etc., drying by air blow by spraying N ₂ gas, etc., drying by baking, and drying by reduced pressure, etc. are mentioned. there is. In addition, as these drying methods, both the method of using any method individually, or the method of using any two or more methods in combination are possible.

[Encapsulation (7)]

As mentioned above, the sealing body 7 is equipped with the wiring layer 4, the element 5 mounted in the wiring layer 4, and the sealing material 6 which seals the element 5. . In one embodiment, the sealing body 7 is equipped with the some element 5, and by dicing such a sealing body 7, a some electronic component can be obtained.

The element 5 is a semiconductor element or another element, and may have a single-layered or multi-layered structure. In addition, when the element 5 is a semiconductor element, the electronic component obtained by dicing the sealing body 7 turns into a semiconductor device.

The wiring layer 4 is also called RDL (Redistribution Layer: redistribution layer), is a thin-film wiring body constituting the wiring connected to the element 5 , and may have a single-layer or multiple-layer structure. In one embodiment, the wiring layer 4 is a dielectric (eg, a photosensitive resin such as silicon oxide (SiOx) and photosensitive epoxy) to a conductor (eg, aluminum, copper, titanium, nickel, gold) metal, etc.) may be one in which wiring is formed, but is not limited thereto.

As the sealing material 6, epoxy-type resin, silicone-type resin, etc. can be used, for example. In one embodiment, the sealing material 6 is not formed for every element 5, but is sealing all the several element 5 mounted in the wiring layer 4 integrally.

[Support (1)]

In one embodiment, the support body 1 just needs to have the intensity|strength required in order to prevent the breakage or deformation|transformation of each component of the sealing body 7 at the time of formation of the sealing body 7 . Moreover, what is necessary is just to transmit the light for changing the quality of the separation layer 2 .

As a material of the support body 1, although glass, silicone, an acrylic resin etc. can be used, for example, it is not limited to these. As a shape of the support body 1, although a circular plate-shaped thing can be used, for example, it is not limited to this.

[Adhesive Layer (3)]

In one embodiment, the adhesive layer 3 is used in order to fix the sealing body 7 on the support body 1, and in order to protect the separation layer 2, it is used.

The thickness of the adhesive layer 3 may be appropriately set according to the type of the support 1 and the sealing body 7, the treatment performed in the sealing body forming step, etc., but it is preferably in the range of 10 to 150 µm, and 15 to It is more preferable to exist in the range of 100 micrometers.

As the adhesive for forming the adhesive layer 3, for example, various adhesives known in the art such as acrylic, novolac, naphthoquinone, hydrocarbon, polyimide, elastomer, polysulfone, etc. can be used. .

The resin contained in the adhesive, that is, the resin contained in the adhesive layer 3 may be any having adhesive properties, for example, hydrocarbon resins, acrylic-styrene resins, maleimide resins, elastomer resins, and polysulfone resins. A phone-based resin or the like or a combination thereof can be used more preferably. Hereinafter, the composition of the resin which the contact bonding layer 3 contains is demonstrated.

(hydrocarbon resin)

A hydrocarbon resin is a resin which has a hydrocarbon backbone and is formed by superposing|polymerizing a monomer composition. As the hydrocarbon resin, a cycloolefin-based polymer (hereinafter, sometimes referred to as “resin (A)”), and at least one resin selected from the group consisting of terpene resins, rosin-based resins, and petroleum resins (hereinafter, “ Resin (B)") etc. are mentioned, but it is not limited to this.

Resin (A) may be resin formed by superposing|polymerizing the monomer component containing a cycloolefin type monomer. Specific examples thereof include a ring-opened (co)polymer of a monomer component containing a cycloolefin-based monomer, and a resin obtained by addition (co)polymerization of a monomer component containing a cycloolefin-based monomer.

As said cycloolefin type monomer contained in the monomer component which comprises resin (A), For example, bicyclic bodies, such as norbornene and norbornadiene, dicyclopentadiene, hydroxydicyclopentadiene, etc. of a tricyclic compound, a tetracyclic compound such as tetracyclododecene, a pentacyclic compound such as cyclopentadiene trimer, etc.) a substituent, an alkenyl (vinyl, etc.) substituent, an alkylidene (ethylidene, etc.) substituent, an aryl (phenyl, tolyl, naphthyl, etc.) substituent, etc. are mentioned. Among these, a norbornene-based monomer selected from the group consisting of norbornene, tetracyclododecene, or an alkyl substituent thereof is particularly preferable.

The monomer component which comprises resin (A) may contain the other monomer copolymerizable with the cycloolefin type monomer mentioned above, and it is preferable to contain an alkene monomer, for example. As an alkene monomer, ethylene, propylene, 1-butene, isobutene, 1-hexene, alpha-olefin etc. are mentioned, for example. The alkene monomer may be linear or branched.

Moreover, it is preferable from a viewpoint of high heat resistance (low thermal decomposition, thermal weight reduction property) to contain a cycloolefin monomer as a monomer component which comprises resin (A). It is preferable that it is 5 mol% or more, and, as for the ratio of the cycloolefin monomer with respect to the whole monomer component which comprises resin (A), it is more preferable that it is 10 mol% or more, It is still more preferable that it is 20 mol% or more. In addition, the ratio of the cycloolefin monomer to the entire monomer component constituting the resin (A) is not particularly limited, but is preferably 80 mol% or less, and 70 mol% or less from the viewpoint of solubility and stability with time in solution. more preferably.

Moreover, you may contain a linear or branched alkene monomer as a monomer component which comprises resin (A). The ratio of the alkene monomer to the entire monomer component constituting the resin (A) is preferably from 10 to 90 mol%, more preferably from 20 to 85 mol%, and from 30 to 80 mol% from the viewpoint of solubility and flexibility. It is more preferable that

In addition, the resin (A) is, for example, a resin that does not have a polar group, such as a resin formed by polymerizing a monomer component consisting of a cycloolefin-based monomer and an alkene monomer, in order to suppress the generation of gas under high temperature. it is preferable to have

There is no restriction|limiting in particular about the polymerization method, polymerization conditions, etc. at the time of superposing|polymerizing a monomer component, What is necessary is just to set suitably according to a conventional method.

For example, a cycloolefin copolymer which is a copolymer of a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2) can be used as the resin (A) as an adhesive component.

[Formula 1]

(In formula (2), n is 0 or an integer of 1-3.)

As such a cycloolefin copolymer, APL 8008T, APL 8009T, APL 6013T (all manufactured by Mitsui Chemicals Co., Ltd.), etc. can be used.

In addition, as a commercial item which can be used as resin (A), For example, "TOPAS" manufactured by Polyplastics Co., Ltd., "APEL" manufactured by Mitsui Chemicals Co., Ltd., "ZEONOR" and "ZEONEX" manufactured by Nippon Zeon Corporation, JSR "ARTON" manufactured by a corporation, etc. are mentioned.

It is preferable that it is 60 degreeC or more, and, as for the glass transition temperature (Tg) of resin (A), it is especially preferable that it is 70 degreeC or more. When the glass transition temperature of resin (A) is 60 degreeC or more and it exposes to a high-temperature environment, softening of the contact bonding layer 3 can be suppressed further.

Resin (B) is at least 1 sort(s) of resin chosen from the group which consists of a terpene type resin, a rosin type resin, and a petroleum resin. Specific examples of the terpene-based resin include a terpene resin, a terpene phenol resin, a modified terpene resin, a hydrogenated terpene resin, and a hydrogenated terpene phenol resin. Examples of the rosin-based resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. As a petroleum resin, an aliphatic or aromatic petroleum resin, hydrogenated petroleum resin, modified petroleum resin, an alicyclic petroleum resin, a coumarone indene petroleum resin, etc. are mentioned, for example. Among these, hydrogenated terpene resin and hydrogenated petroleum resin are more preferable.

Although the softening point in particular of resin (B) is not limited, It is preferable that it is 80-160 degreeC. When the softening point of resin (B) is 80-160 degreeC, when exposed to a high-temperature environment, it can suppress that it softens, and adhesive failure does not arise.

Although the weight average molecular weight of resin (B) is not specifically limited, It is preferable that it is 300-3,000. When the weight average molecular weight of resin (B) is 300 or more, heat resistance becomes a sufficient thing, and degassing amount decreases in a high temperature environment. On the other hand, when the weight average molecular weight of resin (B) is 3,000 or less, the dissolution rate of the contact bonding layer 3 with respect to a hydrocarbon type solvent becomes favorable. For this reason, the residue of the adhesive layer 3 on the sealing body 7 after isolate|separating the support body 1 can be melt|dissolved quickly and can be removed. In addition, the weight average molecular weight of resin (B) in this embodiment means the molecular weight of polystyrene conversion measured by gel permeation chromatography (GPC).

Moreover, you may use what mixed resin (A) and resin (B) as resin. By mixing, heat resistance becomes favorable. For example, as a mixing ratio of the resin (A) and the resin (B), (A): (B) = 80: 20 to 55: 45 (mass ratio), heat resistance in a high-temperature environment, and flexibility It is preferable because it is excellent.

(Acrylic-Styrenic Resin)

Examples of the acrylic-styrene-based resin include styrene or a styrene derivative and a resin obtained by polymerization using (meth)acrylic acid ester or the like as a monomer.

As (meth)acrylic acid ester, (meth)acrylic acid alkylester which consists of a chain structure, (meth)acrylic acid ester which has an aliphatic ring, and (meth)acrylic acid ester which has an aromatic ring is mentioned, for example. Examples of the (meth)acrylic acid alkyl ester having a chain structure include an acrylic long-chain alkyl ester having an alkyl group having 15 to 20 carbon atoms, an acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms, and the like. As the acrylic long-chain alkyl ester, acrylic acid or methacrylic acid in which the alkyl group is n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-eicosyl group, etc. of alkyl esters. In addition, the said alkyl group may be branched chain form.

As acryl-type alkylester which has a C1-C14 alkyl group, the well-known acryl-type alkylester used for the existing acryl-type adhesive agent is mentioned. For example, an alkyl group, acrylic acid or meta consisting of a methyl group, an ethyl group, a propyl group, a butyl group, a 2-ethylhexyl group, an isooctyl group, an isononyl group, an isodecyl group, a dodecyl group, a lauryl group, a tridecyl group, etc. and alkyl esters of acrylic acid.

As (meth)acrylic acid ester having an aliphatic ring, cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, norbornyl (meth)acrylate, isobor Although nyl (meth)acrylate, tricyclodecanyl (meth)acrylate, tetracyclododecanyl (meth)acrylate, dicyclopentanyl (meth)acrylate, etc. are mentioned, Isobornyl methacrylate, dicy Clofentanyl (meth)acrylate is more preferable.

Although it does not specifically limit as (meth)acrylic acid ester which has an aromatic ring, As an aromatic ring, For example, a phenyl group, a benzyl group, a tolyl group, a xylyl group, a biphenyl group, a naphthyl group, anthracenyl group, a phenoxymethyl group , a phenoxyethyl group, and the like. Moreover, the aromatic ring may have a C1-C5 linear or branched alkyl group. Specifically, phenoxyethyl acrylate is preferable.

(Maleimide-based resin)

Examples of the maleimide-based resin include N-methylmaleimide, N-ethylmaleimide, N-n-propylmaleimide, N-isopropylmaleimide, N-n-butylmaleimide, and N-isobutylmaleimide as monomers. Mead, N-sec-butylmaleimide, N-tert-butylmaleimide, N-n-pentylmaleimide, N-n-hexylmaleimide, N-n-heptylmaleimide, N-n-octylmaleimide, N-laurylmaleimide, N -maleimide having an alkyl group such as stearylmaleimide, N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N- A resin obtained by polymerizing an aromatic maleimide having an aryl group, such as maleimide having an aliphatic hydrocarbon group such as cyclooctylmaleimide, N-phenylmaleimide, N-m-methylphenylmaleimide, N-o-methylphenylmaleimide, and N-p-methylphenylmaleimide can be heard

(elastomer)

It is preferable that the elastomer contains a styrene unit as a structural unit of a principal chain, and the said "styrene unit" may have a substituent. As a substituent, a C1-C5 alkyl group, a C1-C5 alkoxy group, a C1-C5 alkoxyalkyl group, an acetoxy group, a carboxyl group, etc. are mentioned, for example. Moreover, it is more preferable that content of the said styrene unit exists in the range of 14 weight% or more and 50 weight% or less. Moreover, it is preferable that a weight average molecular weight exists in the range of 10,000 or more and 200,000 or less of an elastomer.

When the content of the styrene unit is in the range of 14 wt% or more and 50 wt% or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, it is easily dissolved in the hydrocarbon solvent described later, so that it is easier In addition, the adhesive layer 3 can be removed quickly. In addition, when the content of the styrene unit and the weight average molecular weight are within the above ranges, excellent resistance to resist solvents (eg, PGMEA, PGME, etc.), acids (hydrofluoric acid, etc.), alkalis (TMAH, etc.) used in resist lithography. to perform

In addition, you may further mix the above-mentioned (meth)acrylic acid ester with an elastomer.

Content of a styrene unit becomes like this. More preferably, it is 17 weight% or more, More preferably, it is 40 weight% or less.

The more preferable range of the weight average molecular weight is 20,000 or more, and the more preferable range is 150,000 or less.

As the elastomer, various elastomers can be used as long as the content of the styrene unit is in the range of 14 wt% or more and 50 wt% or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less. For example, polystyrene-poly(ethylene/propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer (SBS), styrene-butadiene-butylene- Styrene block copolymer (SBBS), and their hydrogenated products, styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), a styrene-ethylene-ethylene-propylene-styrene block copolymer (SEEPS), a styrene-ethylene-ethylene-propylene-styrene block copolymer in which the styrene block is a reactive crosslinking type (SeptonV9461 (manufactured by Kuraray Co., Ltd.), SeptonV9475 (Co.) (manufactured by Kuraray)), a styrene-ethylene-butylene-styrene block copolymer in which the styrene block is a reactive crosslinking type (Septon V9827 (manufactured by Kuraray Co., Ltd.) having a reactive polystyrene-based hard block), polystyrene-poly (ethylene-ethylene/ propylene) block-polystyrene block copolymer (SEEPS-OH: terminal hydroxyl group modification), etc. are mentioned, Content and weight average molecular weight of the styrene unit of an elastomer in the above-mentioned range can be used.

Moreover, a hydrogenated substance is more preferable also in an elastomer. If it is a hydrogenated substance, the stability with respect to heat|fever improves, and deterioration, such as decomposition and polymerization, does not generate|occur|produce easily. Moreover, it is more preferable also from a viewpoint of the solubility with respect to the hydrocarbon type solvent, and the tolerance with respect to a resist solvent.

Moreover, it is more preferable that both ends are block polymers of styrene among an elastomer. This is because higher heat resistance is exhibited by blocking styrene having high thermal stability at both ends.

More specifically, the elastomer is more preferably a hydrogenated product of a block copolymer of styrene and a conjugated diene. The stability to heat is improved, and deterioration such as decomposition or polymerization is less likely to occur. In addition, higher heat resistance is exhibited by blocking styrene with high thermal stability at both ends. Moreover, it is more preferable also from a viewpoint of the solubility with respect to the hydrocarbon type solvent, and the tolerance with respect to a resist solvent.

Commercially available products that can be used as an elastomer contained in the adhesive constituting the adhesive layer 3 include, for example, “Septon (trade name)” manufactured by Kuraray Co., Ltd., “Hybra (trade name)” manufactured by Kuraray Co., Ltd., Asahi Chemical Co., Ltd. "Toughtech (trade name)" manufactured by K.K., "Dynaron (brand name)" manufactured by JSR Corporation, etc. are mentioned.

As the content of the elastomer contained in the adhesive constituting the adhesive layer 3, for example, the total amount of the adhesive composition is 100 parts by weight, preferably in the range of 50 parts by weight or more and 99 parts by weight or less, and 60 parts by weight or more , more preferably in the range of 99 parts by weight or less, and most preferably in the range of 70 parts by weight or more and 95 parts by weight or less. By setting it in these ranges, the sealing body 7 can be suitably fixed to the support body 1, maintaining heat resistance.

In addition, an elastomer may mix several types. In other words, the adhesive constituting the adhesive layer 3 may contain a plurality of types of elastomers. In addition, at least one of a plurality of types of elastomers may contain a styrene unit as a structural unit of the main chain. In addition, if at least one of the plurality of types of elastomers has a styrene unit content in a range of 14 wt% or more and 50 wt% or less, or a weight average molecular weight within a range of 10,000 or more and 200,000 or less, the scope of the present invention am. In addition, in the adhesive agent which comprises the contact bonding layer 3 WHEREIN: When several types of elastomers are included, as a result of mixing, you may adjust so that content of a styrene unit may become in the said range. For example, when Septon4033 manufactured by Kuraray Co., Ltd. (trade name) having a styrene unit content of 30% by weight and Septon2063 manufactured by Septon (trade name) having a styrene unit content of 13% by weight are mixed in a weight ratio of 1:1, The styrene content with respect to the whole elastomer contained in an adhesive agent becomes 21 to 22 weight%, and therefore becomes 14 weight% or more. In addition, for example, when a styrene unit of 10 weight% and a thing of 60 weight% are mixed in a weight ratio of 1:1, it will be 35 weight%, and it will be in the said range. The present invention may have such a form. In addition, it is most preferable that the plurality of types of elastomers contained in the adhesive constituting the adhesive layer 3 all contain a styrene unit within the above range and have a weight average molecular weight within the above range.

Moreover, it is preferable to form the adhesive layer 3 using resin other than a photocurable resin (for example, UV curable resin). By using resin other than photocurable resin, it can prevent that a residue generate|occur|produces in the periphery of the minute unevenness|corrugation of the sealing body 7 after peeling or removal of the adhesive layer 3 . In particular, the adhesive constituting the adhesive layer 3 is preferably not dissolved in all solvents, but preferably dissolved in a specific solvent. This is because it is removable by dissolving the contact bonding layer 3 in a solvent, without applying a physical force to the sealing body 7 . Removal of the adhesive layer 3 WHEREIN: Even from the sealing body 7 with low intensity|strength, the adhesive layer 3 can be easily removed without damaging or deforming the sealing body 7 .

(Polysulfone-based resin)

The adhesive for forming the adhesive layer 3 may contain the polysulfone-type resin. By forming the adhesive layer 3 with a polysulfone-based resin, even if a high-temperature treatment is performed in the sealing body forming step, the adhesive layer 3 is dissolved in the subsequent step, and the sealing body 7 is removed from the support body (1) can be peeled off. When the adhesive layer 3 contains the polysulfone resin, in the sealing body forming step, for example, a high-temperature process treated at a high temperature of 300°C or higher can be used.

Polysulfone-type resin has a structure which consists of at least 1 type of structural unit among the structural unit represented by the following general formula (3), and the structural unit represented by the following general formula (4).

[Formula 2]

(Here, R ¹ , R ² and R ³ in the general formula (3), and R ¹ and R ² in the general formula (4) are each independently selected from the group consisting of a phenylene group, a naphthylene group, and an anthrylene group and X' is an alkylene group having 1 or more and 3 or less carbon atoms.)

The polysulfone-based resin includes at least one of the polysulfone structural unit represented by the formula (3) and the polyethersulfone structural unit represented by the formula (4) on the support body 1 and the separation layer 2 After forming the adhesive layer 3 in a sealing body formation process, even if it processes under high temperature conditions, it can prevent that the adhesive layer 3 is insolubilized by decomposition|disassembly, superposition|polymerization, etc. In addition, as long as the polysulfone-based resin is a polysulfone resin composed of the polysulfone structural unit represented by the formula (3), it is stable even when heated to a higher temperature. For this reason, it can prevent that the residue resulting from the adhesive layer 3 generate|occur|produces in the sealing body 7 after washing|cleaning.

It is preferable to exist in the range of 30,000 or more and 70,000 or less, and, as for the weight average molecular weight (Mw) of polysulfone-type resin, it is more preferable to exist in the range of 30,000 or more and 50,000 or less. If the weight average molecular weight (Mw) of the polysulfone-based resin is in the range of 30,000 or more, for example, an adhesive composition that can be used at a high temperature of 300°C or more can be obtained. Moreover, if the weight average molecular weight (Mw) of polysulfone-type resin is in the range of 70,000 or less, it can melt|dissolve suitably with a solvent. That is, the adhesive composition which can be preferably removed with a solvent can be obtained.

(dilution solvent)

Examples of the diluting solvent used when forming the adhesive layer 3 include linear hydrocarbons such as hexane, heptane, octane, nonane, isononane, methyloctane, decane, undecane, dodecane, and tridecane. , branched hydrocarbons having 4 to 15 carbon atoms, for example, cyclic hydrocarbons such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, tetrahydronaphthalene, p-mentane, o-mentane, m- Menthane, diphenylmentane, 1,4-terpine, 1,8-terpine, bornan, norbornane, finan, tuyan, karan, longipollen, geraniol, nerol, linalool, citral, sheet Lonerol, menthol, isomenthol, neomenthol, α-terpineol, β-terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydroterpinyl acetate, 1 terpene solvents such as 4-cineol, 1,8-cineol, borneol, carbonone, yonone, tuyon, camphor, d-limonene, 1-limonene and dipentene; lactones such as γ-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isopentyl ketone, and 2-heptanone; polyhydric alcohols such as ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol; A compound having an ester bond, such as ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, or dipropylene glycol monoacetate, monomethyl ether, monoethyl ether of the polyhydric alcohol or compound having an ester bond, Derivatives of polyhydric alcohols such as compounds having ether bonds such as monoalkyl ethers such as monopropyl ether and monobutyl ether, or monophenyl ether (among these, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME) is preferable); Cyclic ethers such as dioxane, esters such as methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, and ethyl ethoxypropionate Ryu ; Aromatic organic solvents, such as anisole, ethyl benzyl ether, crezyl methyl ether, diphenyl ether, dibenzyl ether, phenetol, and butylphenyl ether, etc. are mentioned.

(Other ingredients)

The adhesive constituting the adhesive layer 3 may further contain other miscible substances as long as the essential properties are not impaired. For example, various commonly used additives such as additional resins, plasticizers, adhesion aids, stabilizers, colorants, thermal polymerization inhibitors and surfactants for improving the performance of the adhesive may be additionally used.

[Separation layer (2)]

As mentioned above, the separation layer 2 is changed in quality by irradiating light. In one embodiment, the support body 1 can be isolate|separated from the sealing body 7 by irradiating light to the separation layer 2 through the support body 1 and changing the quality of the separation layer 2 .

The thickness of the separation layer 2 is, for example, more preferably in the range of 0.05 µm or more and 50 µm or less, and still more preferably in the range of 0.3 µm or more and 1 µm or less. When the thickness of the separation layer 2 falls within the range of 0.05 µm or more and 50 µm or less, desired alteration can be generated in the separation layer 2 by short-time light irradiation and low-energy light irradiation. Moreover, it is especially preferable that the thickness of the separation layer 2 falls within the range of 1 micrometer or less from a viewpoint of productivity.

In addition, another layer may be further formed between the separation layer 2 and the support body 1 . In this case, the other layer may be made of a material that transmits light. Thereby, the layer which has a preferable property etc. can be added suitably, without preventing the incidence of light to the separation layer 2 . The wavelength of the light that can be used differs according to the kind of material constituting the separation layer 2 . Therefore, the material constituting the other layer does not need to transmit all the light, and can be appropriately selected from materials capable of transmitting light having a wavelength that can alter the material constituting the separation layer 2 .

In addition, although it is preferable that the separation layer 2 is formed only from the material which has a structure which absorbs light, in the range which does not impair the essential characteristic in this invention, WHEREIN: It does not have a structure which absorbs light. A material may be added to form the separation layer 2 . In addition, it is preferable that the surface of the separation layer 2 on the side opposite to the adhesive layer 3 is flat (no irregularities are formed), whereby the separation layer 2 can be easily formed. Moreover, also in pasting, it becomes possible to stick uniformly.

(fluorocarbon)

The separation layer 2 may consist of fluorocarbon. When the separation layer 2 is constituted of fluorocarbon, it changes in quality by absorbing light, and as a result, the strength or adhesiveness before being irradiated with light is lost. Therefore, by applying a slight external force (for example, lifting the support body 1, etc.), the separation layer 2 is destroyed, and the support body 1 and the sealing body 7 can be easily separated. . The fluorocarbon constituting the separation layer 2 can be preferably formed by plasma CVD (chemical vapor deposition) method.

Fluorocarbon absorbs light having an intrinsic range of wavelengths depending on its type. By irradiating the separation layer 2 with light having a wavelength in the range that the fluorocarbon used for the separation layer 2 absorbs, the fluorocarbon can be suitably altered. Moreover, it is preferable that the light absorptivity in the separation layer 2 is 80 % or more.

The light irradiated to the separation layer 2 is, for example, a solid laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, a dye, depending on a wavelength that fluorocarbon can absorb. Liquid lasers such as lasers, CO ₂ lasers, excimer lasers, gas lasers such as Ar lasers and He-Ne lasers, laser light such as semiconductor lasers and free electron lasers, or non-laser light may be appropriately used. Although it is not limited to this as a wavelength which can change a fluorocarbon, For example, the thing of the range of 600 nm or less can be used.

(A polymer containing a structure having light absorption in its repeating unit)

The separation layer 2 may contain the polymer which contains the structure which has light absorption in the repeating unit. The polymer changes in quality when irradiated with light. The deterioration of the polymer occurs when the structure absorbs the irradiated light. The separation layer 2 lost the intensity|strength or adhesiveness before receiving irradiation of light as a result of the quality change of a polymer. Therefore, by applying a slight external force (for example, lifting the support plate 2, etc.), the separation layer 2 is destroyed, so that the support 1 and the encapsulant 7 can be easily separated. there is.

The structure having light absorption is a chemical structure that absorbs light and alters the polymer including the structure as a repeating unit. The structure is, for example, an atomic group containing a conjugated π-electron system composed of a substituted or unsubstituted benzene ring, a condensed ring, or a heterocyclic ring. More specifically, the structure is a cardo structure, or a benzophenone structure, a diphenylsulfoxide structure, a diphenylsulfone structure (bisphenylsulfone structure), a diphenyl structure, or a diphenylamine present in the side chain of the polymer. can be a structure.

When the said structure exists in the side chain of the said polymer, the structure can be represented by the following formula.

[Formula 3]

(Wherein, R is each independently an alkyl group, an aryl group, a halogen, a hydroxyl group, a ketone group, a sulfoxide group, a sulfone group, or N(R ⁴ )(R ⁵ ), wherein R ⁴ and R ⁵ are each independently , a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), Z is absent or -CO-, -SO ₂ -, -SO- or -NH-, and n is 0 or an integer of 1 to 5 .)

In addition, the said polymer contains, for example, the repeating unit represented by any of (a)-(d) in the following formula, It is represented by (e), or the structure of (f) is its included in the main chain.

[Formula 4]

(Wherein, l is an integer of 1 or more, m is 0 or an integer of 1 to 2, X is any of the formulas shown in the above "Formula 3" in (a) to (e), (f) In any of the formulas shown in "Formula 3" above, or not present, Y ₁ and Y ₂ are each independently -CO- or SO ₂ -. l is preferably an integer of 10 or less .)

Examples of the benzene ring, condensed ring and heterocyclic ring represented by the above "Formula 3" include phenyl, substituted phenyl, benzyl, substituted benzyl, naphthalene, substituted naphthalene, anthracene, substituted anthracene, anthraquinone, substituted anthraquinone, acridine , substituted acridine, azobenzene, substituted azobenzene, fluorine, substituted fluorine, fluorimone, substituted fluorimone, carbazole, substituted carbazole, N-alkylcarbazole, dibenzofuran, substituted dibenzofuran, phenane threne, substituted phenanthrene, pyrene, and substituted pyrene. When the exemplified substituent further has a substituent, the substituent is, for example, alkyl, aryl, halogen atom, alkoxy, nitro, aldehyde, cyano, amide, dialkylamino, sulfonamide, imide, carboxyl. acid, carboxylic acid ester, sulfonic acid, sulfonic acid ester, alkylamino and arylamino.

As a fifth substituent having two phenyl groups among the substituents shown in "Formula 3" above, when Z is -SO ₂ -, examples of the case include bis(2,4-dihydroxyphenyl)sulfone, bis( 3,4-dihydroxyphenyl)sulfone, bis(3,5-dihydroxyphenyl)sulfone, bis(3,6-dihydroxyphenyl)sulfone, bis(4-hydroxyphenyl)sulfone, bis(3 -hydroxyphenyl)sulfone, bis(2-hydroxyphenyl)sulfone, bis(3,5-dimethyl-4-hydroxyphenyl)sulfone, etc. are mentioned.

As a fifth substituent having two phenyl groups among the substituents shown in the above "Formula 3", when Z is -SO-, examples of the case include bis(2,3-dihydroxyphenyl)sulfoxide, bis( 5-Chloro-2,3-dihydroxyphenyl)sulfoxide, bis(2,4-dihydroxyphenyl)sulfoxide, bis(2,4-dihydroxy-6-methylphenyl)sulfoxide, bis(5 -Chloro-2,4-dihydroxyphenyl) sulfoxide, bis (2,5-dihydroxyphenyl) sulfoxide, bis (3,4-dihydroxyphenyl) sulfoxide, bis (3,5-di Hydroxyphenyl)sulfoxide, bis(2,3,4-trihydroxyphenyl)sulfoxide, bis(2,3,4-trihydroxy-6-methylphenyl)-sulfoxide, bis(5-chloro-2 ,3,4-trihydroxyphenyl)sulfoxide, bis(2,4,6-trihydroxyphenyl)sulfoxide, bis(5-chloro-2,4,6-trihydroxyphenyl)sulfoxide, etc. can be heard

As a fifth substituent having two phenyl groups among the substituents shown in the above "Formula 3", when Z is -C(=O)-, 2,4-dihydroxybenzophenone, 2, 3,4-trihydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2,2',5,6'-tetrahydroxybenzophenone, 2-hydroxy-4-methyl Toxybenzophenone, 2-hydroxy-4-octocybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,6-di Hydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-amino-2'-hydroxybenzophenone, 4-dimethylamino-2'-hydr Roxybenzophenone, 4-diethylamino-2'-hydroxybenzophenone, 4-dimethylamino-4'-methoxy-2'-hydroxybenzophenone, 4-dimethylamino-2',4'-dihydr and hydroxybenzophenone and 4-dimethylamino-3',4'-dihydroxybenzophenone.

When the said structure exists in the side chain of the said polymer, the ratio which occupies for the said polymer of the repeating unit containing the said structure is the range in which the light transmittance of the separation layer 2 is 0.001 % or more and 10 % or less. is within When the polymer is prepared so that the ratio falls within such a range, the separation layer 2 sufficiently absorbs light, so that it can be changed reliably and quickly. That is, the removal of the support body 1 from the sealing body 7 is easy, and the irradiation time of the light required for the removal can be shortened.

The structure can absorb light having a wavelength in a desired range by selecting the type thereof. For example, as for the wavelength of the light which the said structure can absorb, it is more preferable that it exists in the range of 100 nm or more and 2,000 nm or less. In this range, the wavelength of the light which the said structure can absorb is a shorter wavelength side, for example, exists in the range of 100 nm or more and 500 nm or less. For example, the structure preferably absorbs ultraviolet light having a wavelength within the range of about 300 nm or more and 370 nm or less, so that the polymer including the structure can be altered.

The light that can be absorbed by the above structure is, for example, a high-pressure mercury lamp (wavelength: 254 nm or more, 436 nm or less), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157 nm), XeCl laser (wavelength: 308 nm), XeF laser (wavelength: 351 nm) or solid UV laser (wavelength: 355 nm), or g-rays (wavelength: 436 nm), h line (wavelength: 405 nm) or i-line (wavelength: 365 nm) or the like.

Although the separation layer 2 mentioned above contains the polymer which contains the said structure as a repeating unit, the separation layer 2 can contain components other than the said polymer further. As the component, a filler, a plasticizer, and the component etc. which can improve the peelability of the support plate 2 are mentioned. These components are appropriately selected from conventionally known substances or materials that do not interfere with or promote the absorption of light by the structure and the deterioration of the polymer.

(inorganic)

The separation layer 2 may consist of an inorganic substance. The separation layer 2 is comprised by an inorganic substance, and it changes in quality by absorbing light, As a result, the intensity|strength before receiving irradiation of light or adhesiveness is lost. Therefore, by applying a slight external force (for example, lifting the support body 1, etc.), the separation layer 2 is destroyed, and the support body 1 and the sealing body 7 can be easily separated. .

The inorganic substance may have any configuration that is altered by absorbing light, and for example, one or more kinds of inorganic substances selected from the group consisting of metals, metal compounds, and carbon can be preferably used. The metal compound refers to a compound containing a metal atom, and may be, for example, a metal oxide or a metal nitride. Examples of such inorganic materials include, but are not limited to, gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon selected from the group consisting of One or more types of inorganic substances used can be mentioned. In addition, carbon is a concept that may include an allotrope of carbon, and may be, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, or the like.

The inorganic material absorbs light having an intrinsic wavelength range according to its type. By irradiating the separation layer 2 with light having a wavelength in the range that the inorganic substance used for the separation layer 2 absorbs, the inorganic substance can be suitably altered.

The light irradiated to the separation layer 2 made of an inorganic material is, for example, a solid laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, depending on the wavelength at which the inorganic material can be absorbed. , a liquid laser such as a dye laser, a CO ₂ laser, an excimer laser, an Ar laser, a gas laser such as a He-Ne laser, laser light such as a semiconductor laser, a free electron laser, or a non-laser light may be appropriately used.

The separation layer 2 made of an inorganic material can be formed on the support plate 2 by a known technique such as, for example, sputtering, chemical vapor deposition (CVD), plating, plasma CVD, or spin coating. The thickness of the separation layer 2 made of an inorganic material is not particularly limited, and may be a film thickness capable of sufficiently absorbing the light to be used. desirable. Moreover, you may apply an adhesive agent to the both surfaces or single side|surface of the inorganic film (for example, a metal film) which consists of an inorganic substance which comprises the separation layer 2 in advance, and stick to the support body 1 .

In addition, when a metal film is used as the separation layer 2, depending on conditions such as the film quality of the separation layer 2, the type of laser light source, laser output, etc., laser reflection or charging to the film may occur. . Therefore, it is preferable to provide countermeasures against them by forming an antireflection film or an antistatic film on the upper and lower sides of the separation layer 2 or either one.

(Compound having an infrared absorptive structure)

The separation layer 2 may be formed of a compound having an infrared absorptive structure. The compound changes in quality by absorbing infrared rays. The separation layer 2 lost the strength or adhesiveness before being irradiated with infrared rays as a result of deterioration of the compound. Therefore, by applying a slight external force (for example, lifting the support body 1, etc.), the separation layer 2 is destroyed, and the support body 1 and the sealing body 7 can be easily separated. .

As a compound containing a structure having infrared absorption property or a structure having infrared absorption property, for example, alkane, alkene (vinyl, trans, cis, vinylidene, trisubstituted, tetrasubstituted, conjugated, cumulene, ring type), alkynes (monosubstituted, disubstituted), monocyclic aromatics (benzene, monosubstituted, disubstituted, trisubstituted), alcohols and phenols (free OH, intramolecular hydrogen bonding, intermolecular hydrogen bonding, saturated secondary, saturated tertiary, unsaturated secondary, unsaturated tertiary), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxylan ring ether, peroxide ether, ketone, dialkylcarbonyl, aromatic carbonyl, 1,3- Diketone enol, o-hydroxyaryl ketone, dialkylaldehyde, aromatic aldehyde, carboxylic acid (dimer, carboxylic acid anion), formic acid ester, acetate ester, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic acid chlorides, aromatic acid chlorides, acid anhydrides (conjugated, non-conjugated, cyclic, acyclic), primary amides, secondary amides, lactams, primary amines (aliphatic, aromatic), secondary amine (aliphatic, aromatic), tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, Aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic isonitrile, isocyanic acid ester, thiocyanate, aliphatic isothiocyanate, aromatic isothiocyanate, aliphatic nitro compound, aromatic nitro compound, nitroamine; Nitrosoamine, nitrate ester, nitrite ester, nitroso bond (aliphatic, aromatic, monomer, dimer), mercaptan, sulfur compounds such as thiophenol and thiolic acid, thiocarbonyl group, sulfoxide, sulfone, sulfonyl chloride, Primary sulfonamide, secondary sulfonamide, sulfuric ester, carbon-halogen bond, Si-A ¹ bond (A ¹ is, H, C, O or halogen), PA ² bond (A ² is, H, C or O) , or a Ti—O bond.

As a structure including the carbon-halogen bond, for example, -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=CF ₂ , aryl fluoride, and aryl chloride.

As a structure including the Si-A ¹ bond, SiH, SiH ₂ , SiH ₃ , Si-CH ₃ , Si-CH ₂ -, Si-C ₆ H ₅ , SiO-aliphatic, Si-OCH ₃ , Si- OCH ₂ CH ₃ , Si-OC ₆ H ₅ , Si-O-Si, Si-OH, SiF, SiF ₂ , and SiF ₃ , and the like. As a structure containing a Si-A ¹ bond, it is preferable to form especially siloxane skeleton and silsesquioxane skeleton.

As a structure including the PA ² bond, PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , A ³ ₃ -PO (A ³ is aliphatic or aromatic), (A ⁴ O ) ₃ -PO (A ⁴ is alkyl), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH, and O=P-OH.

The structure can absorb infrared rays having a wavelength in a desired range, depending on the type of the structure. Specifically, the wavelength of the infrared rays that the structure can absorb is, for example, in the range of 1 µm or more and 20 µm or less, and can more preferably absorb it in the range of 2 µm or more and 15 µm or less. In addition, when the structure is a Si-O bond, a Si-C bond, and a Ti-O bond, it may be in the range of 9 μm or more and 11 μm or less. In addition, the wavelength of infrared rays capable of absorbing each structure can be easily understood by those skilled in the art. For example, as an absorption band in each structure, Non-Patent Literature: SILVERSTEIN · BASSLER · MORRILL "Identification method by spectrum of organic compounds (5th edition) - Combination of MS, IR, NMR, UV -" (1992) (published in year) pages 146 to 151 can be referred to.

As the compound having an infrared absorptive structure used in the formation of the separation layer 2, among the compounds having a structure as described above, it can be dissolved in a solvent for application and can be solidified to form a high layer If there is, it will not specifically limit. However, in order to effectively modify the compound in the separation layer 2 and to facilitate separation of the support 1 and the encapsulant 7, the absorption of infrared rays in the separation layer 2 is large, that is, , it is preferable that the infrared transmittance when infrared rays are irradiated to the separation layer 2 is low. Specifically, it is preferable that the infrared transmittance in the separation layer 2 is lower than 90 %, and it is more preferable that the infrared transmittance is lower than 80 %.

As an example, as a compound having a siloxane skeleton, for example, a resin which is a copolymer of a repeating unit represented by the following formula (5) and a repeating unit represented by the following formula (6), or a compound represented by the following formula (5) A resin which is a copolymer of repeating units and repeating units derived from an acrylic compound can be used.

[Formula 5]

(In formula (6), R ⁶ is hydrogen, an alkyl group having 10 or less carbon atoms, or an alkoxy group having 10 or less carbon atoms.)

Among them, as the compound having a siloxane skeleton, t-butylstyrene (TBST)-dimethylsiloxane copolymer, which is a copolymer of a repeating unit represented by the above formula (5) and a repeating unit represented by the following formula (7), is more preferable, A TBST-dimethylsiloxane copolymer comprising the repeating unit represented by the formula (5) and the repeating unit represented by the following formula (7) in a 1:1 ratio is more preferable.

[Formula 6]

As the compound having a silsesquioxane skeleton, for example, a resin that is a copolymer of a repeating unit represented by the following formula (8) and a repeating unit represented by the following formula (9) can be used.

[Formula 7]

(In the formula (8), R ⁷ is hydrogen or an alkyl group having 1 or more and 10 or less carbon atoms, and in the formula (9), R ⁸ is an alkyl group having 1 or more and 10 or less carbon atoms, or a phenyl group.)

As a compound having a silsesquioxane skeleton, in addition, Japanese Patent Application Laid-Open No. 2007-258663 (published on October 4, 2007), Japanese Patent Application Laid-Open No. 2010-120901 (published on June 3, 2010), Each silsesquioxane resin disclosed in Unexamined-Japanese-Patent No. 2009-263316 (published on November 12, 2009) and in Unexamined-Japanese-Patent No. 2009-263596 (published on November 12, 2009) is preferable Available.

Among them, as the compound having a silsesquioxane skeleton, a copolymer of a repeating unit represented by the following formula (10) and a repeating unit represented by the following formula (11) is more preferable, and a repeating unit represented by the following formula (10) and a copolymer comprising a repeating unit represented by the following formula (11) in a ratio of 7:3 is more preferable.

[Formula 8]

Although there may exist a random structure, a ladder structure, and a cage structure as a polymer which has a silsesquioxane skeleton, any structure may be sufficient.

Further, as the compound containing a Ti-O bond, for example, (i) tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetrakis(2-ethylhexyloxy)titanium, and titanium Alkoxy titanium, such as -i- propoxy octylene glycolate; (ii) chelate titanium such as di-i-propoxy/bis(acetylacetonato)titanium and propanedioxytitaniumbis(ethylacetoacetate); (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O-] _n -iC ₃ H ₇ , and nC ₄ H ₉ O-[-Ti(OnC ₄ H ₉ ) ₂ -O- ] titanium polymers such as _n -nC ₄ H ₉ ; (iv) acyl, such as tri-n-butoxytitanium monostearate, titanium stearate, di-i-propoxytitanium diisostearate, and (2-n-butoxycarbonylbenzoyloxy)tributoxytitanium late titanium; (v) water-soluble titanium compounds, such as di-n-butoxy bis(triethanolaminato)titanium, etc. are mentioned.

Among them, as a compound containing a Ti-O bond, di-n-butoxy bis(triethanolaminato)titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH) ₂ ] ₂ ) is preferable.

Although the separation layer 2 mentioned above contains the compound which has an infrared ray absorptive structure, the separation layer 2 can contain components other than the said compound further. As the component, a filler, a plasticizer, and the component etc. which can improve the peelability of the support plate 2 are mentioned. These components are suitably selected from conventionally well-known substances or materials which do not interfere with or accelerate the absorption of infrared rays by the said structure and deterioration of a compound.

(Infrared absorbing material)

The separation layer 2 may contain an infrared absorbing substance. The separation layer 2 is comprised by containing an infrared ray absorbing substance, and it changes in quality by absorbing light, As a result, the intensity|strength before receiving irradiation of light or adhesiveness is lost. Therefore, by applying a slight external force (for example, lifting the support body 1, etc.), the separation layer 2 is destroyed, and the support body 1 and the sealing body 7 can be easily separated. .

What is necessary is just a structure which changes in quality by absorbing infrared rays, for example, carbon black, an iron particle, or an aluminum particle can be used preferably for an infrared ray absorbing substance. The infrared absorbing material absorbs light having a wavelength in an intrinsic range according to its type. By irradiating the separation layer 2 with light having a wavelength in the range that the infrared absorbing substance used for the separating layer 2 absorbs, the infrared absorbing substance can be suitably altered.

(reactive polysilsesquioxane)

The separation layer 2 can be formed by polymerizing reactive polysilsesquioxane, whereby the separation layer 2 has high chemical resistance and high heat resistance.

In this specification, reactive polysilsesquioxane is polysilsesquioxane which has a silanol group at the terminal of polysilsesquioxane skeleton, or a functional group which can form a silanol group by hydrolysis, The said silanol group Alternatively, by condensing a functional group capable of forming a silanol group, they can be polymerized with each other. In addition, if the reactive polysilsesquioxane has a silanol group or a functional group capable of forming a silanol group, one having a silsesquioxane skeleton such as a random structure, a cage structure, or a ladder structure may be employed. can

Moreover, it is more preferable that reactive polysilsesquioxane has a structure shown to following formula (12).

[Formula 9]

In formula (12), R" is each independently selected from the group consisting of hydrogen and an alkyl group having 1 or more and 10 or less carbon atoms, and more preferably selected from the group consisting of hydrogen and an alkyl group having 1 or more and 5 or less carbon atoms. When R" is hydrogen or an alkyl group having 1 or more and 10 or less carbon atoms, the reactive polysilsesquioxane represented by the formula (12) is preferably condensed by heating in the separation layer 2 forming step. can

In formula (12), it is preferable that p is an integer of 1 or more and 100 or less, and it is more preferable that it is an integer of 1 or more and 50 or less. Reactive polysilsesquioxane, by having the repeating unit represented by Formula (12), has a greater content of Si-O bonds than that formed using other materials, and infrared rays (0.78 µm or more and 1000 µm or less) , preferably far-infrared rays (3 µm or more, 1000 µm or less), more preferably, a separation layer 2 having high absorbance at a wavelength of 9 µm or more and 11 µm or less.

In addition, in Formula (12), R' is each independently an organic group which is mutually the same or different. Here, R is, for example, an aryl group, an alkyl group, and an alkenyl group, and these organic groups may have a substituent.

When R' is an aryl group, a phenyl group, a naphthyl group, an anthryl group, a phenanthryl group, etc. are mentioned, It is more preferable that it is a phenyl group. Moreover, the aryl group may couple|bond with the polysilsesquioxane skeleton via a C1-C5 alkylene group.

When R' is an alkyl group, examples of the alkyl group include a linear, branched, or cyclic alkyl group. Moreover, when R is an alkyl group, it is preferable that carbon number is 1-15, and it is more preferable that it is 1-6. Further, when R is a cyclic alkyl group, it may be an alkyl group having a monocyclic or 2 to 4 cyclic structure.

When R' is an alkenyl group, a linear, branched, or cyclic alkenyl group is mentioned similarly to the case of an alkyl group, The alkenyl group preferably has 2 to 15 carbon atoms, and 2 to 6 carbon atoms. It is more preferable that Further, when R is a cyclic alkenyl group, it may be an alkenyl group having a monocyclic or 2 to 4 cyclic structure. As an alkenyl group, a vinyl group, an allyl group, etc. are mentioned, for example.

Moreover, as a substituent which R' may have, a hydroxyl group, an alkoxy group, etc. are mentioned. When a substituent is an alkoxy group, a linear, branched, or cyclic alkylalkoxy group is mentioned, It is preferable that carbon number in an alkoxy group is 1-15, and it is more preferable that it is 1-10.

Moreover, one viewpoint WHEREIN: It is preferable that they are 70 mol% or more and 99 mol% or less, and, as for the siloxane content of reactive polysilsesquioxane, it is more preferable that they are 80 mol% or more and 99 mol% or less. When the siloxane content of the reactive polysilsesquioxane is 70 mol% or more and 99 mol% or less, it is preferably altered by irradiating infrared rays (preferably far-infrared rays, more preferably light with a wavelength of 9 µm or more and 11 µm or less). It is possible to form a separate layer (2) capable of

Moreover, one viewpoint WHEREIN: It is preferable that they are 500 or more and 50,000 or less, and, as for the weight average molecular weight (Mw) of reactive polysilsesquioxane, it is more preferable that they are 1,000 or more and 10,000 or less. If the weight average molecular weight (Mw) of reactive polysilsesquioxane is 500 or more and 50,000 or less, it can be suitably melt|dissolved in a solvent, and can be apply|coated suitably on a support plate.

As a commercial item which can be used as reactive polysilsesquioxane, SR-13, SR-21, SR-23, SR-33 by the Konishi Chemicals Co., Ltd. product, etc. are mentioned, for example.

[Embodiment 2]

Another embodiment (Embodiment 2) of the present invention will be described as follows. In addition, for convenience of description, about the member which has the same function as the member demonstrated in the said embodiment, the same code|symbol is attached|subjected and the description is abbreviate|omitted. In the manufacturing method of the encapsulant according to the second embodiment, the separation layer forming step, the separation layer peripheral portion removal step, the adhesive layer forming step, the encapsulation body forming step, the adhesive layer removing step, the light irradiation step, the separation step, and the removing step are performed in this order. Conduct.

(Separation layer formation process - Adhesive layer formation process)

As shown to Fig.2 (a)-(c), since the separation layer formation process, the separation layer peripheral part removal process, and the contact bonding layer formation process are the same as that of Embodiment 1, the description is abbreviate|omitted.

(Encapsulation Forming Process)

As shown to Fig.2 (d) - (g), in the sealing body formation process, the sealing body 7 is formed on the contact bonding layer 3 . In the sealing body formation process in this embodiment, an element arrangement process, a sealing process, a thinning process, and a wiring layer formation process are implemented in this order.

As shown in FIG.2(d), the element 5 is arrange|positioned on the contact bonding layer 3 in an element arrangement|positioning process. Arrangement of the element 5 with respect to the adhesive layer 3 can be implemented using a chip mounter etc., for example.

As shown to FIG.2(e), in a sealing process, the element 5 is sealed with the sealing material 6. As shown in FIG. The sealing material 6 may be injection-molded using a molding die, for example, and may be apply|coated by methods, such as spin coating, dipping, a roller blade, spray application|coating, and slit application|coating.

As shown in FIG.2(f), in a thinning process, the sealing material 6 is thinned. What is necessary is just to thin the sealing material 6 until the terminal part of the element 5 is exposed from the sealing material 6, for example.

As shown in FIG.2(g), in a wiring layer formation process, the wiring layer 4 is formed on the element 5 sealed with the sealing material 6 .

In one embodiment, in the formation order of the wiring layer 4, first, on the element 5 sealed with the sealing material 6, dielectric layers, such as a silicon oxide (SiOx) and a photosensitive resin, are formed. The dielectric layer made of silicon oxide can be formed by, for example, a sputtering method, a vacuum vapor deposition method, or the like. The dielectric layer made of the photosensitive resin can be formed by, for example, applying the photosensitive resin by a method such as spin coating, dipping, roller blade, spray coating, or slit coating.

Then, wiring is formed in the dielectric layer with a conductor such as a metal. As a method of forming the wiring, for example, a lithographic process such as photolithography (resist lithography) or a known semiconductor process method such as an etching process can be used.

By the above, on the support body 1, the sealing body 7 can be formed smoothly. Also in this embodiment, similarly to Embodiment 1, since the separation layer 2 is protected by the adhesive layer 3, contact of the chemical|medical solution with the separation layer 2 can be avoided. Moreover, by protecting the separation layer 2 with the adhesive layer 3, the separation layer 2 can be protected also from a chemical|medical solution other than a chemical|medical solution. Thereby, it can prevent that the separation layer 2 peels during a sealing body formation process.

In addition, the laminate 9 shown in FIG. 2(g) obtained by the above process includes a support 1 that transmits light, a separation layer 2 that is altered by irradiating light, and an adhesive layer 3 and , the encapsulant 7 is laminated in this order, and the encapsulant 7 includes a wiring layer 4 , an element 5 mounted on the wiring layer 4 , and a sealing material for sealing the element 5 . (6) is provided, and the separation layer (2) is covered with the adhesive layer (3) except for the portion in contact with the support body (1). Such a laminated body 9 is manufactured only in the process of the manufacturing method of the sealing body which concerns on this invention, and in order to manufacture the isolated sealing body 7, it can be used suitably.

(Adhesive layer removal process - removal process)

As shown in Figs. 2 (h) to (k), the adhesive layer removal step, the light irradiation step, the separation step, and the removal step are different in the vertical direction of the encapsulant 7, but are performed for other parts Since it is the same as that of Embodiment 1, the description is abbreviate|omitted.

By the above, similarly to Embodiment 1, the isolated sealing body 7 can be obtained. Moreover, you may perform processes, such as solder ball formation and a dicing process, with respect to the sealing body 7 further. Moreover, you may laminate|stack another element on the sealing body 7 further.

Further, similarly to Embodiment 1, (i) by making the outer diameter of the mold for molding of the sealing body 7 smaller than the support body 1, the sealing body 7 is molded smaller than the outer diameter of the support body 1, or, (ii) After shaping|molding of the sealing body 7, you may perform full cut trim with respect to the sealing body 7 so that it may become smaller than the outer diameter of the support body 1.

This invention is not limited to each embodiment mentioned above, Various changes are possible within the range shown in the claim, The embodiment obtained by combining the technical means disclosed in each different embodiment suitably is also included in the technical scope of this invention do.

The support separation method according to the present invention can be suitably used in the manufacturing process of a miniaturized semiconductor device.

1 support
1a flat part
1b starring part
2 separation layer
2a perimeter end
3 adhesive layer
4 wiring layer
5 element
6 encapsulant
7 encapsulant
8, 9 Laminate

Claims (8)

A method for manufacturing an encapsulant, comprising:
A separation layer forming step of forming a separation layer that is altered by irradiating light on one flat portion of the light-transmitting support;
a separation layer peripheral portion removing step of removing the separation layer formed around the entire peripheral portion of the support;
an adhesive layer forming step of forming an adhesive layer on the side of the support from which the separation layer has been removed from the entire periphery of the support;
an encapsulant forming step of forming the encapsulant on the adhesive layer;
After the encapsulant forming step, an adhesive layer removing step of removing the adhesive layer formed around the entire periphery of the support body,
In the adhesive layer removing step, the sealing body manufacturing method, characterized in that removing the adhesive layer formed outside the outer peripheral end of the separation layer formed on the support body. delete delete The method of claim 1,
After the adhesive layer removal step, a light irradiation step of modifying the separation layer by irradiating light to the separation layer through the support;
After the light irradiation process, the manufacturing method of the encapsulant, characterized in that it further comprises a separation process of separating the support and the encapsulant. 5. The method of claim 4,
After the separation process, the method of manufacturing an encapsulant, characterized in that it further comprises a removal process of removing the adhesive layer and the separation layer remaining in the encapsulant. The method of claim 1,
The encapsulant includes a wiring layer, an element mounted on the wiring layer, and a sealing material encapsulating the element,
The encapsulant forming step includes forming the wiring layer on the adhesive layer, mounting the element on the wiring layer, and sealing the element with the encapsulant. The method of claim 1,
The encapsulant includes a wiring layer, an element mounted on the wiring layer, and a sealing material encapsulating the element,
The encapsulant forming step comprises disposing the element on the adhesive layer, sealing the element with the encapsulant, and forming the wiring layer on the element encapsulated by the encapsulant. A method for manufacturing an encapsulant. delete

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