TWI734767B - A sealing body manufacturing method, and a laminate - Google Patents

Abstract

The present invention provides a method for manufacturing a sealing body and a laminated body that can prevent the separation layer provided on the support body from peeling off when the sealing body is formed on the support body.

The manufacturing method of the sealing body includes the steps of forming a separation layer (2) on the flat portion (1a) on one side of the support body (1) that is altered by irradiating light, and removing the peripheral edge formed on the support body (1) Part (1b) the step of separating the whole circumference of the layer (2), and the step of forming the adhesive layer (3) on the surface of the supporting body (1) on the side of the separating layer of the whole circumference of the part (1b), and then The step of forming a sealing body (7) on the layer (3).

Description

Manufacturing method of sealing body and laminated body

The present invention relates to a manufacturing method of a sealed body and a laminated body.

In recent years, in order to achieve integration or miniaturization of semiconductor devices, fan-out WLP (Fan-Out Wafer Level Package) technology has been developed. Known as fan-out WLP technology is (i) temporarily forming a resin wafer (pseudo-wafer) in which plural chips are sealed with resin on a support body, then removing the support body from the resin wafer, and then forming wiring on the resin wafer The method of forming a sealed body by layer (Patent Documents 1 to 3), and (ii) a method of forming a sealed body by removing the support after forming a wiring layer and a resin wafer on a support (Non-Patent Document 1), based on In terms of high-density wiring, the latter has attracted more attention.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2012-248598 A (December 2012) (Open on 13th)

[Patent Document 2] JP 2012-60100 A (published on March 22, 2012)

[Patent Document 3] JP 2013-168594 A (published on August 29, 2013)

[Non-Patent Literature]

[Non-Patent Document 1] Kurita Yoichiro, "Development of the new FO-WLP process RDL-first method to achieve high-reliability, high-density wiring ultra-small package", [online] RENESAS EDGE, [2016 (Heisei 28) Retrieved on January 6], Internet <URL: http://japan.renesas.com/media/edge_ol/r_and_d/01/r70pf0030jj0101_edge.pdf>

Based on their own knowledge, the inventors of the present invention, as a structure for removing the support at a desired time point in the fan-out WLP technology, studied the provision of a separation layer that is degraded by irradiation with light in advance on the support. As a result, it was found that in the method of forming a sealing body (wiring layer and resin wafer) on the support as in Non-Patent Document 1, since the processing for forming the wiring layer (such as lithography processing, etc.) is performed on the support, Therefore, due to the influence of the treatment (for example, the influence of the chemical liquid used in the treatment, etc.), the separation layer provided on the support may be peeled off.

The present invention was completed in view of the aforementioned problems, and its main purpose The purpose of the invention is to provide a method for manufacturing a sealing body and a laminated body that can prevent the separation layer provided on the support body from peeling off when the sealing body is formed on the support body.

In order to solve the above-mentioned problems, the manufacturing method of the sealing body of the present invention is a method of manufacturing a sealing body including a wiring layer, an element mounted on the wiring layer, and a sealing material that seals the element, and is characterized by being included in the light-transmitting The step of forming a separation layer in which a separation layer that is degraded by irradiation with light is formed on the flat portion on one side of the support, and the step of removing the separation layer peripheral edge portion of the separation layer formed on the entire circumference of the support body, in the support An adhesive layer forming step in which an adhesive layer is formed on the surface of the separation layer side of the entire periphery of the body where the peripheral portion is removed, and a sealing body forming step in which the sealing body is formed on the adhesive layer.

In addition, the laminated body of the present invention is characterized by sequentially laminating a light-transmissive support, a separation layer that is deteriorated by irradiating light, an adhesive layer, and a sealing body. The sealing body is provided with a wiring layer and is mounted on the wiring layer. In the element and the sealing material for sealing the element, in the separation layer, except for the part in contact with the support, it is covered by the adhesive layer.

According to the present invention, it is possible to provide a method for manufacturing a sealing body and a laminated body that can prevent the separation layer provided on the support body from peeling off when the sealing body is formed on the support body.

1‧‧‧Support

1a‧‧‧Plane

1b‧‧‧peripheral part

2‧‧‧Separation layer

2a‧‧‧peripheral end

3‧‧‧Next layer

4‧‧‧Wiring layer

5‧‧‧Component

6‧‧‧Sealing material

7‧‧‧Sealing body

8,9‧‧‧Laminated body

Fig. 1 is a diagram showing the steps of the manufacturing method of the sealing body according to the first embodiment of the present invention.

Fig. 2 is a diagram showing each step of the manufacturing method of the sealing body according to the second embodiment of the present invention.

The manufacturing method of the sealing body of the present invention is a manufacturing method of a sealing body including a wiring layer, an element mounted on the wiring layer, and a sealing material for sealing the element, which includes a flat portion on one side of a light-transmitting support A separation layer forming step of forming a separation layer that is degraded by irradiating light, and a separation layer peripheral portion removal step of removing the separation layer formed on the entire circumference of the support body, in the removal of the entire circumference of the support body An adhesive layer forming step of forming an adhesive layer on the surface of the separation layer, and a sealing body forming step of forming the sealing body on the adhesive layer.

According to the above configuration, after removing the separation layer formed on the entire circumference of the support body, the support body is removed from the entire circumference of the An adhesive layer is formed on the surface on the side of the separation layer, and the separation layer can be protected by the adhesive layer. Thereby, in the sealing body forming step, the separation layer can be prevented from peeling off the support body due to the erosion of the chemical liquid or the like.

[Embodiment 1]

Fig. 1 is a diagram showing each step of a method of manufacturing a sealing body according to an embodiment (Embodiment 1) of the present invention. The manufacturing method of the sealing body of the first embodiment sequentially performs the separation layer forming step, the separation layer peripheral part removal step, the subsequent layer forming step, the sealing body forming step, the subsequent layer removal step, the light irradiation step, the separation step, and the removal step.

(Separation layer formation step)

As shown in Figure 1(a), in the step of forming the separation layer, on one side flat portion 1a of the light-transmissive support 1, for example, a chemical vapor growth (CVD) method or the like is formed by irradiation Separation layer 2 degraded by light. In addition, the “one-side flat surface portion” refers to one of the flat surface portions that the support 1 has. In addition, the "planar portion" may have fine concavities and convexities to the extent that it is substantially flat. The details of the support 1 and the separation layer 2 and the formation sequence of the separation layer 2 will be described later.

(Removal of the peripheral edge of the separation layer)

As shown in Figure 1(b), in the step of removing the peripheral portion of the separation layer, for example, by EBR (Edge Bead Removal, edge ball removal) processing, the peripheral portion 1b of the support body 1 is formed on the entire circumference. The separation layer 2 is removed. Perimeter The portion 1b is the peripheral portion of the plane portion 1a. As a result, as shown in FIG. 1(b), the flat portion 1a is in a state where the separation layer 2 is formed in a portion surrounded by the peripheral portion 1b from which the separation layer 2 is removed. The details of EBR processing will be described later.

(Next layer formation step)

As shown in FIG. 1(c), in the adhesive layer forming step, the adhesive layer 3 is formed on the surface of the support 1 on the side of the separation layer 2 where the peripheral edge portion 1b is removed. The adhesive layer 3 can be formed by applying the adhesive by methods such as spin coating, dipping, roll knife, spray coating, and slit coating. Thereby, since the adhesive layer 3 is formed on the peripheral portion 1b surrounding the separation layer 2 and the upper portion of the separation layer 2, the separation layer 2 is covered with the adhesive layer 3. Thereby, the separation layer 2 can be protected. The details of the adhesive used to form the adhesive layer 3 will be described later.

(Steps of forming a sealing body)

As shown in (d) to (g) of FIG. 1, in the sealing body forming step, a sealing body 7 is formed on the adhesive layer 3. In this embodiment, in the sealing body forming step, the wiring layer forming step, the mounting step, the sealing step, and the thinning step are sequentially performed.

As shown in FIG. 1(d), the wiring layer 4 is formed on the adhesive layer 3 in the wiring layer forming step.

In one embodiment, as a procedure for forming the wiring layer 4, first, a dielectric layer of silicon oxide (SiO _x ), photosensitive resin, and the like is formed on the adhesive layer 3. The dielectric layer made of silicon oxide can be formed by, for example, sputtering, vacuum evaporation, or the like. The dielectric layer made of the photosensitive resin can be formed by applying the photosensitive resin by methods such as spin coating, dipping, roll knife, spray coating, and slit coating.

Next, on the dielectric layer, wiring is formed with a conductor such as metal. As the wiring formation method, for example, photolithography (resist lithography) and other conventional semiconductor manufacturing methods such as lithography processing and etching processing can be used.

As shown in Fig. 1(e), the component 5 is mounted on the wiring layer 4 in the mounting step. The mounting of the component 5 to the wiring layer 4 can be performed using, for example, a wafer mounter.

As shown in FIG. 1(f), in the sealing step, the component 5 is sealed by the sealing material 6. The sealing material 6 can be injection-molded using, for example, a molding die, or can be applied by a method such as spin coating, dipping, roll knife, spray coating, and slit coating.

As shown in Fig. 1(g), in the thinning step, the sealing material 6 is thinned. The sealing material 6 may also be thinned to the same thickness as the element 5, for example.

As described above, the sealing body 7 can be formed on the support 1 smoothly and well. In this case, for example, a chemical solution may be used in lithography processing, etching processing, etc. for forming wiring. Since the separation layer 2 often has insufficient resistance to the chemical liquid, when the separation layer 2 comes into contact with the chemical liquid, the separation layer 2 may peel off. Therefore, according to this embodiment, since the separation layer 2 is protected by the adhesive layer 3, it is possible to prevent the chemical solution from contacting the separation layer 2. Moreover, the separation layer 2 is protected by the adhesive layer 3, and the separation layer 2 can also be protected from influences other than the chemical liquid. Thereby, in the sealing body forming step, the separation layer 2 can be prevented from peeling off. Furthermore, according to the adhesive layer 3, for example, in the distribution In the wire layer forming step, even when the oxide film or metal layer that constitutes the wiring layer 4 is attached to the vicinity of the end of the support 1, the oxidation can be easily removed from the support 1 by removing the adhesive layer 3 The support 1 can be reused for films, metal layers, etc., especially without washing.

In addition, the laminated body 8 shown in (g) of FIG. 1 obtained by the above steps is sequentially laminated with a light-transmissive support 1, a separation layer 2, an adhesive layer 3, and a sealing body 7 that are altered by light irradiation. The sealing body 7 is provided with a wiring layer 4, an element 5 mounted on the wiring layer 4, a sealing material 6 for the sealing element 5, and a separation layer 2 covered by an adhesive layer 3 except for the part in contact with the support 1. The laminated body 8 is manufactured only in the process of the manufacturing method of the sealing body of the present invention, and can be better used to manufacture the sealing body 7 for separation.

(Following the layer removal step)

As shown in FIG. 1(h), in the adhesive layer removal step, the adhesive layer 3 formed on the entire circumference of the peripheral portion 1b of the support 1 is removed, for example, by EBR processing. The details of EBR processing will be described later. In the adhering layer 3, the part formed on the entire circumference of the peripheral portion 1b of the support 1 does not penetrate the separation layer 2, and the support 1 and the sealing body 7 are bonded, so by removing this part in advance, the separation layer 2 When it deteriorates, the support body 1 and the sealing body 7 can be separated smoothly.

In particular, by removing in advance the adhesive layer 3 formed outside the outer peripheral end 2a of the separation layer 2 formed on the support 1, since the support 1 and the sealing body 7 can be in a state of necessarily passing through the separation layer 2 and then adhered. Therefore, when the quality of the separation layer 2 is changed, the support 1 and the sealing body 7 can be separated more smoothly.

(Light irradiation step)

As shown in FIG. 1(i), in the light irradiation step, the separation layer 2 is irradiated with light L through the support 1 to change the quality of the separation layer 2. The type and wavelength of the irradiated light L can be appropriately selected according to the transmittance of the support 1 and the material of the separation layer 2. For example, YAG laser, ruby laser, glass laser, YVO ₄ laser, LD laser can be used , Fiber lasers and other solid lasers, pigment lasers and other liquid lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electrons Laser light such as laser, or non-laser light. Thereby, the quality of the separation layer 2 is changed, and the support body 1 and the sealing body 7 can be easily separated.

Also, as an example of the laser light irradiation conditions when irradiating the laser light, the following conditions can be exemplified, but are not limited to this: The average output value of the laser light is preferably 1.0W or more and 5.0W or less, more preferably 3.0W or more and 4.0W or less The repetition frequency of the laser light is preferably above 20 kHz and below 60 kHz, more preferably above 30 kHz and below 50 kHz; the scanning speed of the laser light is preferably above 100 mm/s and below 10,000 mm/s.

(Separation step)

As shown in FIG. 1(j), in the separation step, the support body 1 and the sealing body 7 are separated. For example, by applying a force in a direction in which the supporting body 1 and the sealing body 7 are separated from each other, the supporting body 1 and the sealing body 7 are separated. For example, in a state where one of the support 1 and the sealing body 7 is fixed on the table, the other is held by a separate plate equipped with an adsorption pad such as a vacuum pad (bellows pad) and the other is pulled up at the same time to make the support 1 is separated from the sealing body 7.

(Removal step)

As shown in FIG. 1(k), in the removal step, the adhesive layer 3 and the separation layer 2 remaining on the sealing body 7 after the separation of the support body 1 are removed. For example, a cleaning step of removing residues of the adhesive layer 3 and the separation layer 2 with a cleaning solution containing an organic solvent or the like is performed. As the cleaning liquid, for example, a diluting solvent of the adhesive agent described later, a solvent showing alkalinity (especially an amine compound), etc. can be used, but it is not limited thereto.

From the above, a single-separated sealing body 7 can be obtained.

Furthermore, the sealing body 7 may also be subjected to processing such as solder ball formation and cutting processing. Moreover, other components can also be laminated on the sealing body 7.

In addition, in the adhesive removal step (refer to FIG. 1(h)), in order to better remove the outer periphery of the adhesive layer 3 (outside the separation layer 2), the outer diameter of the sealing body 7 is preferably smaller than that of the support body 1. Outer diameter. Therefore, for example, (i) by making the outer diameter of the molding die of the sealing body 7 smaller than the support body, forming the sealing body 7 having an outer diameter smaller than that of the support body, or (ii) after the sealing body 7 is formed, in order to make it more than The outer diameter of the support body is small, and the sealing body 7 is preferably fully cut and trimmed.

[EBR processing]

In one embodiment, in the (A) separation layer peripheral portion removal step, the EBR process to remove the separation layer 2 formed on the entire circumference of the peripheral portion 1b of the support 1 and (B) the adhesive layer removal step are used Examples of the EBR treatment for removing the adhesive layer 3 formed on the entire circumference of the peripheral portion 1b of the support 1 include (i) a method of removing by solvent dissolution, (ii) a method of removing physically using a cutter or a blade, etc. , (Iii) Removal by ashing under atmospheric pressure The method and so on. Among them, from the viewpoint of strength and practicality, a method of removal by a solvent is preferred.

The solvent used in the method of solvent removal is not particularly limited as long as it can dissolve the separation layer 2 or the adhesive layer 3 to be removed, and those skilled in the art can appropriately select it according to the composition of the removal target. For example, for the adhesive layer 3 formed using a hydrocarbon-based adhesive, terpene-based solvents such as p-menthane and d-limonene can be used as the solvent, and for the adhesive layer 3 formed by an acrylic or maleimide-based adhesive , Propylene glycol monomethyl ether acetate, cyclohexanone, 2-heptanone, ethyl acetate and methyl ethyl ketone can be used as solvents.

Moreover, for the separation layer 2, for example, a solvent exhibiting basicity can be used, especially an amine compound can be used, and aliphatic amine, alicyclic amine, aromatic amine or heterocyclic amine can be used from the first, second, and third stages. At least one compound selected from the group of amines. Among these organic amine compounds, monoethanolamine, 2-(2-aminoethoxy)ethanol and 2-ethylaminoethanol are particularly preferably used. -Alkanolamines such as methylaminoethanol (MAE). Moreover, the peeling liquid may mix and use the said amine compound and other solvents, and may mix and use the solvent described in the column of (diluent solvent) mentioned later.

As a method of supplying the solvent, for example, a method of supplying the solvent to the removal target by spraying the solvent, and a method of immersing the removal target in the solvent.

In the method of supplying the solvent to the removal target by spraying the solvent, in order to uniformly supply the solvent, a method of supplying the solvent to the removal target while rotating the support 1 is preferred. As the supporting body 1 is rotated while supplying the melt For example, the method of spraying the solvent is to arrange a nozzle for spraying the solvent directly above the outer side of the peripheral portion 1b of the support 1, and while dripping the solvent on the outer side of the peripheral portion 1b of the support 1, use a spinner to support The method of body 1 rotation. Thereby, the solvent can be supplied to the vicinity of the outer side of the entire circumference of the peripheral portion 1b of the support 1. In addition, the number of nozzles arranged is not limited, as long as it is one or more.

With the above method of supporting body 1 rotation and solvent ejection, the rotation speed of the supporting body 1, the solvent flow rate when the solvent is supplied from the nozzle, and the solvent supply time may depend on the composition of the removal object, the thickness of the removal object, and the type of solvent used And the degree of removal varies, but if you are skilled in the art, you can review and determine the most suitable conditions without difficulty.

In addition, it is preferable to dry the support 1 etc. after the object is dissolved and removed by the solvent. By going through the drying step, unnecessary solvents, solvents immersed in the separation layer 2 or the adhesive layer 3 of the non-removable part can be removed.

Examples of the drying method include drying by rotating the support 1 using a spinner or the like, drying with a _{blower using spray of N 2} gas or the like, drying with baking, and drying with reduced pressure. In addition, as these drying methods, any method may be used alone, or any one of two or more methods may be used in combination.

[Seal Body 7]

As described above, the sealing body 7 includes the wiring layer 4, the element 5 mounted on the wiring layer 4, and the sealing material 6 that seals the element 5. In one embodiment, the sealing body 7 is provided with a plurality of elements 5. This type of sealing body 7 can obtain a plurality of electronic zeros by cutting. Pieces.

Element 5 is a semiconductor element or other element, and may have a single-layer or multiple-layer structure. Moreover, when the element 5 is a semiconductor element, the electronic part obtained by cutting the sealing body 7 becomes a semiconductor device.

The wiring layer 4 is also called RDL (Redistribution Layer: Redistribution Layer), and is a thin-film wiring body that constitutes wiring connected to the element 5, and may have a single-layer or multiple-layer structure. In one embodiment, the wiring layer 4 can be a dielectric (such as silicon oxide (SiO _x ), photosensitive resin such as photosensitive epoxy resin, etc.) through a conductive body (such as aluminum, copper, titanium, nickel, etc.) Metals such as gold, etc.) are formed by forming wiring, but it is not limited to this.

As the sealing material 6, for example, epoxy resin, silicon resin, etc. can be used. In one embodiment, the sealing material 6 is not provided for each element 5, but is one that integrally seals all the plural elements 5 mounted on the wiring layer 4.

[Support 1]

In one embodiment, the support 1 only needs to have the strength necessary to prevent damage or deformation of each component of the sealing body 7 when the sealing body 7 is formed. What is necessary is just to transmit light which can be used to change the quality of the separation layer 2.

As the material of the support 1, for example, glass, silicon, acrylic resin, etc. can be used, but it is not limited thereto. As the shape of the support body 1, for example, a circular plate shape can be used, but it is not limited to this.

[Next layer 3]

In one embodiment, the adhesive layer 3 is used to fix the sealing body 7 to the support Those on the body 1, and used to protect the separation layer 2.

The thickness of the subsequent layer 3 can be appropriately set according to the types of the support 1 and the sealing body 7 and the treatment performed in the sealing body forming step, but it is preferably in the range of 10 to 150 μm, more preferably 15 to 100 μm. Within range.

As the adhesive for forming the adhesive layer 3, various adhesives known in the field such as acrylic, novolac, naphthoquinone, hydrocarbon, polyimide, elastomer, and polyimide can be used.

As the resin contained in the adhesive, that is, the resin contained in the adhesive layer 3, it is sufficient if it has adhesive properties. For example, hydrocarbon resins, acrylic-styrene resins, maleimide resins, and elastomers can be preferably used. Resin, polycarbonate-based resin, etc., or a combination of these, etc. The resin composition contained in the adhesive layer 3 will be described below.

(Hydrocarbon resin)

The hydrocarbon resin is a resin having a hydrocarbon skeleton and polymerizing a monomer composition. Examples of hydrocarbon resins include cycloolefin-based polymers (hereinafter sometimes referred to as "resin (A)") and at least one resin selected from the group consisting of terpene resins, rosin-based resins, and petroleum resins (hereinafter sometimes referred to as "Resin (B)") etc., but not limited to this.

The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin-based monomer. Specifically, examples are ring-opening (co)polymers containing monomer components of cycloolefin-based monomers, resins obtained by addition (co)polymerization of monomer components containing cycloolefin-based monomers, and the like.

As the aforementioned cycloolefin-based monomer contained in the monomer component of the resin (A), for example, bicyclic body such as norbornene, norbornadiene, dicyclopentadiene, hydroxydicyclopentadiene The tricyclic ring such as tetracyclododecene, the pentacyclic ring such as cyclopentadiene trimer, the heptacyclic ring such as tetracyclopentadiene, or the alkane of such polycyclic ring Group (methyl, ethyl, propyl, butyl, etc.) substituents, alkenyl (vinyl, etc.) substituents, alkylene (ethylene, etc.) substituents, aryl (phenyl, tolyl, naphthalene, etc.) Group, etc.) Substituted body and the like. Among these, particularly preferred is a norbornene-based monomer selected from the group consisting of norbornene, tetracyclododecene, or these alkyl substituted compounds.

The monomer component constituting the resin (A) may also contain other monomers copolymerizable with the above-mentioned cycloolefin-based monomer, and for example, it is preferable to contain an olefin monomer. Examples of olefin monomers include ethylene, propylene, 1-butene, isobutylene, 1-hexene, and α-olefins. The ethylenic monomer may be linear or branched.

As a monomer component constituting the resin (A), it is preferable to contain a cycloolefin monomer from the viewpoint of high heat resistance (low thermal decomposition, thermal weight reduction). The ratio of the cycloolefin monomer to the total monomer components constituting the resin (A) is preferably at least 5 mol%, more preferably at least 10 mol%, and still more preferably at least 20 mol%. The ratio of the cycloolefin monomer to the total monomer components constituting the resin (A) is not particularly limited. From the viewpoint of solubility and stability of the solution with time, it is preferably 80 mol% or less, more preferably 70 mol%. Less than ear%.

Furthermore, as a monomer component constituting the resin (A), a linear or branched ethylenic monomer may be contained. The ratio of the alkene monomer to the total monomer components constituting the resin (A) is preferable from the viewpoint of solubility and flexibility It is 10 to 90 mol%, more preferably 20 to 85 mol%, and still more preferably 30 to 80 mol%.

In addition, when the resin (A) is a resin that does not have a polar group, such as a resin formed by polymerizing a monomer component of a cycloolefin-based monomer and an alkene monomer, it is more effective in terms of suppressing gas generation at high temperatures. good.

The polymerization method, polymerization conditions, and the like at the time of polymerization of the monomer components are not particularly limited, as long as they are appropriately set according to common methods.

For example, a cyclic olefin copolymer which is a copolymer of a repeating unit represented by the following chemical formula (1) and a repeating unit represented by the following chemical formula (2) can be used as the resin (A) of the subsequent component.

(化學式(2)中，n為0或1~3之整數)。

(In the chemical formula (2), n is 0 or an integer of 1 to 3).

As such a cycloolefin copolymer, APL 8008T, APL 8009T, APL 6013T (all manufactured by Mitsui Chemicals Co., Ltd.), etc. can be used.

And examples of commercially available products that can be used as resin (A) are, for example, "TOPAS" made by PolyPlastic Co., Ltd., "APEL" made by Mitsui Chemicals Co., Ltd., and one made by ZEON Co., Ltd. "ZEONOR" and "ZEONEX", "ARTON" manufactured by JSR Corporation, etc.

The glass transition temperature (Tg) of the resin (A) is preferably at least 60°C, particularly preferably at least 70°C. When the glass transition temperature of the resin (A) is above 60°C, the softening of the adhesive layer 3 when exposed to a high-temperature environment can be further suppressed.

The resin (B) is at least one resin selected from the group consisting of terpene-based resins, rosin-based resins, and petroleum resins. Specifically, examples of terpene-based resins include terpene resins, terpene phenol resins, modified terpene resins, hydrogenated terpene resins, hydrogenated terpene phenol resins, and the like. Examples of rosin-based resins include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of petroleum resins include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, coumarone-indene petroleum resins, and the like. Among these, hydrogenated terpene resin and hydrogenated petroleum resin are more preferable.

The softening point of the resin (B) is not particularly limited, but it is preferably from 80 to 160°C. When the softening point of the resin (B) is 80 to 160°C, the softening when exposed to a high-temperature environment can be suppressed, and adhesion failures will not occur.

The weight average molecular weight of the resin (B) is not particularly limited, but it is preferably from 300 to 3,000. When the weight average molecular weight of the resin (B) is 300 or more, the heat resistance is sufficient, and the amount of outgassing in a high-temperature environment decreases. On the other hand, when the weight average molecular weight of the resin (B) is 3,000 or less, the dissolution rate of the adhesive layer 3 in the hydrocarbon solvent is good. Therefore, the residue of the adhesive layer 3 on the sealing body 7 after separating the support body 1 can be quickly dissolved and removed. In addition, the weight average molecular weight of the resin (B) in this embodiment means The molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

Moreover, as resin, what mixed resin (A) and resin (B) can be used. By mixing, it becomes one with good heat resistance. For example, when the mixing ratio of resin (A) and resin (B) is (A): (B)=80:20~55:45 (mass ratio), the heat resistance and flexibility under high temperature environment are excellent, so it is better .

(Acrylic-styrene resin)

As the acrylic-styrene resin, for example, a resin polymerized using styrene or a derivative of styrene and (meth)acrylate or the like as monomers.

Examples of (meth)acrylates include alkyl (meth)acrylates having a chain structure, (meth)acrylates having an aliphatic ring, and (meth)acrylates having an aromatic ring. Examples of (meth)acrylic acid alkyl esters formed by a chain structure include long-chain acrylic acid-based alkyl esters having an alkyl group having 15 to 20 carbon atoms, and acrylic acid-based alkyl esters having an alkyl group having 1 to 14 carbon atoms. Examples of long-chain acrylic acid-based alkyl esters are: alkyl group is one of n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, n-eicosyl, etc. Alkyl ester of acrylic acid or methacrylic acid. In addition, the alkyl group may be branched.

As the alkyl acrylate having an alkyl group having 1 to 14 carbon atoms, a conventional acrylate alkyl ester used in an existing acrylic adhesive is exemplified. For example, the alkyl group is methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, isononyl, isodecyl, dodecyl, lauryl, tridecyl, etc. It is an alkyl ester of acrylic acid or methacrylic acid.

Examples of (meth)acrylates having an aliphatic ring are cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, norbornyl (meth)acrylate Ester, isobornyl (meth)acrylate, tricyclodecyl (meth)acrylate, tetracyclododecyl (meth)acrylate, dicyclopentane (meth)acrylate, etc., but more preferably methyl Isobornyl acrylate, dicyclopentyl (meth)acrylate.

The (meth)acrylate having an aromatic ring is not particularly limited, but examples of the aromatic ring include phenyl, benzyl, tolyl, xylyl, biphenyl, naphthyl, anthryl, and phenoxy. Benzylmethyl, phenoxyethyl, etc. In addition, the aromatic ring may have a linear or branched alkyl group having 1 to 5 carbon atoms. Specifically, phenoxyethyl acrylate is preferred.

(Maleimide resin)

Examples of maleimide resins include, for example, N-methylmaleimide, N-ethylmaleimide, N-n-propylmaleimide, and N-isopropylmaleimide as monomers. Propyl maleimide, N-n-butyl maleimide, N-isobutyl maleimide, N-second butyl maleimide, N-tertiary butyl maleimide N-pentylmaleimide, N-pentylmaleimide, N-hexylmaleimide, N-heptylmaleimide, N-octylmaleimide, N-laurel Maleimines having alkyl groups such as N-stearyl maleimines, N-stearyl maleimines, N-cyclopropyl maleimines, N-cyclobutyl maleimines , N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide, etc. which have aliphatic hydrocarbon groups Maleimide, N-phenylmaleimide, N-m-methylphenylmaleimide, N- O-Methylphenylmaleimide, N-p-methylphenylmaleimide, and other aromatic maleimide resins with aromatic groups.

(Elastomer)

The elastomer preferably contains a styrene unit as a constituent unit of the main chain, and the "styrene unit" may have a substituent. Examples of the substituent include, for example, an alkyl group having 1 to 5 carbons, an alkoxy group having 1 to 5 carbons, an alkoxyalkyl group having 1 to 5 carbons, an acetoxy group, and a carboxyl group. Furthermore, the content of the styrene unit is more preferably within the range of 14% by weight or more and 50% by weight or less. Furthermore, the elastomer preferably has a weight average molecular weight of 10,000 or more and 200,000 or less.

If the content of the styrene unit is within the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is within the range of 10,000 or more and 200,000 or less, it is easy to dissolve in the hydrocarbon solvent described later, so it can be more The adhesive layer 3 is easily and quickly removed. And, by making the content of the styrene unit and the weight average molecular weight within the above range, the resist solvent (such as PGMEA, PGME, etc.), acid (hydrofluoric acid, etc.), alkali (TMAH Etc.) of excellent patience.

In addition, the above-mentioned (meth)acrylate may be further mixed with the elastomer.

The content of the styrene unit is more preferably 17% by weight or more, and more preferably 40% by weight or less.

A more preferable range of the weight average molecular weight is 20,000 or more, and a more preferable range is 150,000 or less.

If used as an elastomer, the content of styrene units is 14 Various elastomers can be used within the range of weight% or more and 50 weight% or less, and the weight average molecular weight of the elastomer is 10,000 or more and 200,000 or less. Examples are, for example, polystyrene-poly(ethylene/propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block Copolymer (SBS), styrene-butadiene-butylene-styrene block copolymer (SBBS), and their hydrogenated products, styrene-ethylene-butylene-styrene block copolymer (SEBS) , Styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer ( SEEPS), styrene-ethylene-ethylene-propylene-styrene block copolymers (Septon V9461 (manufactured by KURARAY Co., Ltd.), Septon V9475 (manufactured by KURARAY Co., Ltd.)) whose styrene block is a reactive cross-linked type, styrene The block is a reactive cross-linked styrene-ethylene-butylene-styrene block copolymer (a reactive polystyrene hard block Septon V9827 (manufactured by KURARAY Co., Ltd.)), polystyrene-poly (Ethylene-ethylene/propylene) block-polystyrene block copolymer (SEEPS-OH: terminal hydroxyl modification), etc., can use elastomers whose styrene unit content and weight average molecular weight are within the above-mentioned ranges.

In addition, the elastomer is more preferably a hydride. If it is a hydride, the stability to heat is improved, and it is unlikely to cause deterioration such as decomposition or polymerization. In addition, it is also preferable from the viewpoint of solubility to hydrocarbon solvents and resistance to resist solvents.

In addition, among the elastomers, a block polymer having styrene at both ends is more preferable. The reason is that due to the high thermal stability of styrene which is blocked at both ends Shows higher heat resistance.

More specifically, the elastomer is more preferably a hydrogenated product of a block copolymer of styrene and conjugated diene. The stability to heat is improved, and it is not easy to cause deterioration such as decomposition or polymerization. In addition, styrene, which has high thermal stability due to the end-capping of both ends, exhibits higher heat resistance. Furthermore, it is better based on the viewpoints of solubility to hydrocarbon solvents and resistance to resist solvents.

Examples of commercially available products that can be used as the elastomer contained in the adhesive constituting the adhesive layer 3 are, for example, "Septon (trade name)" manufactured by KURARAY Co., Ltd. and "Hybler (trade name)" manufactured by KURARAY Co., Ltd. , "Tuftec (trade name)" manufactured by Asahi Kasei Co., Ltd., "Dynaron (trade name)" manufactured by JSR Corporation, etc.

As the content of the elastomer contained in the adhesive constituting the adhesive layer 3, for example, when the total amount of the adhesive composition is 100 parts by weight, it is preferably in the range of 50 parts by weight or more and 99 parts by weight or less, more preferably Within the range of 60 parts by weight or more and 99 parts by weight or less, preferably within the range of 70 parts by weight or more and 95 parts by weight or less. By falling within these ranges, the heat resistance can be maintained and the sealing body 7 can be better fixed to the support 1 at the same time.

In addition, multiple types of elastomers may be mixed. That is, the adhesive constituting the adhesive layer 3 may contain plural kinds of elastomers. Moreover, as long as at least one of plural types of elastomers contains a styrene unit as a constituent unit of the main chain. In addition, if at least one of the plural types of elastomers has a unit content of styrene in the range of 14% by weight or more and 50% by weight or less, or the weight average molecular weight is in the range of 10,000 or more and 200,000 or less, That is the scope of the present invention. In addition, when the adhesive constituting the adhesive layer 3 contains a plurality of types of elastomers, the content of the styrene unit may be adjusted within the above-mentioned range as a result of mixing. For example, when Septon 4033 manufactured by KURARAY Co., Ltd. with a styrene unit content of 30% by weight and Septon 2063 with a styrene unit content of 13% by weight in Septon (trade name) are mixed in a weight ratio of 1:1 Since the styrene content is 21 to 22% by weight with respect to the entire elastomer contained in the adhesive, it is 14% by weight or more. In addition, for example, when the styrene unit is 10% by weight and 60% by weight are mixed at a weight ratio of 1 to 1, it becomes 35% by weight, which is within the above-mentioned range. The present invention may also be in such forms. In addition, it is preferable that all the plural types of elastomers contained in the adhesive agent constituting the adhesive layer 3 contain styrene units within the above-mentioned range and have a weight average molecular weight within the above-mentioned range.

In addition, it is preferable to use a resin other than a photocurable resin (for example, a UV curable resin) to form the adhesive layer 3. By using a resin other than the photocurable resin, after the adhesive layer 3 is peeled or removed, it is possible to prevent residues from being generated around the microscopic unevenness of the sealing body 7. In particular, as the adhesive that constitutes the adhesive layer 3, one that is not soluble in all solvents, and one that is soluble in a specific solvent is preferred. This is because the adhesive layer 3 can be removed by dissolving the adhesive layer 3 in a solvent without applying a physical force to the sealing body 7. When the adhesive layer 3 is removed, even if the sealing body 7 has a low strength, the adhesive layer 3 can be easily removed without damaging or deforming the sealing body 7.

(Polymer resin)

The adhesive used to form the adhesive layer 3 may also contain a polymer-based resin. By forming the adhesive layer 3 with a polymer-based resin, even in the sealing body forming step High-temperature treatment is performed in the middle, and the adhesive layer 3 can also be dissolved in the subsequent steps, and the support 1 can be peeled from the sealing body 7. If the subsequent layer 3 contains a polycarbonate resin, in the sealing body forming step, a high-temperature process such as high-temperature treatment above 300° C. can be used.

The polymer resin has a structure composed of at least one of the constituent units represented by the following general formula (3) and the constituent units represented by the following general formula (4).

(Here, R ¹ , R ² and R ³ in the general formula (3) and R ¹ and R ² in the general formula (4) are independently selected from the group consisting of phenylene, naphthylene and anthrylene , X'is an alkylene group having a carbon number of 1 or more and 3 or less).

After the polyether-based resin is provided with at least one of the polyether constitutional unit represented by the formula (3) and the polyether constitutional unit represented by the formula (4), the adhesive layer 3 is formed on the support 1 and the separation layer 2 In the sealing body forming step, even if the treatment is performed under high temperature conditions, the adhesive layer 3 can be prevented from being insolubilized due to decomposition and polymerization. In addition, if the polysulfide-based resin is a polysulfide resin composed of a polysulfide constituent unit represented by the above formula (3), it can be stable even when heated at a higher temperature. Therefore, the sealing body 7 after washing can be prevented from generating residues caused by the adhesive layer 3.

The weight-average molecular weight (Mw) of the polyuncle-based resin is preferably in the range of 30,000 or more and 70,000 or less, more preferably in the range of 30,000 or more and 50,000 or less. If the weight average molecular weight (Mw) of the polyimide-based resin is within the range of 30,000 or more, an adhesive composition that can be used at a high temperature of 300°C or more can be obtained, for example. In addition, if the weight average molecular weight (Mw) of the polyimide-based resin is within the range of 70,000 or less, it can be appropriately dissolved in a solvent. That is, an adhesive composition that can be removed by a solvent can be obtained.

(Diluent solvent)

As the dilution solvent used when forming the adhesive layer 3, for example, hexane, heptane, octane, nonane, isononane, methyloctane, decane, undecane, dodecane, tridecane, etc. Straight chain hydrocarbons, branched chain hydrocarbons with 4 to 15 carbons, such as cyclic hydrocarbons such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decalin, tetralin, p-menthane, O-menthane, meta-menthane, diphenylmethane, 1,4-terpene diol, 1,8-terpene diol, bornane, norbornane, pinane, thujaboxane, long pine needles Carane (carane), longleafene, geraniol, nerol, linalol, citral, citronellol, menthol, isomenthol, neomenthol, α-terpineol, β-terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydrorosin acetate, 1,4-cineole, 1,8-cineole, camphor, Carvone, ionone, thujone, camphor, d-limonene, l-limonene, dipentene and other terpene solvents; γ-butyrolactone and other lactones; acetone, methyl ethyl ketone, cyclic Ketones such as hexanone (CH), methyl-n-pentyl ketone, methyl isoamyl ketone, 2-heptanone, etc.; Polyols such as ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate or dipropylene glycol monoacetate, etc. Compounds with ester linkages, the aforementioned polyols or the aforementioned compounds with ester linkages such as monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether, etc. Derivatives of alcohols (in these, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME)); such as cyclic ethers of dioxane, or methyl lactate, ethyl lactate Ester (EL), methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypyruvate, ethyl ethoxypyruvate, etc. The esters; aromatic organic solvents such as anisole, ethyl benzyl ether, tolyl methyl ether, diphenyl ether, dibenzyl ether, phenethyl ether, butyl phenyl ether, etc.

(Other ingredients)

The adhesive constituting the adhesive layer 3 may further contain other substances with miscibility within a range that does not impair the essential characteristics. For example, additional resins, plasticizers, adjuvants, stabilizers, colorants, thermal polymerization inhibitors, surfactants, and other customary additives for improving the performance of the adhesive can be further used.

[Separation layer 2]

As described above, the separation layer 2 can be deteriorated by irradiation with light. In one embodiment, by irradiating the separation layer 2 with light through the support 1 to change the quality of the separation layer 2, the support 1 and the sealing body 7 can be separated.

The thickness of the separation layer 2 is more preferably in the range of 0.05 μm or more and 50 μm or less, and more preferably in the range of 0.3 μm or more and 1 μm or less. If the thickness of the separation layer 2 is limited to a range of 0.05 μm or more and 50 μm or less, the desired deterioration of the separation layer 2 can be caused by short-time light irradiation and low-energy light irradiation. In addition, the thickness of the separation layer 2 is particularly preferably limited to a range of 1 μm or less from the viewpoint of productivity.

Moreover, another layer may be further formed between the separation layer 2 and the support 1. In this case, the other layers only need to be made of light-permeable materials. Thereby, the incidence of light into the separation layer 2 is not hindered, and a layer having better properties and the like can be appropriately added. Depending on the type of material constituting the separation layer 2, the usable light wavelength is also different. Therefore, it is not necessary for the materials constituting the other layers to transmit all light, and may be appropriately selected from materials capable of transmitting light of a wavelength that can change the material constituting the separation layer 2.

In addition, the separation layer 2 is preferably formed only of a material having a structure that absorbs light, but within a range that does not impair the essential characteristics of the present invention, a material that does not have a structure that absorbs light may be added to form the separation layer 2. In addition, the surface of the separation layer 2 on the side facing the adhesive layer 3 is preferably flat (no unevenness is formed). This facilitates the formation of the separation layer 2 and allows uniform attachment during attachment.

(Fluorocarbon)

The separation layer 2 may also be formed of a fluorocarbon compound. When the separation layer 2 is made of a fluorocarbon compound, it can be deteriorated by absorbing light, and as a result, the strength or adhesiveness before being irradiated with light is lost. Therefore, the separation layer 2 can be destroyed by a slight application of external force (such as pulling up the support 1 etc.), and the support 1 can be easily combined with the sealing body. 7 Separation. The fluorocarbon constituting the separation layer 2 can be preferably formed into a film by a plasma CVD (chemical vapor deposition) method.

Fluorocarbon compounds can absorb light with a wavelength within a specific range depending on their type. By irradiating the separation layer 2 with light having a wavelength in the range absorbed by the fluorocarbon compound used in the separation layer 2, the fluorocarbon compound can be appropriately deteriorated. In addition, the light absorption rate of the separation layer 2 is preferably at least 80%.

_{As the light irradiated to the separation layer 2, solid lasers such as YAG lasers, ruby lasers, glass lasers, YVO 4} lasers, LD lasers, fiber lasers, etc. are appropriately used according to the wavelength that the fluorocarbon can absorb. Lasers, color lasers and other liquid lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electron lasers and other lasers, or Non-laser light is fine. The wavelength at which the fluorocarbon compound can be modified is not limited to these wavelengths, and, for example, those in the range of 600 nm or less can be used.

(The repeating unit contains a polymer with a light-absorbing structure)

The separation layer 2 may also contain a polymer having a light-absorbing structure in its repeating unit. The polymer is irradiated with light and deteriorated. The deterioration of the polymer is caused by the above-mentioned structure absorbing the irradiated light. The separation layer 2 loses its strength or adhesiveness before being irradiated with light as a result of the deterioration of the polymer. Therefore, a slight application of external force (for example, pulling up the support 1 etc.) can destroy the separation layer 2, and the support 1 and the sealing body 7 can be easily separated.

The above-mentioned structure having light absorption is a chemical structure that absorbs light and alters the polymer containing the structure as a repeating unit. The structure is For example, an atomic group containing a conjugated π-electron system formed by a substituted or unsubstituted benzene ring, a condensed ring or a heterocyclic ring. In more detail, the structure may be a cardo structure, or a benzophenone structure, a diphenyl sulfide structure, a diphenyl sulfide structure (bisphenyl sulfide structure), a benzophenone structure, a diphenyl sulfide structure, and a Diphenyl structure or diphenylamine structure.

When the above-mentioned structure exists in the side chain of the above-mentioned polymer, the structure can be represented by the following formula.

(In the formula, R is each independently an alkyl group, an aryl group, a halo group, a hydroxyl group, a keto group, an allylylene group, a oxo group, or N(R ⁴ )(R ⁵ ) (here, R ⁴ and R ⁵ are each independently A hydrogen atom or an alkyl group with 1 to 5 carbon atoms), Z is not present or is -CO-, -SO ₂ -, -SO- or -NH-, n is an integer of 0 or 1 to 5).

In addition, the above-mentioned polymer contains, for example, a repeating unit represented by any one of (a) to (d) in the following formulae, or a structure represented by (e), or a structure containing (f) in the main chain.

(In the formula, l is an integer of 1 or more, m is 0 or an integer of 1 to 2, and X in (a) to (e) is any one of the formulae shown in the above "Chemical 3", in ( f) is any one of the formulae shown in "Chemical 3" above, or does not exist, Y ₁ and Y ₂ are each independently -CO- or SO ₂ -, and l is preferably an integer of 10 or less).

Examples of the benzene ring, condensed ring and heterocyclic ring shown in the above "Chemical 3" include phenyl, substituted phenyl, benzyl, substituted benzyl, naphthyl, substituted naphthyl, anthryl, substituted anthryl, Anthraquinone, substituted anthraquinone, acridine, substituted acridine, azobenzene, substituted azobenzene, fluorime, substituted fluoroamine, fluorimone, substituted fluoroketone, carbazole, Substituted carbazole, N-alkylcarbazole, benzofuran, substituted benzofuran, phenanthrene, substituted phenanthrene, pyrene and substituted pyrene. When the exemplified substituent further has a substituent, the substituent is selected from For example, alkyl groups, aryl groups, halogen atoms, alkoxy groups, nitro groups, aldehydes, cyano groups, amides, dialkylamino groups, sulfonamides, imines, carboxylic acids, carboxylic acid esters, sulfonic acids, Sulfonate, alkylamino and arylamino groups.

Among the substituents shown in "Chemical 3" above, examples of the fifth substituent having two phenyl groups and Z is -SO ₂ -include bis(2,4-dihydroxyphenyl) sulfide, Bis(3,4-dihydroxyphenyl) clump, bis(3,5-dihydroxyphenyl) clump, bis(3,6-dihydroxyphenyl) clump, bis(4-hydroxyphenyl) clump, double (3-hydroxyphenyl) ash, bis(2-hydroxyphenyl) ash, and bis(3,5-dimethyl-4-hydroxyphenyl) ash, etc.

Among the substituents shown in "Chemical 3" above, examples of the fifth substituent having two phenyl groups and Z is -SO- include bis(2,3-dihydroxyphenyl)allenite, Bis(5-chloro-2,3-dihydroxyphenyl) sulfite, bis(2,4-dihydroxyphenyl) sulfite, bis(2,4-dihydroxy-6-methylphenyl) sulfite , Bis(5-chloro-2,4-dihydroxyphenyl) sulfene, bis(2,5-dihydroxyphenyl) sulfene, bis(3,4-dihydroxyphenyl) sulfene, bis(3 ,5-Dihydroxyphenyl) sulfene, bis(2,3,4-trihydroxyphenyl) sulfene, bis(2,3,4-trihydroxy-6-methylphenyl)-sulfene, double (5-Chloro-2,3,4-trihydroxyphenyl) sulfene, bis(2,4,6-trihydroxyphenyl) sulfene and bis(5-chloro-2,4,6-trihydroxybenzene Base) Yaqi and so on.

Among the substituents shown in the above "Chemical 3", as the fifth substituent with two phenyl groups and Z is -C(=O)-, an example is 2,4-dihydroxybenzophenone , 2,3,4-Trihydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2,2',5,6'-tetrahydroxybenzophenone, 2- Hydroxy-4-methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy- 4-methoxybenzophenone, 2,6-dihydroxy-4- Methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-amino-2'-hydroxybenzophenone, 4-dimethylamino -2'-hydroxybenzophenone, 4-diethylamino-2'-hydroxybenzophenone, 4-dimethylamino-4'-methoxy-2'-hydroxybenzophenone, 4 -Dimethylamino-2',4'-dihydroxybenzophenone and 4-dimethylamino-3',4'-dihydroxybenzophenone, etc.

When the above-mentioned structure is present in the side chain of the above-mentioned polymer, the proportion of the repeating unit containing the above-mentioned structure in the above-mentioned polymer is such that the light transmittance of the separation layer 2 is within the range of 0.001% or more and 10% or less. If the polymer is prepared so that the ratio is limited to this range, the separation layer 2 can sufficiently absorb light and can be surely and rapidly deteriorated. That is, the support body 1 can be easily removed from the sealing body 7, and the light irradiation time necessary for the removal can be shortened.

The above-mentioned structure can absorb light with a desired range of wavelength according to the selection of its kind. For example, the wavelength of light that can be absorbed by the above structure is more preferably within a range of 100 nm or more and 2,000 nm or less. Within this range, the wavelength of light that can be absorbed by the above-mentioned structure is on the shorter wavelength side, for example, within the range of 100 nm or more and 500 nm or less. For example, the structure described above can preferably degrade the polymer containing the structure by absorbing ultraviolet light having a wavelength in the range of about 300 nm or more and 370 nm or less.

The above-mentioned structure can absorb light from, for example, high-pressure mercury lamps (wavelength: above 254nm and below 436nm), KrF excimer laser (wavelength: 248nm), ArF excimer laser (wavelength: 193nm), F2 excimer laser (wavelength: : 157nm), XeCl laser (wavelength: 308nm), XeF laser (wavelength: 351nm) or solid UV laser (wavelength: 355nm), or These are g-line (wavelength: 436 nm), h-line (wavelength: 405 nm), i-line (wavelength: 365 nm), or the like.

The aforementioned separation layer 2 contains a polymer containing the aforementioned structure as a repeating unit, but the separation layer 2 may further contain components other than the aforementioned polymer. Examples of the components include fillers, plasticizers, and components that can improve the releasability of the support 1. These components are appropriately selected from the past known substances or materials that do not hinder the light absorption by the above-mentioned structure and the deterioration of the polymer, or can promote the absorption and deterioration.

(Inorganic)

The separation layer 2 may also be composed of an inorganic substance. The separation layer 2 is made of an inorganic substance and can be deteriorated by absorbing light. As a result, the strength or adhesiveness before light irradiation is lost. Therefore, by applying a slight external force (for example, pulling up the support 1 etc.), the separation layer 2 can be broken, and the support 1 and the sealing body 7 can be easily separated.

The above-mentioned inorganic substance should just be a structure which changes in quality by absorbing light, for example, at least one kind of inorganic substance selected from the group consisting of a metal, a metal compound, and carbon can be used suitably. The so-called metal compound means a compound containing a metal atom, such as a metal oxide or a metal nitride. The illustration of the inorganic substance is not limited to this, but it can be exemplified by the group consisting of gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon. More than one selected inorganic substance. In addition, the so-called carbon is also a concept that can contain isotopes of carbon, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, etc.

The above-mentioned inorganic substance absorbs light having a wavelength within a specific range according to its kind. By irradiating the separation layer 2 with light of a wavelength in the range absorbed by the inorganic substance used in the separation layer 2, the above-mentioned inorganic substance can be appropriately changed.

As the light irradiated to the separation layer 2 made of an inorganic substance, as long as it corresponds to the wavelength that the above-mentioned inorganic substance can absorb, for example, YAG laser, ruby laser, glass laser, YVO ₄ laser, LD laser, optical fiber can be suitably used. Solid lasers such as lasers, liquid lasers such as pigment lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electron lasers and other lasers , Or non-laser light.

The separation layer 2 made of an inorganic substance can be formed on the support 1 by conventional techniques such as sputtering, chemical vapor deposition (CVD), electroplating, plasma CVD, spin coating, and the like. The thickness of the separation layer 2 made of an inorganic substance is not particularly limited, as long as it is a film thickness that can sufficiently absorb the light used, but it is more preferably a film thickness in the range of 0.05 μm or more and 10 μm or less, for example. In addition, an adhesive may be applied to both sides or one side of an inorganic film (for example, a metal film) formed of an inorganic substance constituting the separation layer 2 in advance, and attached to the support 1.

Moreover, when a metal film is used as the separation layer 2, depending on the film quality of the separation layer 2, the type of laser light source, the laser output and other conditions, it can cause reflection of the laser or charge the film. Therefore, it is better to implement such countermeasures by disposing an anti-reflection film or an anti-static film on the upper and lower sides of the separation layer 2 or on one side thereof.

(Compounds with infrared absorbing structure)

The separation layer 2 may also be formed of a compound having an infrared absorbing structure. The compound deteriorates by absorbing infrared rays. As a result of the deterioration of the compound, the separation layer 2 loses its strength or adhesiveness before being irradiated with infrared rays. Therefore, by applying a slight external force (for example, pulling up the support 1 etc.), the separation layer 2 can be broken, and the support 1 and the sealing body 7 can be easily separated.

The structure with infrared absorption or the compound containing the structure with infrared absorption can be, for example, alkanes, alkenes (vinyl, trans, cis, vinylidene, tri-substituted, tetra-substituted, conjugated, cumulene, Cyclic), alkynes (monosubstituted, disubstituted), monocyclic aromatics (benzene, monosubstituted, disubstituted, trisubstituted), alcohols and phenols (free OH, intramolecular hydrogen bonds, intermolecular hydrogen bonds, saturated Secondary, saturated tertiary, unsaturated secondary, unsaturated tertiary), acetals, ketals, aliphatic ethers, aromatic ethers, vinyl ethers, ethylene oxide cyclic ethers, peroxide ethers, ketones Type, dialkylcarbonyl, aromatic carbonyl, 1,3-diketone enol, o-hydroxyaryl ketone, dialkyl aldehyde, aromatic aldehyde, carbonic acid (dimer, carbonate anion), formate , Acetate, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic hydrochloride, aromatic hydrochloride, acid anhydride (conjugated, non-co Yoke, cyclic, acyclic), primary amine, secondary amine, internal amine, primary amine (aliphatic, aromatic), secondary amine (aliphatic, aromatic), tertiary amine (aliphatic) , Aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carboxyimid, aliphatic isonitrile, aromatic isonitrile, isocyanate, thiocyanate Acid esters, aliphatic isothiocyanates, aromatic isothiocyanates, aliphatic nitro compounds, aromatic nitro compounds, nitroamines, nitrosamines, nitrates, nitrites, nitroso Nitro bond (aliphatic, aromatic, monomer, dimer), thiol and thiophene, and thiol acid and other sulfur compounds, thiocarbonyl, sulfonium, sulfonium chloride, primary sulfonamide, secondary Sulfonamide, sulfate ester, carbon-halogen bond, Si-A ¹ bond (A ¹ is H, C, O or halogen), PA ² bond (A ² is H, C or O), or Ti-O bond.

The structure containing the above-mentioned carbon-halogen bond is enumerated, for example, -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=CF ₂ , fluorinated aromatic And chlorinated aryl groups.

The above-mentioned structures containing Si-A ¹ bonds are listed as SiH, SiH ₂ , SiH ₃ , Si-CH ₃ , Si-CH ₂ -, Si-C ₆ H ₅ , SiO-aliphatic, Si-OCH ₃ , Si-OCH ₂ CH ₃ , Si-OC ₆ H ₅ , Si-O-Si, Si-OH, SiF, SiF ₂ and SiF ₃ etc. The structure containing the Si-A ¹ bond preferably forms a siloxane skeleton and a silsesquioxane skeleton.

The structure containing the above PA ² bond is listed as PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , A ³ ₃ -PO (A ³ is aliphatic or aromatic), (A ⁴ O ) _3- PO (A ⁴ is an alkyl group), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH and O=P-OH, etc.

The above-mentioned structure can absorb infrared light having a wavelength in a desired range according to the selection of its kind. Specifically, the wavelength of the infrared ray that can be absorbed by the above structure is, for example, within the range of 1 μm or more and 20 μm or less, and it can be better absorbed within the range of 2 μm or more and 15 μm or less. In addition, when the above-mentioned structure is a Si-O bond, Si-C bond, and Ti-O bond, it may be within a range of 9 μm or more and 11 μm or less. Moreover, those skilled in the art can easily understand the wavelength of infrared rays that can be absorbed by each structure. For example, the absorption band in each structure can refer to the non-patent literature: SILVERSTEIN. BASSLER. MORRILL The description of "Identification Method Using Organic Compound Spectra (5th Edition)-Combination of MS, IR, NMR, and UV -" (issued in 1992) pages 146 to 151.

The compound having an infrared-absorbing structure used in the formation of the separation layer 2 is not particularly limited as long as it is a compound having a structure as described above, which is soluble in the solvent used for coating and can be cured to form a solid layer. However, in terms of effectively changing the quality of the compound in the separation layer 2 and facilitating the separation of the support 1 and the sealing body 7, it is better to increase the absorption of infrared rays in the separation layer 2, that is, to irradiate the separation layer 2 with infrared rays. The infrared transmittance of the time is low. Specifically, the infrared transmittance in the separation layer 2 is preferably less than 90%, and the infrared transmittance is more preferably less than 80%.

If an example is given, as a compound having a siloxane skeleton, for example, a resin of a copolymer of a repeating unit represented by the following chemical formula (5) and a repeating unit represented by the following chemical formula (6), or the following chemical formula ( 5) Resins representing the repeating units and copolymers derived from the repeating units of acrylic compounds.

(In the chemical formula (6), R ⁶ is hydrogen, an alkyl group with a carbon number of 10 or less, or an alkoxy group with a carbon number of 10 or less).

Among them, the compound having a siloxane skeleton is more preferably tertiary butyl styrene (TBST)-dimethyl styrene (TBST)-a copolymer of the repeating unit represented by the above chemical formula (5) and the repeating unit represented by the following chemical formula (7) The silicone copolymer is more preferably a TBST-dimethylsiloxane copolymer comprising the repeating unit represented by the above formula (5) and the repeating unit represented by the following chemical formula (7) in 1:1.

In addition, the compound having a silsesquioxane skeleton can use, for example, a resin of a repeating unit represented by the following chemical formula (8) and a copolymer of the repeating unit represented by the following chemical formula (9).

(In the chemical formula (8), R ⁷ is hydrogen or an alkyl group with 1 to 10 carbon atoms, and in the chemical formula (9), R ⁸ is an alkyl group with 1 to 10 carbon atoms, or a phenyl group).

In addition to compounds having a silsesquioxane skeleton, Japanese Patent Application Publication No. 2007-258663 (published on October 4, 2007) and Japanese Patent Application Publication No. 2010-120901 (2010 June Released on March 3), Various silsesquioxane resins disclosed in Japanese Patent Application Publication No. 2009-263316 (published on November 12, 2009) and Japanese Patent Application Publication No. 2009-263596 (published on November 12, 2009).

Among them, the compound having a silsesquioxane skeleton is more preferably a copolymer of a repeating unit represented by the following chemical formula (10) and a repeating unit represented by the following chemical formula (11), and more preferably 7:3 containing the following chemical formula (10) A copolymer of the repeating unit represented by the following chemical formula (11).

The polymer with silsesquioxane skeleton has random structure, The ladder structure and cage structure can be any structure.

Furthermore, compounds containing Ti-O bonds are exemplified by (i) tetra-isopropoxide titanium, tetra-n-butoxide titanium, tetrakis (2-ethylhexyloxy) titanium, and titanium isopropoxide octanediol, etc. Titanium alkoxide; (ii) di-isopropoxy. Chelated titanium such as bis(acetylacetonyl) titanium and propanedioxytitanium bis(ethyl acetylacetate); (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O-] _n -iC ₃ H ₇ , and nC ₄ H ₉ O-[-Ti(OnC ₄ H ₉ ) ₂ -O-] _n -nC ₄ H ₉ and other titanium polymers; (iv) three- Titanium n-butoxide monostearate, titanium stearate, titanium diisopropoxide diisostearate, and (2-n-butoxycarbonylbenzyloxy) titanium tributoxide, etc. Titanium; (v) di-n-butoxy. Water-soluble titanium compounds such as bis(triethanolamine) titanium, etc.

Among them, the compound containing a Ti-O bond is preferably di-n-butoxy. Bis(triethanolamine) titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH) ₂ ] ₂ ).

The aforementioned separation layer 2 contains a compound having an infrared absorbing structure, but the separation layer 2 may further contain components other than the aforementioned compounds. As for the components, fillers, plasticizers, and components that can improve the releasability of the support 1 are exemplified. These components can be appropriately selected from the past known substances or materials that do not hinder the infrared absorption and compound deterioration of the above-mentioned structure, or promote the absorption and deterioration.

(Infrared absorbing material)

The separation layer 2 may contain an infrared absorbing substance. The separation layer 2 is formed by containing an infrared absorbing material, and can be deteriorated by absorbing light, and as a result, the strength or adhesiveness before being irradiated with light is lost. Therefore, by applying a little An external force (for example, pulling up the support 1 etc.) can destroy the separation layer 2 so that the support 1 and the sealing body 7 can be easily separated.

The infrared absorbing substance may be any structure that changes its quality by absorbing infrared rays, and carbon black, iron particles, or aluminum particles can be preferably used, for example. The infrared absorbing material absorbs light with a wavelength within a specific range according to its type. By irradiating the separation layer 2 with light having a wavelength in the range absorbed by the infrared absorbing material used in the separation layer 2, the infrared absorbing material can be better deteriorated.

(Reactive polysilsesquioxane)

The separation layer 2 can be formed by polymerization of reactive polysilsesquioxane, whereby the separation layer 2 has high chemical resistance and high heat resistance.

In this specification, the so-called reactive polysilsesquioxane is a polysilsesquioxane having a silanol group or a functional group that can be hydrolyzed to form a silanol group at the end of the polysilsesquioxane skeleton, by The silanol groups or functional groups that can form silanol groups are condensed and can be polymerized with each other. In addition, as long as the reactive polysilsesquioxane has a silanol group or a functional group capable of forming a silanol group, a silsesquioxane skeleton having a random structure, a cage structure, a step structure, etc. can be used.

In addition, the reactive polysilsesquioxane more preferably has a structure represented by the following formula (12).

In the formula (12), R" is independently selected from the group consisting of hydrogen and an alkyl group having a carbon number of 1 or more and 10 or less, and is more preferably selected from the group consisting of hydrogen and an alkyl group having a carbon number of 1 or more and 5 or less. If R" is hydrogen or an alkyl group having 1 to 10 carbon atoms, the separation layer 2 can be heated in the forming step to appropriately condense the reactive polysilsesquioxane represented by the formula (12).

In formula (12), p is preferably an integer of 1 or more and 100 or less, more preferably an integer of 1 or more and 50 or less. Reactive polysilsesquioxanes have the repeating unit represented by formula (12), and can form higher Si-O bond content than those formed by other materials, infrared (0.78μm or more, 1000μm or less), better Far infrared rays (3 μm or more, 1000 μm or less), and more preferably a separation layer 2 having a high absorbance with a wavelength of 9 μm or more and 11 μm or less.

In addition, in the formula (12), R'is each independently an organic group which is the same or different from each other. Here, R'is, for example, an aryl group, an alkyl group, an alkenyl group, etc., and these organic groups may have a substituent.

When R'is an aryl group, phenyl, naphthyl, anthryl, phenanthryl, etc. can be exemplified, and phenyl is more preferred. In addition, the aryl group can also be bonded to the polysilsesquioxane skeleton through an alkylene having 1 to 5 carbon atoms.

When R'is an alkyl group, examples of the alkyl group include linear, branched, or cyclic alkyl groups. When R'is an alkyl group, the carbon number is preferably from 1 to 15, more preferably from 1 to 6. And when R is a cyclic alkyl group, it may also be an alkyl group having a monocyclic or di- to tetracyclic structure.

When R'is an alkenyl group, as in the case of an alkyl group, linear, branched, or cyclic alkenyl groups can be exemplified. The alkenyl group preferably has 2 to 15 carbon atoms, more preferably 2 to 6. When R'is a cyclic alkenyl group, it may also be an alkenyl group having a monocyclic or di- to tetracyclic structure. Examples of alkenyl groups include vinyl and allyl groups.

In addition, examples of substituents that R'may have include a hydroxyl group, an alkoxy group, and the like. When the substituent is an alkoxy group, linear, branched, or cyclic alkoxy groups can be exemplified, and the number of carbon atoms in the alkoxy group is preferably 1-15, more preferably 1-10.

Furthermore, in one viewpoint, the content of silicone in the reactive polysilsesquioxane is preferably 70 mol% or more and 99 mol% or less, more preferably 80 mol% or more and 99 mol% or less . If the siloxane content in the reactive polysilsesquioxane is 70 mol% or more and 99 mol% or less, it can be formed by irradiating infrared rays (preferably far infrared rays, and more preferably with a wavelength of 9 μm or more, 11μm or less light) and the separation layer 2 is better degraded.

Moreover, in one viewpoint, the weight average molecular weight (Mw) of the reactive polysilsesquioxane is preferably 500 or more and 50,000 or less, more preferably 1,000 or more and 10,000 or less. If the weight average molecular weight (Mw) of the reactive polysilsesquioxane is 500 or more and 50,000 or less, it can be better dissolved in a solvent and can be better coated on a support.

Commercial products that can be used as reactive polysilsesquioxanes can be, for example, SR-13, SR-21, SR-23, SR-33 manufactured by Konishi Chemical Industry Co., Ltd., and the like.

[Embodiment 2]

The other embodiment (Embodiment 2) of the present invention will be explained as follows. In addition, for the convenience of description, members having the same functions as those described in the foregoing embodiment are denoted by the same reference numerals and their description is omitted. The manufacturing method of the sealing body of the second embodiment is to sequentially perform the separation layer forming step, the separation layer peripheral part removal step, the subsequent layer forming step, the sealing body forming step, the subsequent layer removing step, the light irradiation step, the separating step, and the removing step.

(Separation layer formation step ~ next layer formation step)

As shown in (a) to (c) of FIG. 2, the separation layer forming step, the separation layer peripheral part removal step, and the subsequent layer forming step are the same as in the first embodiment, so their description is omitted.

(Steps of forming a sealing body)

As shown in (d) to (g) of FIG. 2, in the sealing body forming step, the sealing body 7 is formed on the adhesive layer 3. In the sealing body forming step in this embodiment, the component placement step, the sealing step, the thinning step, and the wiring layer forming step are sequentially performed.

As shown in Figure 2(d), in the component placement step, in the following Component 5 is arranged on layer 3. The placement of the components 5 on the adhesive layer 3 can be performed using, for example, a wafer mounter.

As shown in FIG. 2(e), in the sealing step, the sealing material 6 is used to seal the element 5. The sealing material 6 can be injection-molded using a molding die, for example, or can be coated by a method such as spin coating, dipping, roll knife, spray coating, and slit coating.

As shown in FIG. 2(f), in the thinning step, the sealing material 6 is thinned. The sealing material 6 may be thinned to expose the terminal portion of the element 5 from the sealing material 6, for example.

As shown in FIG. 2(g), the wiring layer 4 is formed on the element 5 sealed by the sealing material 6 in the wiring layer forming step.

In one embodiment, as a procedure for forming the wiring layer 4, first, a _{dielectric layer of silicon oxide (SiO x} ), photosensitive resin, or the like is formed on the element 5 sealed by the sealing material 6. The dielectric layer made of silicon oxide can be formed by, for example, sputtering, vacuum evaporation, or the like. The dielectric layer made of the photosensitive resin can be formed by applying the photosensitive resin by methods such as spin coating, dipping, roll knife, spray coating, and slit coating.

Next, on the dielectric layer, wiring is formed from a conductor such as metal. As a method for forming wiring, conventional semiconductor manufacturing methods such as photolithography (resist lithography), lithography processing, etching processing, and the like can be used.

From the above, the sealing body 7 can be formed on the support 1 smoothly and well. In this embodiment, as in the first embodiment, since the separation layer 2 is protected by the adhesive layer 3, it is possible to prevent the chemical solution from contacting the separation layer 2. And by following The layer 3 protects the separation layer 2, and can also protect the separation layer 2 from influences other than the liquid medicine. Thereby, in the sealing body forming step, the separation layer 2 can be prevented from peeling off.

In addition, the laminated body 9 shown in (g) of FIG. 2 obtained by the above steps is a support body 1 through which light is transmitted, a separation layer 2, a bonding layer 3, and a sealing body 7 that are changed in quality by irradiating light. As a result, the sealing body 7 includes a wiring layer 4, an element 5 mounted on the wiring layer 4, a sealing material 6 for the sealing element 5, and the separation layer 2 is covered by an adhesive layer 3 except for the part in contact with the support 1. Such a laminated body 9 is manufactured only in the process of the sealing body manufacturing method of the present invention, so it can be better used to manufacture a separate sealing body 7.

(Next layer removal step~removal step)

As shown in Figure 2 (h) ~ (k), the subsequent layer removal step, light irradiation step, separation step, and removal step have different directions in the upper and lower directions of the sealing body 7, but the other parts are the same as in the first embodiment, so they are omitted Its description.

From the above, in the same manner as in the first embodiment, a separate sealing body 7 can be obtained. Furthermore, the sealing body 7 may also be subjected to processing such as solder ball formation and cutting processing. In addition, other components may be laminated on the sealing body 7.

And, as in the first embodiment, (i) by making the outer diameter of the molding die of the sealing body 7 smaller than the support body 1, the sealing body 7 with a smaller outer diameter than the support body 1 is formed, or (ii) the sealing body After forming, the sealing body 7 can also be fully cut and trimmed to make it smaller than the outer diameter of the support body 1.

The present invention is not limited to the above-mentioned embodiments, and various changes can be made within the scope of the patent application. The embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included in this The technical scope of the invention.

[Industrial availability]

The support separation method of the present invention can be better used in the manufacturing steps of miniaturized semiconductor devices.

1‧‧‧Support

1a‧‧‧Plane

1b‧‧‧peripheral part

2‧‧‧Separation layer

2a‧‧‧peripheral end

3‧‧‧Next layer

4‧‧‧Wiring layer

5‧‧‧Component

6‧‧‧Sealing material

7‧‧‧Sealing body

8‧‧‧Laminated body

Claims (7)

A method for manufacturing a sealing body, which is a method for manufacturing a sealing body including a wiring layer, an element mounted on the wiring layer, and a sealing material for sealing the element, which is characterized by being included on one side of a light-transmitting support The separation layer forming step of forming a separation layer that is degraded by irradiating light on the flat portion, the separation layer peripheral portion removal step of removing the separation layer formed on the entire circumference of the support body, and the removal of the entire circumference portion of the support body An adhesive layer is formed on the surface on the side of the peripheral separation layer, whereby the adhesive layer forming step of covering the formed adhesive layer except for the part in contact with the support of the separation layer, and forming the above-mentioned adhesive layer on the above-mentioned adhesive layer The sealing body forming step of the sealing body. The method for manufacturing a sealed body according to claim 1, wherein after the sealing body forming step, it further includes an adhesive layer removal step of removing the adhesive layer formed on the entire circumference of the support body. The method for manufacturing a sealed body according to claim 2, wherein in the adhesive layer removing step, the adhesive layer formed on the outer peripheral end of the separation layer formed on the support is removed. Such as the manufacturing method of the sealing body of claim 2 or 3, wherein the following After the layer removal step, it further includes a light irradiation step of irradiating light to the separation layer through the support body to change the quality of the separation layer, and a separation step of separating the support body and the sealing body after the light irradiation step. The method for manufacturing a sealed body according to claim 4, wherein after the separation step, it further includes a removal step of removing the adhesive layer and the separation layer remaining in the sealed body. The method of manufacturing a sealed body according to claim 1, wherein the sealing body forming step includes forming the wiring layer on the adhesive layer, mounting the element on the wiring layer, and sealing the element with the sealing material. The method of manufacturing a sealed body according to claim 1, wherein the sealing body forming step includes arranging the element on the adhesive layer, sealing the element with the sealing material, and forming the wiring on the element sealed by the sealing material Floor.

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