TWI752230B - Manufacturing method of laminated body, manufacturing method of electronic device, laminated body, and laminated body manufacturing system - Google Patents

Abstract

An object of the present invention is to suppress the separation layer from being easily peeled off, so that subsequent processing can be smoothly performed, and a laminate or an electronic device can be easily produced. The solution of the present invention is a method for producing a laminate, which produces a layer obtained by laminating a rectangular glass support (10) and a separation layer (20) degraded by light absorption or heating The method of integrating the body (50), further comprising: a separation layer forming process S01, in which the separation layer (20) is formed in such a way that the end portion (20a) is separated from the end portion (10e) of the glass support body (10). on the central part of the glass support (10).

Description

Manufacturing method of laminated body, manufacturing method of electronic device, laminated body, and laminated body manufacturing system

The present invention relates to a method for manufacturing a laminate, a method for manufacturing an electronic device, a laminate, and a system for manufacturing the laminate.

In recent years, as an example of a method of manufacturing an electronic device, a method called a so-called fan-out PLP (Fan-out Panel Level Package) technique has been known. In the fan-out PLP technology, for example, a separation layer degenerated by light absorption or heating is formed on a plate-shaped support, and a substrate having electronic components is laminated thereon. Then, light or heat is applied to the separation layer to separate the substrate from the support, and the substrate is cut into individual electronic components to obtain an electronic device. As a support, it is also proposed to use a rectangular glass support, and in the fan-out PLP technology using such a glass support, the liquid for forming the separation layer is passed through a slit nozzle or the like. It is apply|coated to a glass support body, it is made to dry, and a separation layer is formed on a glass support body (for example, refer patent document 1 and patent document 2).

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 9-29167

[Patent Document 2] Japanese Patent Laid-Open No. 2002-186893

In the fan-out PLP technology, in order to improve the yield, substrates including electronic components are widely formed on a glass support. In this case, since the board|substrate was peeled from the glass support body, it is presumed that the separation layer was formed up to the edge part of the glass support body. However, when the separation layer is formed up to the end of the glass support, the adhesion between the separation layer and the glass support becomes low at the end of the glass support, and the separation layer is easily peeled off. There is a problem that the processing after the formation of the separation layer is hindered. In particular, when a liquid material is applied to form a separation layer, the separation layer becomes thick and rigid at the ends, and the separation layer is stretched toward the center as the liquid material dries. There is a problem that it becomes easy to peel off from the end. In addition, when the separation layer is formed by applying the liquid material on the glass support from the slit nozzle or the like, even if the application of the liquid material is stopped in front of the end of the glass support, the liquid material will remain in the glass support. The glass support spreads upward to form a separation layer in a state of reaching the end, and the separation layer is easily peeled off in the same manner as described above.

In view of the above-mentioned circumstances, the present invention is to provide a method for producing a laminate that can improve the adhesion between the glass support and the separation layer, suppress the separation layer from being easily peeled off, and enable smooth subsequent processing, Manufacturing method of electronic device, laminate, and laminate manufacturing system as purpose.

In an aspect of the present invention, there is provided a method for producing a laminate, which produces a rectangular glass support and is transformed into a state that can be destroyed by an external force by absorbing or heating light, or A method of laminating a separated layer in a state in which the adhesive force between the layers connected to other layers is reduced, comprising: a separation layer forming process of separating the layers so that the end The central part formed on the glass support in such a way that the part is separated from the end part of the glass support; and the subsequent layer forming process, after the separation layer forming process, is on the side where the glass support of the separation layer does not exist, so as to be consistent with the separation layer forming process. The adhesive layer is formed so that the separation layers are joined to each other, and the adhesive layer is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer.

In an aspect of the present invention, there is provided a method for producing a laminate, which produces a rectangular glass support and is transformed into a state that can be destroyed by an external force by absorbing or heating light, or A method of laminating a separated layer in a state in which the adhesive force between the layers connected to other layers is reduced, comprising: a separation layer forming process of separating the layers so that the end The center part on the glass support body is formed in such a way that the part is separated from the end part of the glass support body; and the substrate forming process is performed after the separation layer forming process, and the electronic parts are formed on the side where the glass support body of the separation layer does not exist. The substrate, the substrate, is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer.

In an aspect of the present invention, there is provided a laminate in which a rectangular glass support and a glass support are transformed into a state capable of being destroyed by external force by absorbing or heating light, or in a state that is compatible with other components. It is formed by stacking the separation layers in a state where the bonding force between the connected layers is reduced, and it is characterized in that: the central part on the glass support body is provided with a separation layer, the separation layer, and the end part is from the end part of the glass support body. Separation, on the side where the glass support of the separation layer does not exist, the adhesive layer is formed so as to be bonded to the separation layer, and the adhesive layer is formed in the separation layer in a state where the end portion is separated from the end portion of the separation layer. layer.

In an aspect of the present invention, there is provided a laminate in which a rectangular glass support and a glass support are transformed into a state capable of being destroyed by external force by absorbing or heating light, or in a state that is compatible with other components. It is formed by stacking the separation layers in a state where the bonding force between the connected layers is reduced, and it is characterized in that: the central part on the glass support body is provided with a separation layer, the separation layer, and the end part is from the end part of the glass support body. In separation, a substrate having electronic components is formed on the side where the glass support of the separation layer does not exist, and the substrate is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer.

In an aspect of the present invention, there is provided a laminated body manufacturing system that manufactures a rectangular glass support and is transformed into a state that can be destroyed by external force by absorbing or heating light, or A system of laminates formed by laminating separation layers in a state in which the bonding force between the other adjoining layers is reduced, characterized by comprising: separation layer forming means for forming the separation layer at the end from the separation layer. a center portion formed on a glass support in a state where the ends of the glass support are separated; and an adhesive layer forming device tied to the separation After the layer is formed, on the side where the glass support of the separation layer does not exist, an adhesive layer is formed in such a way that the separation layer is bonded to each other, and the adhesive layer forming apparatus is used to attach the adhesive layer at the end from the end of the separation layer. It is formed on the separation layer in a separated state.

In an aspect of the present invention, there is provided a laminated body manufacturing system that manufactures a rectangular glass support and is transformed into a state capable of being destroyed by external force by absorbing or heating light, or A system of laminates formed by laminating separation layers in a state in which the bonding force between the other adjoining layers is reduced, characterized by comprising: separation layer forming means for forming the separation layer at the end from the separation layer. a center portion formed on the glass support with the ends of the glass support separated; and a substrate forming apparatus for forming a substrate with electronic parts on the side where the glass support of the separation layer does not exist after the separation layer is formed The substrate forming apparatus forms the substrate on the separation layer in a state where the end portion is separated from the end portion of the separation layer.

In a first aspect of the present invention, there is provided a method for producing a laminate in which a rectangular glass support and a separation layer degraded by light absorption or heating are laminated. The method of forming a body, further comprising: a separation layer forming process of forming the separation layer on the central portion of the glass support so that the end portion thereof is separated from the end portion of the glass support.

In a second aspect of the present invention, there is provided a method of manufacturing an electronic device, which includes the steps of manufacturing a laminate by the method of manufacturing a laminate as described above, and deteriorating the separation layer, And the step of separating the said glass support body from the said laminated body.

In a third aspect of the present invention, there is provided a laminate comprising a rectangular glass support and a separation layer degraded by light absorption or heating, on the glass support. The center part of the said separation layer is provided with the said separation layer, and the edge part of this separation layer is separated from the edge part of the said glass support body.

In a fourth aspect of the present invention, there is provided a laminate production system that produces a laminate formed by laminating a rectangular glass support and a separation layer degraded by light absorption or heating The system includes: a separation layer forming device for forming the separation layer on the central part of the glass support body in a state where the end part is separated from the end part of the glass support body.

According to the present invention, since the end portion of the separation layer is formed in the center portion of the glass support body in a state of being separated from the end portion of the glass support body, the adhesion between the glass support body and the separation layer is improved by improving Further, it is possible to suppress the separation layer from being easily peeled off, so that subsequent processing can be smoothly performed, and a laminate or an electronic device can be easily produced.

L: light

L1, L2, L3, L4, LX1, LX2, LX3, LX4: Distance

M: mask

M1, M2, M3, M4, MX1, MX2, MX3, MX4: Distance

Q1, Q2: liquid

S: solvent

10: Glass support

10a, 10b, 10c, 10d, 20a, 20b, 20c, 20d, 30a, 30b, 30c, 30d: edge

10e, 20e, 30e, 40e: end

10f: Separation layer forming surface

10g: peripheral part

10r: Bottom surface

20: Separate layers

20f: Next layer forming surface

30: Next layer

30f: Substrate forming surface

40: Substrate

41: Electronic Parts

42: Mold sealing

42a: Above

50: Laminate

51: Electronic Devices

60, 61, 62: Slit nozzle

61a, 62a: Opening part

70: stage

80: Nozzle control section

90: Separation layer forming device

91: Subsequent layer forming device

92: Substrate forming device

93: Sealing mold grinding device

94: Separation layer metamorphism device

95: Glass support peeling device

96: Subsequent layer removal device

100: Laminated Manufacturing Systems

[FIG. 1] It is a flowchart which shows an example of the manufacturing method of the electronic device of embodiment.

[FIG. 2] (A) and (B) are diagrams showing a process of a manufacturing method of an electronic device.

[FIG. 3] (A) to (C) are diagrams showing a process of a manufacturing method of an electronic device following FIG. 2. FIG.

[FIG. 4] (A) and (B) are diagrams showing a process of a manufacturing method of an electronic device following FIG. 3. FIG.

[FIG. 5] (A) and (B) are diagrams showing a process of a manufacturing method of an electronic device following FIG. 4. FIG.

[FIG. 6] It is a perspective view which shows an example of the separation layer formation apparatus of embodiment.

[Fig. 7] (A) and (B) are diagrams showing an example of the separation layer formation process.

[FIG. 8] (A) and (B) are diagrams showing an example of a separation layer formation process following FIG. 7. FIG.

[Fig. 9] is a diagram showing an example of the separation layer formation process.

[FIG. 10] It is a figure which shows an example of an adhesive layer formation process.

[FIG. 11] It is a figure which shows an example of an adhesive layer formation process.

[FIG. 12] (A) and (B) are diagrams showing another example of the method for producing the laminate.

[FIG. 13] (A) and (B) are figures which show another example of the manufacturing method of a laminated body.

[FIG. 14] (A) to (C) are engineering drawings showing another example of the manufacturing method of the laminated body.

[FIG. 15] An example of the laminated body manufacturing system of the embodiment is shown A block diagram of an intentional display.

[FIG. 16] (A) to (C) are tables showing the results of the peel test of Examples.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Hereinafter, in the drawings, in order to make each structure easier to understand, a part is emphasized or a part is simplified and shown, and it may differ from an actual structure, a shape, a scale, etc. in some cases.

FIG. 1 is a flowchart showing an example of the manufacturing method of the electronic device of the embodiment. In the present embodiment, the electronic device is manufactured by the so-called fan-out PLP technology. As shown in FIG. 1, the manufacturing method of the electronic device according to the embodiment includes: separation layer formation process (step S01), adhesive layer formation process (step S02), substrate formation process (step S03), and mold polishing Process (step S04), separation layer modification process (step S05), glass support peeling process (step S06), and adhesive layer removal process (step S07).

FIG. 2 to FIG. 5 are diagrams showing an example of the process for the manufacturing method of the electronic device according to the embodiment. Hereinafter, in FIGS. 2 to 5, the directions in the drawings are described using the XYZ coordinate system. In this XYZ coordinate system, the surface parallel to the separation layer formation surface in which the separation layer is formed in the glass support is set as the XY plane. One direction parallel to this XY plane (for example, the short side direction of the glass support) is represented as the X square In the direction, the direction orthogonal to the X direction (for example, the longitudinal direction of the glass support) is expressed as the Y direction. In addition, a direction perpendicular to the XY plane is expressed as the Z direction. That is, the normal line direction of the separation layer forming surface is the Z direction. Each of the X direction, the Y direction, and the Z direction will be described so that the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction.

<Separation layer formation process>

In the separation layer formation process S01 , for example, as shown in FIGS. 2(A) and (B), the separation layer 20 is formed on the separation layer formation surface 10f of the rectangular glass support 10 . The separation layer forming surface 10f is flat. Moreover, in the separation layer forming process S01, the separation layer 20 is formed on the separation layer forming surface 10f of the glass support 10 so that the end 20e of the separation layer 20 is separated from the end 10e of the glass support 10 The central portion of the laminate 50 is thereby formed. In addition, the glass support 10 uses, for example, a glass plate having a thickness of 500 to 1500 μm or the like, is placed on the stage portion 70 (see FIG. 6 ) or the like and is adsorbed, and the separation layer forming surface 10f is formed. It is held in the state set to a specific flatness.

In the example shown in FIGS. 2(A) and (B), the separation layer 20 is formed in a rectangular shape. In addition, the separation layer 20 is not limited to a rectangular shape, and may be other shapes. For example, the separation layer 20 may be formed in a circular shape, an oval shape, an oval shape, or a polygonal shape other than a rectangle. When the separation layer 20 is formed in a rectangular shape, the separation layer 20 has four end sides 20a, 20b, 20c, and 20d as the end portion 20e. End edge 20a~20d, It is arrange|positioned in parallel with the edge 10a, 10b, 10c, 10d which is the edge part 10e of the glass support body 10, respectively.

The edge 20a of the separation layer 20 is arranged at a distance L1 from the edge 10a of the glass support 10 . The edge 20b of the separation layer 20 is arranged at a distance L2 from the edge 10b of the glass support 10 . Moreover, the edge 20c of the separation layer 20 and the edge 10c of the glass support body 10 are arrange|positioned at a distance M1. The edge 20d of the separation layer 20 is arranged at a distance M2 from the edge 10d of the glass support 10 . The above-mentioned distances L1, L2, M1, and M2 may be respectively the same value, or may be different values from each other.

In addition, the above-mentioned distances L1, L2, M1, and M2, for example, can be set within the range of 0.1 mm to 10 mm, but are not limited to this range. By setting the value of the distances L1 , L2 , M1 , and M2 to be 0.1 mm or more, the effect of separating the end portion 20e of the separation layer 20 from the end portion 10e of the glass support 10 is more exhibited. In addition, by setting the above-mentioned value to be 10 mm or less, an appropriate area of the separation layer 20 can be secured, and a process with good yield can be constructed. In addition, although the film thickness of the separation layer 20 is formed so that it may become uniform or substantially uniform over the front surface, a part of the film thickness may be different. For example, the end portion 20e of the separation layer 20 may be thinner than the other portions, and the end portion 20e may be thicker than the other portions.

(Manufacturing example of separation layer)

FIG. 6 is a perspective view showing an example of the separation layer forming apparatus 90 according to the embodiment. As shown in FIG. 6, the separation layer forming apparatus 90 is The nozzle part 60 , the stage part 70 , and the control part 80 are provided. The nozzle portion 60 is held by a holder or the like, not shown, and is movable relative to the stage portion 70 . The nozzle part 60 can discharge the liquid for forming the separation layer 20 from the opening part (slit). The stage portion 70 has a stage on which the glass support 10 can be placed. The control part 80 controls so that the liquid material may be applied from the nozzle part 60 to the glass support body 10 while moving the nozzle part 60 relative to the stage part 70 . In addition, the separation layer forming apparatus 90 may have a structure in which the nozzle part 60 is fixed and the stage part 70 is moved, or a structure in which both the nozzle part 60 and the stage part 70 are moved.

FIGS. 7 to 9 are process diagrams showing the state in which the separation layer formation process S01 is performed by the separation layer formation apparatus 90 described above. In addition, before the separation layer forming process S01, as the nozzle part 60 of the separation layer forming apparatus 90, the slit nozzle 61 for discharging the liquid Q1 for forming the separation layer 20 is provided. The slit nozzle 61 has an opening 61 a for discharging the liquid for forming the separation layer 20 . In addition, in FIGS. 7-9, the stage part 70 is abbreviate|omitted. In addition, the operation of each part described below is based on the instruction from the control part 80 .

In the separation layer forming process S01, first, the glass support 10 is placed on the stage portion 70, and then, as shown in FIG. 7(A), the opening 61a of the slit nozzle 61 faces the glass support 10. The separation layer forming surface 10f is arranged. At this time, the opening part 61a is arrange|positioned at the position which is a predetermined distance LX1 from the edge 10a of the glass support body 10 as a discharge start position of the liquid Q1. Next, the liquid Q1 is discharged to the separation layer forming surface 10f from the opening 61a. Thereby, the liquid discharged from the opening 61a The shape body Q1 is in a state of being sandwiched between the opening 61a and the separation layer forming surface 10f.

Next, as shown in FIG. 7(B), the slit nozzle 61 moves in the X direction while discharging the liquid Q1 from the opening 61a. By this operation, the liquid Q1 is continuously discharged in the moving direction (+X direction) of the slit nozzle 61 , and the liquid Q1 is applied to the separation layer forming surface 10 f of the glass support 10 . In addition, the liquid Q1 spreads in the opposite direction (-X direction) to the moving direction of the slit nozzle 61 after the slit nozzle 61 moves in the +X direction. An end edge 20a which is one of the end portions 20e of the separation layer 20 is formed by the expansion of the liquid Q1.

Next, as shown in FIG. 8(A), the slit nozzle 61 stops moving when the opening 61a reaches a position at a distance LX2 from the edge 10b of the glass support 10, and stops moving from the opening. The discharge of the liquid Q1 of 61a. After that, as shown in FIG. 8(B) , the slit nozzle 61 is raised, and the opening 61 a is separated from the glass support 10 . When the predetermined distance LX2 is reached, the discharge of the liquid Q1 is stopped, but the opening 61 a is separated from the glass support 10 , whereby the liquid Q1 is directed to +X toward the edge 10 b of the glass support 10 . direction expansion. The edge 20b of the separation layer 20 is formed by the expansion of the liquid Q1. At this time, the distance LX2 is set so that the liquid Q1 does not spread to the end side 10b of the glass support body 10 .

In this way, the relative movement range of the glass support 10 and the slit nozzle 61 is adjusted by also taking into account the situation where the liquid Q1 spreads at both the positions of the start and stop of the discharge of the liquid Q1. so that the end sides 20a and 20b of the separation layer 20 can be separated by distances L1 and L2 from both end sides 10a and 10b of the glass support 10 in the moving direction (X direction).

Moreover, as shown in FIG. 9, when the slit nozzle 61 is moved while the liquid Q1 is discharged from the opening 61a of the slit nozzle 61, the liquid Q1 applied to the glass support 10 , extend in directions (Y direction) orthogonal to the moving direction of the slit nozzle 61 , that is, toward the edge 10c side (+Y direction) and 10d side (−Y direction) of the glass support 10 , respectively. The end sides 20c and 20d of the separation layer 20 are formed by the expansion of the liquid Q1.

In this case, with respect to the direction (Y direction) orthogonal to the moving direction of the slit nozzle 61, the length of the opening width of the opening 61a (the length in the Y direction) is adjusted so that -Y from the opening 61a is adjusted. The distance MY1 is set from the side edge to the edge 10c of the glass support 10, and the distance MY2 is set from the +Y side edge of the opening 61a to the edge 10d of the glass support 10. Thereby, from the both ends 10c and 10d of the glass support body 10 in the direction orthogonal to the moving direction, the end sides 20c and 20d of the separation layer 20 can be separated by the distances M1 and M2, respectively. The length of the opening width of the opening portion 61a may be adjusted by using a blocking member for closing a part of the opening portion 61a or the like, or a narrow opening portion 61a having a length corresponding to the Y direction of the glass support 10 may be used. Slit nozzle 61.

The above-mentioned separation layer 20 is formed of, for example, a material that is degraded by absorbing light. In the present embodiment, the degeneration of the separation layer 20 refers to a state in which the separation layer 20 can be broken by receiving a slight external force, or a state in which the adhesive force with the layer in contact with the separation layer 20 is reduced. separation layer 20. It is deteriorated by absorbing light, and the strength or the adhesion with respect to the glass support 10 is reduced compared to before the deterioration. Therefore, the degenerated separation layer 20 is broken or peeled off from the glass support 10 by applying a little external force (for example, lifting the glass support 10 , etc.).

The deterioration of the separation layer 20 can be caused by (exothermic or non-exothermic) decomposition, cross-linking, changes in steric configuration, or dissociation of functional groups caused by the energy of absorbed light (then, accompanied by these hardening, degassing, shrinking or expanding of the separation layer 20) and the like. The deterioration of the separation layer 20 occurs as a result of light absorption by the material constituting the separation layer 20 . Therefore, the type of modification of the separation layer 20 can be changed according to the type of the material constituting the separation layer 20 . In addition, the separation layer 20 is not limited to a material that changes in quality by absorbing light. For example, it may be a material that deteriorates by absorbing heat given regardless of light, or another material that is deteriorated by a solvent or the like.

The thickness of the separation layer 20 is, for example, more preferably 0.05 to 50 μm, and still more preferably 0.3 to 1 μm. As long as the thickness of the separation layer 20 falls within the range of 0.05 to 50 μm, by short-time light irradiation and low-energy light irradiation, or short-time heating, short-time immersion in a solvent, etc., Desirable deterioration can occur in the separation layer 20 . In addition, the thickness of the separation layer 20 is particularly preferably within a range of 1 μm or less from the viewpoint of productivity.

Hereinafter, the separation layer 20 which is degraded by the energy of absorbed light will be described. The separation layer 20 is preferably only formed of a material having a structure that absorbs light, but it can also be formed without impairing the essential properties. Within the range, a material that does not have a structure to absorb light is added to form the separation layer 20 . In addition, it is preferable to make the surface of the separation layer 20 on the side opposite to the adhesive layer 13 flat (without forming irregularities), thereby making it possible to easily form the separation layer 20, and also at the time of sticking. Attaches evenly.

The separation layer 20 may be modified by absorbing light irradiated from a laser. That is, the light irradiated to the separation layer 20 in order to change the quality of the separation layer 20 may be irradiated from a laser. Examples of lasers that emit light irradiated to the separation layer 20 include _{solid-state lasers such as YAG lasers, ruby lasers, glass lasers, YVO 4} lasers, LD lasers, and fiber lasers, and dyes. Liquid lasers such as lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electron lasers and other lasers, or non-lasers Wait. The laser that emits light to irradiate the separation layer 20 can be appropriately selected according to the material constituting the separation layer 20 , and only a laser that emits light of a wavelength that can degenerate the material constituting the separation layer 20 may be selected.

(Fluorocarbon)

The separation layer 20 can also be made of fluorocarbon. Since the separation layer 20 is made of fluorocarbon, it is configured to be degraded by absorbing light, and as a result, the strength or adhesiveness before being irradiated with light is lost. Therefore, by applying a little external force (for example, lifting the glass support body 10 , etc.) to destroy the separation layer 20 , the glass support body 10 and the substrate 40 can be easily separated. The fluorocarbon constituting the separation layer 20 can be suitably formed into a film by a plasma CVD (chemical vapor deposition) method.

Fluorocarbons absorb light in a specific range of wavelengths depending on their type. By irradiating the separation layer with light having a wavelength in a range that the fluorocarbon used in the separation layer 20 can absorb, the fluorocarbon can be appropriately modified. In addition, the absorption rate of light in the separation layer 20 is preferably 80% or more.

As the light irradiated to the separation layer 20, according to the wavelength that fluorocarbon can absorb, as long as it is appropriate to use, for example: YAG laser, ruby laser, glass laser, YVO ₄ laser, LD laser, fiber laser, etc. Solid-state lasers, liquid lasers such as pigment lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electron lasers, etc. Light or non-laser light can be used. Although it does not specifically limit as a wavelength which can change a fluorocarbon, For example, the range of 600 nm or less can be used.

(A polymer having a light-absorbing structure in its repeating unit)

The separation layer 20 may contain a polymer having a light-absorbing structure in its repeating unit. The polymer is degraded by light irradiation. The modification of the polymer is caused by the absorption of irradiated light by the above-mentioned structure. The separation layer 20 loses strength or adhesiveness before being irradiated with light as a result of polymer deterioration. Therefore, by applying a little external force (for example, lifting the glass support body 10 , etc.) to destroy the separation layer 20 , the glass support body 10 and the substrate 40 can be easily separated.

The above-mentioned structure having light-absorbing properties is a chemical structure for absorbing light and deteriorating the polymer containing the structure as a repeating unit. The structure, for example, contains substituted or unsubstituted benzene rings, condensed rings or heterocyclic rings A group of atoms formed by a ring of conjugated pi electrons. More specifically, the structure may be a Cardo structure, a diphenyl ketone structure, a diphenyl arylene structure, or a diphenyl arsenic structure (bisphenyl arsenic structure) existing in the side chain of the above-mentioned polymer. , diphenyl structure or diphenylamine structure.

When the above-mentioned structure exists in the side chain of the above-mentioned polymer, this structure can be represented by the following formula.

(in the formula, R is each independently an alkyl group, an aryl group, a halogen, a hydroxyl group, a keto group, a terylene group, a terylene group, or a N(R ¹ )(R ² ) group (here, R ¹ and R ^{2 are each independently} independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), Z is absent, or -CO-, -SO ₂ -, -SO- or -NH-, and n is an integer of 0 or 1 to 5).

In addition, the above-mentioned polymer, for example, is included in the following formula by the repeating unit represented by any one of (a) to (d), or represented by (e), or in the main The chain contains the construct of (f).

(in the formula, l is an integer of 1 or more, m is an integer of 0 or 1 to 2, X is any one of the formulas represented by the above chemical formula [Chemical formula 1] in (a) to (e), and in ( In f) any one of the formulas shown in the above [Formula 1], or there is no one, Y ₁ and Y ₂ are each independently -CO- or -SO _{2 -.} 1 is preferably an integer of 10 or less) .

Examples of the benzene ring, condensed ring and heterocyclic ring represented by the above chemical formula [Chem. 1] include phenyl, substituted phenyl, benzyl, substituted benzyl, naphthalene, substituted naphthalene, anthracene, substituted anthracene, Anthraquinones, Substituted Anthraquinones, Acridines, Substituted Acridines, Azobenzenes, Substituted Azobenzenes, Pyrene, Substituted Pyrenes, Pylenones, Substituted Pylenones, Carbazoles, Substituted Carbazoles, N-Alkylcarbazoles, Di Benzofuran, substituted dibenzofuran, phenanthrene, substituted phenanthrene, pyrene and substituted pyrene. In the case where the exemplified substituent further has a substituent, the substituent is, for example, selected from alkane group, aryl group, halogen atom, alkoxy group, nitro group, aldehyde, cyano group, amide, dialkylamine, sulfoamide, amide, carboxylic acid, carboxylate, sulfonic acid, sulfonate , alkylamine and arylamine.

Among the substituents represented by the above chemical formula [Chemical 1], examples of the fifth substituent having two phenyl groups and Z is -SO ₂ - include: bis(2,4- Dihydroxyphenyl) bis(3,4-dihydroxyphenyl) bis(3,4-dihydroxyphenyl) bis(3,5-dihydroxyphenyl) bis(3,6-dihydroxyphenyl) bis(3,6-dihydroxyphenyl) bis(4- Hydroxyphenyl) bismuth, bis(3-hydroxyphenyl) bismuth, bis(2-hydroxyphenyl) bismuth, and bis(3,5-dimethyl-4-hydroxyphenyl) bismuth, etc.

Among the substituents represented by the above-mentioned chemical formula [Chemical 1], as the fifth substituent having two phenyl groups and Z is -SO-, bis(2,3-di(2,3-di) is exemplified. Hydroxyphenyl) bis(5-chloro-2,3-dihydroxyphenyl) bis(5-chloro-2,3-dihydroxyphenyl) bis(2,4-dihydroxyphenyl) bis(2,4-dihydroxyphenyl) bis(2,4-dihydroxy-6- Methylphenyl) bis(5-chloro-2,4-dihydroxyphenyl) bis(5-chloro-2,4-dihydroxyphenyl) bis(2,5-dihydroxyphenyl) bis(2,5-dihydroxyphenyl) bis(3,4-dihydroxyphenyl) ) bis(3,5-dihydroxyphenyl) bis(2,3,4-trihydroxyphenyl) bis(2,3,4-trihydroxyphenyl) bis(2,3,4-trihydroxy-6-methylbenzene) bis(2,4,6-trihydroxyphenyl) bis(5-chloro-2,3,4-trihydroxyphenyl) bis(5-chloro-2,3,4-trihydroxyphenyl) bis(2,4,6-trihydroxyphenyl) bis(5-chloro-2, 4,6-trihydroxyphenyl) selenium and so on.

Among the substituents represented by the above chemical formula [Chemical 1], examples of the case where Z is -C(=O)- as the fifth substituent having two phenyl groups include: 2,4 -Dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2,2',5,6'-tetrahydroxybenzophenone 2-Hydroxy-4-methoxy benzophenone, 2-hydroxy-4-octyloxy benzophenone, 2-hydroxy-4-dodecyloxy benzophenone, 2 ,2'-Dihydroxy-4-methoxydiphenyl ketone, 2,6- Dihydroxy-4-methoxydiphenone, 2,2'-dihydroxy-4,4'-dimethoxydiphenone, 4-amino-2'-hydroxydiphenylketone, 4 -Dimethylamino-2'-hydroxybenzophenone, 4-diethylamino-2'-hydroxybenzophenone, 4-dimethylamino-4'-methoxy-2' -Hydroxybenzophenone, 4-dimethylamino-2',4'-dihydroxybenzophenone, and 4-dimethylamino-3',4'-dihydroxybenzophenone, etc. .

When the above-mentioned structure exists in the side chain of the above-mentioned polymer, the proportion of the repeating unit including the above-mentioned structure in the above-mentioned polymer is such that the light transmittance of the separation layer 20 becomes 0.001% or more and 10% within the following range. As long as the polymer is prepared such that the ratio falls within such a range, the separation layer 20 absorbs light sufficiently and can be deteriorated reliably and rapidly. That is, the removal from the glass support body 10 of the laminated body 50 is easy, and the irradiation time of light necessary for this removal can be shortened.

The above-mentioned structure can absorb light having a wavelength in a desired range depending on the selection of the type. For example, the wavelength of light that can be absorbed by the above structure is more preferably in the range of 100 nm or more and 2,000 nm or less. Within this range, the wavelength of light that can be absorbed by the structure is on the shorter wavelength side, for example, in the range of 100 nm or more and 500 nm or less. For example, in the above-mentioned structure, the polymer containing the structure can be degraded by absorbing ultraviolet light having a wavelength in the range of preferably about 300 nm or more and 370 nm or less.

The light that can be absorbed by the above structure is, for example, a high-pressure mercury lamp (wavelength: above 254 nm and below 436 nm), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157nm), XeCl laser (wavelength: 308nm), XeF laser (wavelength: 308nm) Length: 351nm) or solid-state UV laser (wavelength: 355nm), or g-line (wavelength: 436nm), h-line (wavelength: 405nm) or i-line (wavelength: 365nm).

The above-described separation layer 20 contains the polymer having the above-described structure as a repeating unit, but the separation layer 20 may further contain components other than the above-described polymer. As this component, a filler, a plasticizer, a component which can improve the peelability of the glass support body 10, etc. are mentioned. These components are appropriately selected from conventionally known substances or materials that do not hinder or promote the absorption of light and the modification of the polymer by the above-mentioned structure.

(inorganic)

The separation layer 20 may also be formed of an inorganic substance. The separation layer 20 is formed of an inorganic substance, and is degraded by absorbing light. As a result, the strength or adhesiveness before receiving light irradiation is lost. Therefore, by applying a little external force (for example, lifting the glass support body 10 , etc.) to destroy the separation layer 20 , the glass support body 10 and the substrate 40 can be easily separated.

The above-mentioned inorganic substance only needs to have a structure that changes in quality by absorbing light, and for example, one or more inorganic substances selected from the group consisting of metals, metal compounds, and carbon can be suitably used. Metal compounds refer to compounds containing metal atoms, for example, metal oxides and metal nitrides. Examples of such inorganic substances are not limited to these, but include those selected from the group consisting of gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon. One or more inorganic substances in a group. In addition, the so-called carbon refers to a concept that can include an allotrope of carbon, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, and the like.

The above-mentioned inorganic substances absorb light of wavelengths in a specific range according to their types. By irradiating the separation layer with light of a wavelength that is absorbed by the inorganic substances used in the separation layer 20 , the above-mentioned inorganic substances can be appropriately degenerated.

The light irradiated to the separation layer 20 made of inorganic substances depends on the wavelengths that the inorganic substances can absorb. For example, YAG lasers, ruby lasers, glass lasers, YVO ₄ lasers, and LD lasers are appropriately used. , solid-state lasers such as fiber lasers, liquid lasers such as pigment lasers, CO ₂ lasers, excimer lasers, Ar lasers, He-Ne lasers and other gas lasers, semiconductor lasers, free electrons Laser light such as laser light, or non-laser light may be used.

The separation layer 20 made of inorganic materials can be formed on the glass support 10 by known techniques such as sputtering, chemical deposition (CVD), electroplating, plasma CVD, spin coating, and the like. The thickness of the separation layer 20 made of an inorganic substance is not particularly limited as long as it is a film thickness that can sufficiently absorb the light used, but, for example, it is more desirable to set it as a film in the range of 0.05 μm or more and 10 μm or less. thick. In addition, an adhesive may be pre-coated on both sides or one side of an inorganic film (eg, a metal film) composed of an inorganic substance constituting the separation layer 20 , and the adhesive may be applied to the glass support 10 and the substrate 40 .

In addition, when a metal film is used as the separation layer 20, reflection of the laser beam or charging of the film may occur depending on the film quality of the separation layer 20, the type of laser light source, and the laser output. Therefore, it is preferable to take measures against these situations by providing an antireflection film or an antistatic film on the upper and lower sides of the separation layer 20 or on one of them.

(Compound with infrared absorbing structure)

The separation layer 20 may be formed of a compound having an infrared absorbing structure. This compound is degenerated by absorbing infrared rays. The separation layer 20 loses strength or adhesiveness before being irradiated with infrared rays as a result of the modification of the compound. Therefore, by applying a little external force (for example, lifting the support body, etc.), the separation layer 20 is destroyed, and the glass support body 10 and the substrate 40 can be easily separated.

As a structure with infrared absorption, or a compound containing a structure with infrared absorption, for example: alkane, alkene (vinyl, trans, cis, vinylidene, trisubstituted, tetrasubstituted, conjugated, azide) Alkenes, cyclic), alkynes (monosubstituted, disubstituted), monocyclic aromatics (benzene, monosubstituted, disubstituted, trisubstituted), alcohols and phenols (free OH, intramolecular hydrogen bonds, intermolecular hydrogen bond, saturated second order, saturated third order, unsaturated second order, unsaturated third order), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, ethylene oxide cyclic ether, Peroxide ethers, ketones, dialkylcarbonyls, aromatic carbonyls, enols of 1,3-diketones, o-hydroxyaryl ketones, dialkylaldehydes, aromatic aldehydes, carboxylic acids (dimers, carboxylic acids) acid anion), formate, acetate, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic acid chloride, aromatic acid chloride, Anhydrides (conjugated, non-conjugated, cyclic, acyclic), primary amides, secondary amides, lactamides, primary amines (aliphatic, aromatic), secondary amines (aliphatic, aromatic) , tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic Isonitrile, isocyanate, thiocyanate, aliphatic isothiocyanate, aromatic isothiocyanate, aliphatic nitro compound, aromatic nitro compound, nitroamine, nitrosamine, nitrate, nitroso Nitrates, nitroso bonds (aliphatic, aromatic, monomers, dimers), thiols, thiophenols and thiol acids, sulfur compounds, thiocarbonyl, sulfite, sulfite, sulfonic acid chloride, primary Sulfonamide, secondary sulfonamide, sulfate, carbon-halogen bond, Si-A ¹ bond (A ¹ is H, C, O or halogen), PA ² bond (A ² is H, C or O) , or Ti-O bonds.

Examples of the structure including the carbon-halogen bond include -CH ₂ Cl, -CH ₂ Br, -CH ₂ I, -CF ₂ -, -CF ₃ , -CH=CF ₂ , -CF=CF ₂ , Aryl fluorine, aryl chloride, etc.

Examples of the structure including the above-mentioned Si-A ¹ bond include SiH, SiH ₂ , SiH ₃ , Si-CH ₃ , Si-CH ₂ -, Si-C ₆ H ₅ , SiO-aliphatic, and Si-OCH ₃ , Si-OCH ₂ CH ₃ , Si-OC ₆ H ₅ , Si-O-Si, Si-OH, SiF, SiF ₂ , and SiF _{3 ,} etc. As a structure containing Si-A ¹ bond, it is preferable to form especially a siloxane skeleton and a silsesquioxane skeleton.

Examples of structures including the above-mentioned PA ² bond include PH, PH ₂ , P-CH ₃ , P-CH ₂ -, PC ₆ H ₅ , A ³ ₃ -PO (A ³ is aliphatic or aromatic), (A ⁴ O) ₃ -PO (A ⁴ is an alkyl group), P-OCH ₃ , P-OCH ₂ CH ₃ , P-OC ₆ H ₅ , POP, P-OH, and O=P-OH, and the like.

The above-mentioned structure can absorb infrared rays having a wavelength in a desired range depending on the selection of the type. Specifically, the wavelength of infrared rays that can be absorbed by the above-mentioned structure is, for example, in the range of 1 μm or more and 20 μm or less, and can be more suitably absorbed in the range of 2 μm or more and 15 μm or less. Inside. Furthermore, when the said structure is a Si-O bond, a Si-C bond, and a Ti-O bond, it can be in the range of 9 micrometers or more and 11 micrometers or less. In addition, the wavelength of infrared rays that can be absorbed by each structure can be easily understood by those in the industry. For example, as an absorption band in each structure, non-patent literature: SILVERSTEIN·BASSLER·MORRILL, "Spectroscopic Identification of Organic Compounds (5th Edition) - Combined Use of MS, IR, NMR, and UV-" ” (published in 1992), pp. 146~151.

As the compound having an infrared absorbing structure used for the formation of the separation layer 20, among the compounds having the above-mentioned structure, as long as it can be dissolved in a solvent for coating, and can be cured to form a solid layer is not particularly limited. However, in order to effectively degenerate the compounds in the separation layer 20 and facilitate the separation of the glass support 10 and the substrate 40 , it is desirable that the separation layer 20 absorbs infrared rays to be large, that is, when the separation layer 20 is irradiated with infrared rays The transmittance of infrared rays is low. Specifically, the infrared transmittance of the separation layer 20 is preferably less than 90%, and the infrared transmittance is more preferably less than 80%.

As an example of the compound having a siloxane skeleton, for example, a repeating unit represented by the following chemical formula [Chemical 3] and a repeating unit represented by the following chemical formula [Chemical 4] can be used. The resin of the copolymer is a copolymer of a repeating unit represented by the following chemical formula [Chemical 4] and a repeating unit derived from an acrylic compound.

(上述之化學式[化4]中，R³為氫、碳數10以下之烷基、或是碳數10以下之烷氧基)。

(In the above-mentioned chemical formula [Chem. 4], R ³ is hydrogen, an alkyl group having 10 or less carbon atoms, or an alkoxy group having 10 or less carbon atoms).

Among them, as a compound having a siloxane skeleton, t-butane which is a copolymer of a repeating unit represented by the above-mentioned chemical formula [Chemical 3] and a repeating unit represented by the following chemical formula [Chemical 5] is more preferable TBST-dimethylsiloxane copolymer, more preferably containing repeating units represented by the above chemical formula [Chemical 3] and the following chemical formula [Chemical 5] in a ratio of 1:1 The repeating unit of TBST-dimethylsiloxane copolymer.

In addition, as the compound having a silsesquioxane skeleton, for example, a copolymer which is a repeating unit represented by the following chemical formula [Chemical 6] and a repeating unit represented by the following chemical formula [Chemical 7] can be used. resin.

(In the above chemical formula [Chemical 6], R ⁴ is hydrogen or an alkyl group with 1 to 10 carbon atoms, and in the above chemical formula [Chemical 7], R ⁵ is an alkyl group with 1 to 10 carbon atoms or less, or phenyl).

As a compound having a silsesquioxane skeleton, others can also be suitably used in JP 2007-258663 A (published on October 4, 2007) and JP 2010-120901 A (published on June 3, 2010) sesquisiloxane resins disclosed in Japanese Patent Laid-Open No. 2009-263316 (published on November 12, 2009) and Japanese Patent Laid-Open No. 2009-263596 (published on November 12, 2009).

Among them, as the compound having a silsesquioxane skeleton, it is more desirable to be a copolymer of repeating units represented by the following chemical formula [Chemical 8] and repeating units represented by the following chemical formula [Chemical 9], and More preferably, it is a copolymer containing the repeating unit represented by the following chemical formula [Chemical 8] and the repeating unit represented by the following chemical formula [Chemical 9] at 7:3.

As the polymer having a silsesquioxane skeleton, although a random structure, a ladder structure, and a cage structure may be used, any structure may be used.

Moreover, as a compound containing a Ti-O bond, for example, (i) tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetra(2-ethylhexyloxy)titanium, and Titanium alkoxides such as titanium-i-propoxy octane glycolate; (ii) di-i-propoxy·bis(acetone acetone) titanium, and propanedioxytitanium bis(acetoacetate ethyl) (iii) iC ₃ H ₇ O-[-Ti(OiC ₃ H ₇ ) ₂ -O-] _n -iC ₃ H ₇ , and nC ₄ H ₉ O-[-Ti ( Titanium polymers of OnC ₄ H ₉ ) ₂ -O-] _n -nC ₄ H ₉ etc.; (iv) tri-n-butoxytitanium monostearate, titanium stearate, di-i-propane Oxytitanium diisostearate, and (2-n-butoxycarbonylbenzyloxy)tributoxytitanium and other oxytitanium compounds; (v) Di-n-butoxy·bis( Triethanolamine compound) water-soluble titanium compounds such as titanium, etc.

Among them, as a compound containing a Ti-O bond, bis-n-butoxy·bis(triethanolamide) titanium (Ti(OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N(C ₂ H ₄ OH) is preferable ) ₂ ] ₂ ).

The above-described separation layer 20 contains a compound having an infrared-absorbing structure, but the separation layer 20 may further contain components other than the above-described compounds. As this component, a filler, a plasticizer, a component which can improve the peelability of the glass support body 10, etc. are mentioned. These components are appropriately selected from conventionally known substances or materials that do not interfere with or facilitate the absorption of infrared rays by the above-mentioned structure and the modification of the compound.

(infrared absorbing substance)

The separation layer 20 may contain an infrared absorbing substance. Since the separation layer 20 is composed of an infrared absorbing material, it is configured to be degraded by absorbing light, and as a result, the strength or contact before being irradiated with light is lost. stickiness. Therefore, by applying a little external force (for example, lifting the glass support body 10 , etc.) to destroy the separation layer 20 , the glass support body 10 and the substrate 40 can be easily separated.

The infrared absorbing material may be any structure as long as it is changed in quality by absorbing infrared rays, and for example, carbon black, iron particles, or aluminum particles can be suitably used. Infrared absorbing substances absorb light of wavelengths in an inherent range according to their type. By irradiating the separation layer 20 with light of a wavelength in a range that the infrared absorbing material used in the separation layer 20 can absorb, the infrared absorbing material can be appropriately degenerated.

<Adhesion layer formation process>

The next layer formation process S02 is performed after the separation layer formation process S01. In the adhesive layer forming process S02, for example, as shown in FIG. 3(A), on the side where the glass support 10 of the separation layer 20 does not exist, that is, on the adhesive layer forming surface 20f, the separation layer 20 is formed. The adhesive layer 30 is formed so as to be joined to each other. In the adhesive layer forming process S02 , the adhesive layer 30 is formed on the separation layer 20 in a state in which the end portion 30 e of the adhesive layer 30 is separated from the end portion 20 e of the separation layer 20 . For example, first, the adhesive layer 30 is formed on the entire surface of the adhesive layer forming surface 20 f of the separation layer 20 . Thereafter, the peripheral edge of the end portion 30e of the adhesive layer 30 is removed, and the end portion 30e of the adhesive layer 30 is in a state of being separated from the end portion 20e of the separation layer 20 .

In the example shown in FIG. 3(A), the adhesive layer 30 has edge edges 30a and 30b. For example, the end sides 30a and 30b are arranged in parallel with the end sides 20a and 20b of the separation layer 20, respectively. Next, the end edge 30a of the layer 30 is tied and separated. The edge 20a of the separation layer 20 is arranged at a distance L3. The edge 30b of the subsequent layer 30 is disposed at a distance L4 from the edge 20b of the separation layer 20 . The distance L3 and the distance L4 may be respectively the same value or different values from each other.

(Manufacturing example of adhesive layer)

In the adhesive layer forming process S02 , a liquid body containing an adhesive may be applied to the separation layer 20 , or an adhesive tape coated with an adhesive on both sides may be attached to the separation layer 20 . Although it does not specifically limit as a coating method of an adhesive agent, For example, the coating method by a spin coating method, a dipping method, a roll blade method, a doctor blade method, a spray method, a slit nozzle method, etc. are mentioned. Moreover, after apply|coating an adhesive agent on the separation layer 20, you may make it dry by heating or the like. Moreover, as an adhesive agent, various well-known adhesive agents, such as an acrylic type, a novolac type, a naphthoquinone type, a hydrocarbon type, a polyimide type, and an elastomer, can be used, for example.

Fig. 10 and Fig. 11 are engineering drawings showing the state in which the bonding layer forming step S02 is performed. The adhesive layer forming process S02 is performed using an adhesive layer forming apparatus having the same structure as that of the separation layer forming apparatus 90 . In addition, the next layer formation process S02 may be performed using the same apparatus as the separation layer formation apparatus 90 . In this case, in place of the slit nozzle 61, the slit nozzle 62 for discharging the liquid Q2 for forming the adhesive layer 30 is provided before the adhesive layer forming step S02. In the slit nozzle 62, the size of the opening 62a in the direction (Y direction) orthogonal to the moving direction (X direction) is larger than the size of the opening 61a in the slit nozzle 61. small.

In the adhesive layer forming process S02 , as shown in FIG. 10 , the glass support 10 is placed on the stage portion 70 , and thereafter, the opening portion 62 a of the slit nozzle 62 is directed toward the adhesive layer forming surface 20 f of the separation layer 20 . It arrange|positions, and the liquid Q2 is discharged|emitted from the opening part 62a with respect to the adhesive layer formation surface 20f. At this time, the discharge start position of the liquid Q2 in the opening 62a is set at a position away from the edge 10a of the glass support 10 by a predetermined distance LX3.

Thereafter, the liquid body Q2 is discharged from the opening 62a while moving the slit nozzle 62 in the +Y direction. By this operation, the liquid Q2 is applied in the moving direction (+X direction) of the slit nozzle 62 . In addition, the liquid Q2 spreads in the opposite direction (-X direction) to the moving direction of the slit nozzle 62 . The edge 30a of the adhesive layer 30 is formed by the expansion of the liquid Q2. In addition, the distance LX3 is set so that the liquid Q2 does not flow up to the edge 20a of the separation layer 20. When the opening 62a of the slit nozzle 62 reaches a position at a predetermined distance LX4 from the edge 20b of the separation layer 20, the movement of the slit nozzle 62 is stopped, and the discharge of the liquid Q2 from the opening 62a is stopped. Then, the slit nozzle 62 is raised, and the opening 62a is separated from the separation layer 20 . When the predetermined distance LX4 is reached, the discharge of the liquid Q2 stops, but the liquid Q2 spreads to the edge 20b side of the separation layer 20 due to the separation of the opening 62a from the separation layer 20 . The edge 30b of the adhesive layer 30 is formed by the expansion of the liquid Q2. At this time, the distance LX4 is set so that the liquid Q2 does not flow up to the edge 20 b of the separation layer 20 .

In this way, by adjusting the relative movement range of the separation layer 20 (glass support 10 ) and the slit nozzle 62 , the moving direction can be adjusted. From the two end sides 20a, 20b of the separation layer 20, the end sides 30a, 30b of the adhesive layer 30 are separated by distances L3, L4, respectively.

Furthermore, as shown in FIG. 11, when the slit nozzle 62 is moved while the liquid Q2 is discharged from the opening 62a of the slit nozzle 62, the liquid Q2 applied on the separation layer 20 , extend in the direction (Y direction) orthogonal to the moving direction of the slit nozzle 62 , that is, to the edge 20c side (+Y direction) and 20d side (−Y direction) of the separation layer 20 . By the expansion of the liquid Q2, the edges 30c and 30d of the adhesive layer 30 are formed.

In this case, with respect to the direction (Y direction) orthogonal to the moving direction of the slit nozzle 62, the length of the opening width (the Y direction length) of the opening portion 62a is adjusted so that -Y from the opening portion 62a is adjusted. The distance MY3 is set from the side edge to the edge 20c of the separation layer 20, and the distance MY4 is set from the +Y side end of the opening 62a to the edge 20d of the separation layer 20. This makes it possible to separate the end sides 30c and 30d of the adhesive layer 30 by the distances M3 and M4 from the end sides 20c and 20d of the separation layer 20 in the direction orthogonal to the moving direction, respectively. The adjustment of the length of the opening width of the opening portion 62a is the same as that of the slit nozzle 61 described above.

The resin contained in the adhesive layer 30 may be any resin as long as it has adhesiveness, and examples thereof include hydrocarbon resins, acrylic-styrene resins, maleimide resins, elastomer resins, etc., or A combination of these and the like.

The glass transition temperature (Tg) of the adhesive varies depending on the type or molecular weight of the above-mentioned resin, and the blend of plasticizers and the like for the adhesive. The type or molecular weight of the resin contained in the above-mentioned adhesive, although It can be appropriately selected according to the type of substrate and support, but the Tg of the resin used for the adhesive is preferably in the range of -60°C or higher and 200°C or lower, and more preferably -25°C or higher and 150°C or lower. within the range. When the Tg of the resin used for the adhesive is in the range of -60°C or higher and 200°C or lower, the adhesive force of the adhesive layer 30 can be appropriately reduced without consuming excessive energy for cooling. In addition, the Tg of the adhesive layer 30 can also be appropriately adjusted by blending a plasticizer, a resin with a low degree of polymerization, or the like. The glass transition temperature (Tg) can be measured, for example, using a known differential scanning calorimeter (DSC).

(hydrocarbon resin)

A hydrocarbon resin is a resin having a hydrocarbon skeleton and polymerized from a monomer composition. Examples of the hydrocarbon resin include cycloolefin-based polymers (hereinafter, sometimes referred to as "resin (A)") and at least one resin selected from the group consisting of terpene resins, rosin-based resins, and petroleum resins. (Hereinafter, it may be called "resin (B)") etc., but it is not limited to this.

The resin (A) may be a resin obtained by polymerizing a monomer component including a cycloolefin-based monomer. Specifically, a ring-opening (co)polymer containing a monomer component containing a cycloolefin-based monomer, a resin obtained by addition (co)polymerizing a monomer component containing a cycloolefin-based monomer, and the like may be mentioned. .

基、萘基等)取代物等。此等之中，尤其是以降莰烯、四環十二烯、或是選自由此等之烷基取代物所成之群的降莰烯系單體為理想。 Examples of the cycloolefin-based monomer contained in the monomer component constituting the resin (A) include bicyclic bodies such as norbornene and norbornadiene, dicyclopentadiene, and dihydroxypentadiene. Tricyclics such as alkenes, tetracyclics such as tetracyclododecene, pentacyclics such as cyclopentadiene trimers, heptacyclics such as tetracyclopentadiene, or any of these polycyclics Alkyl (methyl, ethyl, propyl, butyl, etc.) substitution, alkenyl (vinyl, etc.) substitution, alkylidene (ethylene, etc.) substitution, aryl (phenyl,

base, naphthyl, etc.) substituents, etc. Among these, norbornene, tetracyclododecene, or a norbornene-based monomer selected from the group of alkyl-substituted products thereof is particularly preferable.

The monomer component constituting the resin (A) may contain other monomers that can be copolymerized with the above-mentioned cycloolefin-based monomer, and preferably contains, for example, an ethylenic monomer. As an ethylenic monomer, ethylene, propylene, 1-butene, isobutylene, 1-hexene, α-olefin, etc. are mentioned, for example. The vinyl monomer may be linear or branched.

Moreover, it is preferable from a viewpoint of high heat resistance (low thermal decomposition, thermal weight reduction property) that contains a cycloolefin monomer as a monomer component which comprises resin (A). The ratio of the cycloolefin monomer to the whole of the monomer components constituting the resin (A) is preferably 5 mol % or more, more preferably 10 mol % or more, and still more preferably 20 mol % or more. In addition, the ratio of the cycloolefin monomer to the whole of the monomer components constituting the resin (A) is not particularly limited, but is preferably 80 mol from the viewpoints of solubility and stability over time in a solution % or less, more preferably 70 mol% or less.

Moreover, a linear or branched ethylenic monomer may be contained as a monomer component which comprises resin (A). From the viewpoint of solubility and flexibility, the ratio of the vinyl monomer to the whole of the monomer components constituting the resin (A) is preferably 10 to 90 mol %, more preferably 20 to 85 mol %, More preferably, it is 30 to 80 mol%.

In addition, the resin (A) is, for example, made of a cycloolefin-based mono A resin that does not have a polar group like a resin obtained by polymerizing a monomer component composed of a monomer and an ethylenic monomer is desirable in order to suppress the generation of gas at high temperature.

There are no particular limitations on the polymerization method, polymerization conditions, and the like at the time of polymerizing the monomer components, and they may be appropriately set according to conventional methods.

Examples of commercially available products that can be used as the resin (A) include "TOPAS" manufactured by Polyplastics Co., Ltd., "APEL" manufactured by Mitsui Chemicals Co., Ltd., "ZEONOR" manufactured by Nippon Zeon Co., Ltd., and "ZEONEX", "ARTON" manufactured by JSR Co., Ltd., etc.

The glass transition temperature (Tg) of the resin (A) is preferably 60°C or higher, particularly preferably 70°C or higher. If the glass transition temperature of the resin (A) is 60° C. or higher, the softening of the adhesive layer 30 can be further suppressed when the laminate is exposed to a high temperature environment.

The resin (B) is at least one resin selected from the group consisting of terpene-based resins, rosin-based resins, and petroleum resins. Specifically, as a terpene resin, a terpene resin, a terpene phenol resin, a modified terpene resin, a hydrogenated terpene resin, a hydrogenated terpene phenol resin, etc. are mentioned, for example. Examples of the rosin-based resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of the petroleum resin include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, benzofuran-indene petroleum resins, and the like. Among them, hydrogenated terpene resins, Hydrogenated petroleum resin.

The softening point of the resin (B) is not particularly limited, but is preferably 80 to 160°C. If the softening point of the resin (B) is 80° C. or higher, it is possible to suppress the softening of the laminate when exposed to a high-temperature environment, without causing poor adhesion. On the other hand, when the softening point of the resin (B) is 160° C. or lower, the peeling speed at the time of peeling the laminate becomes favorable.

The weight average molecular weight of the resin (B) is not particularly limited, but is preferably 300 to 3,000. If the weight average molecular weight of the resin (B) is 300 or more, the heat resistance will be sufficient, and the amount of outgassing in a high temperature environment will be reduced. On the other hand, when the weight average molecular weight of resin (B) is 3,000 or less, the peeling speed at the time of peeling a laminated body becomes favorable. In addition, the weight average molecular weight of the resin (B) in this embodiment means the molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

Moreover, what mixed resin (A) and resin (B) can also be used as resin. By mixing, heat resistance and peeling speed can be made good. For example, when the mixing ratio of resin (A) and resin (B) is (A):(B)=80:20~55:45 (mass ratio), it is due to peeling speed, thermal resistance in high temperature environment, and It is ideal because of its excellent flexibility.

(acrylic-styrene resin)

As acryl-styrene resin, the resin which polymerized using styrene or a styrene derivative, (meth)acrylate, etc. as a monomer is mentioned, for example.

As (meth)acrylate, for example: Alkyl (meth)acrylate, (meth)acrylate having an aliphatic ring, and (meth)acrylate having an aromatic ring composed of the formula structure. As the alkyl (meth)acrylate having a chain structure, an acrylic long-chain alkyl ester having an alkyl group having 15 to 20 carbon atoms and an acrylic acid having an alkyl group having 1 to 14 carbon atoms are exemplified. Alkyl esters, etc. Examples of the long-chain acrylic acid-based alkyl ester include n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, and n-nonadecyl , alkyl esters of acrylic acid or methacrylic acid such as n-eicosyl. In addition, the alkyl group may be branched.

As an acrylic alkyl ester which has a C1-C14 alkyl group, the well-known acrylic alkyl ester used for the existing acrylic adhesive agent is mentioned. For example, the alkyl group is composed of methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, isononyl, isodecyl, dodecyl, lauryl, tridecyl Alkyl esters of acrylic acid or methacrylic acid, etc.

Examples of the (meth)acrylate having an aliphatic ring include cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, 1-adamantyl (meth)acrylate, norbornyl Alkyl (meth)acrylate, Isobornyl (meth)acrylate, Tricyclodecyl (meth)acrylate, Tetracyclododecyl (meth)acrylate, Dicyclopentyl (meth)acrylate Acrylates, etc., are more preferably isobornyl methacrylate and dicyclopentyl (meth)acrylate.

基、茬基、聯苯基、萘基、蒽基、苯氧甲基、苯氧 乙基等。又，芳香族環，係亦可為具有碳數1~5之鏈狀或分支狀的烷基。具體而言，較理想為苯氧乙基丙烯酸酯。 Although there is no particular limitation on the (meth)acrylate having an aromatic ring, examples of the aromatic ring include a phenyl group, a benzyl group, a

group, stubble group, biphenyl group, naphthyl group, anthracenyl group, phenoxymethyl group, phenoxyethyl group, etc. In addition, the aromatic ring may be a chain or branched alkyl group having 1 to 5 carbon atoms. Specifically, phenoxyethyl acrylate is preferable.

(maleimide resin)

As the maleimide-based resin, for example, N-methylmaleimide, N-ethylmaleimide, Nn-propylmaleimide, N- Isopropylmaleimide, Nn-butylmaleimide, N-isobutylmaleimide, N-sec-butylmaleimide, N-tert-butylmaleimide Imide, Nn-amylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide, N-laurylmaleimide Maleimide having an alkyl group such as imine, N-stearyl maleimide, N-cyclopropyl maleimide, N-cyclobutyl maleimide, N-cyclopropyl maleimide Maleimide having aliphatic hydrocarbon groups such as amylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide, etc. Amine, N-phenylmaleimide, Nm-methylphenylmaleimide, No-methylphenylmaleimide, Np-methylphenylmaleimide, etc. Resin obtained by polymerization of aryl aromatic maleimide and the like.

For example, a cycloolefin copolymer, which is a copolymer of a repeating unit represented by the following chemical formula [Chemical 10] and a repeating unit represented by the following chemical formula [Chemical 11], can be used as the resin of the binder component.

(In the above chemical formula [Chem. 11], n is 0 or an integer of 1 to 3).

As such a cycloolefin copolymer, APL 8008T, APL 8009T, and APL 6013T (all manufactured by Mitsui Chemicals Co., Ltd.), etc. can be used.

(Elastomer)

The elastomer preferably contains a styrene unit as a structural unit of the main chain, and the "styrene unit" may also have a substituent. Examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an acetoxy group, and a carboxyl group. Moreover, it is more preferable that the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less. Furthermore, the elastomer preferably has a weight average molecular weight of 10,000 or more Above and below 200,000.

As long as the content of styrene units is within the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is within the range of 10,000 or more and 200,000 or less, it is easy to dissolve in the hydrocarbon-based solvent described later. The first adhesive layer can be removed more easily and quickly. In addition, by making the content of styrene units and the weight-average molecular weight within the above-mentioned ranges, the resist solvent (such as PGMEA, PGME, etc.) exposed when the wafer is subjected to the resist lithography process, Acids (hydrofluoric acid, etc.) and alkalis (TMAH, etc.) exhibit excellent resistance.

In addition, the above-mentioned (meth)acrylate may be further mixed with the elastomer.

In addition, the content of the styrene unit is more preferably 17% by weight or more, and more preferably 40% by weight or less.

A more desirable range of the weight average molecular weight is 20,000 or more, and a more desirable range is 150,000 or less.

As the elastomer, various elastomers can be used as long as the content of styrene units is within the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is within the range of 10,000 or more and 200,000 or less. For example, polystyrene-poly(ethylene/propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer can be used Block copolymers (SBS), styrene-butadiene-butylene-styrene block copolymers (SBBS), and their hydrides, styrene-ethylene-butylene-styrene block copolymers (SEBS) ), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer (SEEPS), styrene-ethylene-ethylene-propylene-styrene block with reactive cross-linking type Block copolymer (Septon V9461 (manufactured by Kuraray Co., Ltd.)), styrene-ethylene-butylene-styrene block copolymer (reactive polystyrene-based hard block with reactive cross-linking type) Septon V9827 (manufactured by Kuraray Co., Ltd.), etc., and the content of styrene units and the weight-average molecular weight are within the above-mentioned ranges.

In addition, hydrides are more preferable among elastomers. If it is a hydride, the thermal stability will be improved, and deterioration such as decomposition or polymerization will not be easily caused. Moreover, it is also more preferable from the viewpoint of the solubility with respect to a hydrocarbon type solvent and the resistance with respect to a resist solvent.

In addition, among the elastomers, a block polymer having both ends of styrene is more preferable. It shows higher heat resistance by blocking styrene with high thermal stability at both ends.

More specifically, as the elastomer, a hydrogenated product of a block copolymer of styrene and a conjugated diene is more desirable. It improves the thermal stability, and is not easy to cause deterioration such as decomposition or polymerization. Moreover, higher heat resistance is exhibited by making styrene with high thermal stability block both ends. Furthermore, it is more preferable from the viewpoint of solubility to a hydrocarbon-based solvent and resistance to a resist solvent.

Examples of commercially available products that can be used as the elastomer contained in the adhesive constituting the adhesive layer 30 include "Septon (trade name)" manufactured by Kuraray Co., Ltd., "HYBRAR (trade name)" manufactured by Kuraray Co., Ltd. name)", manufactured by Asahi Kasei Co., Ltd. "Tuftec (trade name)", "DYNARON (trade name)" manufactured by JSR Co., Ltd., etc.

As the content of the elastomer contained in the adhesive constituting the adhesive layer 30, for example, the total amount of the adhesive composition is set to 100 parts by weight, preferably in the range of 50 parts by weight or more and 99 parts by weight or less, More preferably, it is within a range of 60 parts by weight or more and 99 parts by weight or less, and most preferably within a range of 70 parts by weight or more and 95 parts by weight or less. By being within these ranges, it is possible to appropriately bond the wafer and the support while maintaining heat resistance.

In addition, the elastic system may be a mixture of two or more. That is, the adhesive system constituting the adhesive layer 30 may contain plural types of elastomers. It is sufficient that at least one of the plurality of elastomers is a structural unit containing a styrene unit as a main chain. Moreover, as long as at least one of the plurality of elastomers has a styrene unit content in the range of 14 wt % or more and 50 wt % or less, or the weight average molecular weight is in the range of 10,000 or more and 200,000 or less, it is scope of the present invention. Moreover, when the adhesive agent which comprises the adhesive layer 30 contains several types of elastomers, you may adjust so that the content of the styrene unit after mixing may fall within the said range. For example, if Septon 4033 of Septon (trade name) manufactured by Kuraray Co., Ltd. having a styrene unit content of 30% by weight and Septon 2063 of Septon (trade name) having a styrene unit content of 13% by weight are in a weight ratio of 1 If it is mixed at a ratio of 1, the styrene content will be 21 to 22% by weight with respect to the entire elastomer contained in the adhesive, so it will be 14% by weight or more. Again, for example, if styrene mono The content of 10% by weight and 60% by weight are mixed in a weight ratio of 1:1, and the content is 35% by weight, which is within the above-mentioned range. The present invention may also be in such a form. In addition, the plurality of elastomers contained in the adhesive constituting the adhesive layer 30 preferably all contain styrene units within the above-mentioned range and have a weight average molecular weight within the above-mentioned range.

Moreover, it is preferable to form the adhesive layer 30 using resin other than photocurable resin (for example, UV curable resin). By using a resin other than the photocurable resin, residues can be prevented from remaining on the periphery of the microscopic unevenness of the substrate to be supported after the peeling or removal of the adhesive layer 30 . In particular, the adhesive constituting the adhesive layer 30 is not soluble in all solvents, but preferably soluble in a specific solvent. This is because the adhesive layer 30 can be removed by dissolving the adhesive layer 30 in a solvent without applying physical force to the substrate 40 . When the adhesive layer 30 is removed, the adhesive layer 30 can be easily removed even from the substrate 40 whose strength has been reduced without causing the substrate 40 to be damaged or deformed.

(dilution solvent)

烯基乙酸酯、1,4-桉油醇、1,8-桉油醇、冰片、香旱芹酮、紫羅酮、側柏酮、樟腦、d-檸檬烯、l-檸檬烯、雙戊烯等之萜烯系溶劑；γ-丁內酯等之內酯類；丙酮、甲基乙基酮、環己酮(CH)、甲基-n-戊基酮、甲基異戊基酮、2-庚酮等之酮類；乙二醇、二乙二醇、丙二醇、二丙二醇等之多元醇類；乙二醇單乙酸酯、二乙二醇單乙酸酯、丙二醇單乙酸酯、或二丙二醇單乙酸酯等之具有酯鍵之化合物、前述多元醇類或具有前述酯鍵之化合物的單甲基醚、單乙基醚、單丙基醚、單丁基醚等之單烷基醚或單苯基醚等之具有醚鍵的化合物等之多元醇類之衍生物(此等之中，較理想為丙二醇單甲基醚乙酸酯(PGMEA)、丙二醇單甲基醚(PGME))；如二噁烷一般的環式醚類、或乳酸甲酯、乳酸乙酯(EL)、乙酸甲酯、乙酸乙酯、乙酸丁酯、甲氧基丁基乙酸酯、丙酮酸甲酯、丙酮酸乙酯、甲氧基丙酸甲酯、乙氧基丙酸乙酯等之酯類；苯甲醚、乙基苄基醚、甲苯酚基甲基醚、二苯基醚、二苄基醚、苯乙醚、丁基苯基醚等之芳香族系有機溶劑等。 Examples of the dilution solvent used in forming the adhesive layer 30 (and the separation layer 14 described later) include hexane, heptane, octane, nonane, methyl octane, decane, undecane, and tenane. Linear hydrocarbons such as dioxane and tridecane, and branched hydrocarbons having 4 to 15 carbon atoms, such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decalin, tetrahydronaphthalene, etc. Cyclic hydrocarbons, p-menthane, o-menthane, m-menthane, diphenylmenthane, 1,4-terpene diol, 1,8-terpene diol, camphene, norbornane, pinane , thubanane, carane, longifolene, geraniol, nerol, linalool, citral, citronellol, menthol, isomenthol, neomenthol, alpha-terpineol, beta -Terpineol, gamma-terpineol, terpinen-1-ol, terpinen-4-ol, dihydro

Alkenyl acetate, 1,4-cineole, 1,8-cineole, borneol, eucalyptone, ionone, thujone, camphor, d-limonene, l-limonene, dipentene Terpene solvents such as γ-butyrolactone; Lactones such as γ-butyrolactone; Acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-amyl ketone, methyl isoamyl ketone, 2 - Ketones such as heptanone; polyols such as ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, etc.; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, Or dipropylene glycol monoacetate and other compounds having ester bonds, monoalkanes such as monomethyl ether, monoethyl ether, monopropyl ether, monobutyl ether, etc. of the aforementioned polyols or compounds having the aforementioned ester bond Derivatives of polyols such as compounds having ether bonds such as phenyl ethers or monophenyl ethers (among them, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME) )); cyclic ethers such as dioxane, or methyl lactate, ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate, methyl pyruvate Esters, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate, etc.; anisole, ethylbenzyl ether, cresyl methyl ether, diphenyl ether, diphenyl ether Aromatic organic solvents such as benzyl ether, phenethyl ether, butyl phenyl ether, etc.

(other ingredients)

The adhesive constituting the adhesive layer 30 may further contain other substances having mixing properties within the range not impairing the essential properties. For example, it is possible to further use addition resins, plastic Various commonly used additives such as additives, adhesives, stabilizers, colorants, thermal polymerization inhibitors, and surfactants.

<Substrate formation process>

The substrate formation process S03 is performed after, for example, the adhesive layer formation process S02. In the substrate formation process S03, the substrate 40 having the electronic components 41 is formed on the side where the glass support 10 of the separation layer 20 does not exist. That is, the substrate 40 is formed on the substrate forming surface 30f of the adhesive layer 30 . In the substrate forming process S03 , the substrate 40 is formed on the adhesive layer 30 in a state where the end portion 40 e of the substrate 40 is separated from the end portion 20 e of the separation layer 20 . In the substrate forming process S03, first, as shown in FIG. 3(B), a plurality of electronic components 41 are arranged on the substrate forming surface 30f of the adhesive layer 30. The number of configurations of electronic parts is arbitrary. The electronic component 41 includes, for example, a wafer or the like formed using a semiconductor or the like. The electronic component 41 is bonded and fixed by the bonding layer 30 .

Then, as shown in FIG.3(C), the sealing mold 42 is formed so that the whole surface of the board|substrate formation surface 30f containing the adhesive layer 30 of the electronic component 41 may be covered. By forming the mold 42 , the electronic component 41 is held in a state of being embedded in the mold 42 . Moreover, the sealing mold 42 can be formed so that a part (for example, the upper surface) of the electronic component 41 may be exposed. In addition, the sealing mold 42 is formed using, for example, a material that transmits light that changes the quality of the separation layer 20 . As such a material, glass, silicon, acrylic resin, etc. are mentioned, for example.

In addition, in the board formation process S03, the electronic component 41 may not be arrange|positioned. In the case where the electronic component 41 is not arranged, for example, the following On the substrate forming surface 30f of the layer 30, only the mold 42 may be formed, or a circuit that is rewired to the mold 42 may be formed. That is, the electronic component 41 may not be included in the formed substrate 40 . In addition, since the end of the separation layer 20 is separated from the end of the glass support 10 as described above, the separation layer 20 can be prevented from being peeled off from the glass support 10 during the process of the substrate forming process S03, and can be appropriately performed. Substrate forming process S03 and subsequent processes.

<Mold sealing and grinding process>

The mold sealing and polishing process S04 is performed after the substrate forming process S03. As shown in FIG. 4(A), the mold polishing step S04 is to polish the side of the mold 42 where the glass support 10 does not exist, that is, the upper surface 42a of the mold 42 to expose the electronic components 41 . The top surface (the surface on the +Z side) of the electronic component 41 and the top surface 42a of the mold 42 are substantially flush with each other by the mold grinding process S04. In the sealing mold polishing process S04, for example, the sealing mold is polished by a known method. In addition, in the substrate forming process S03, when the mold 42 is formed to expose a part of the electronic component 41, the mold polishing process S04 can be omitted.

In addition, after the mold sealing and polishing process S04, the upper surface of the electronic component 41 and the sealing mold 42 (the surface on the +Z side, or the surface on the side where the glass support 10 does not exist) can be made of a conductive material. Wiring is formed. In addition, the electronic component 41 may be arranged so as to be electrically connected to the wiring, and the mold 42 may be formed so as to cover the electronic component 41 . The connection between the wiring and the electronic component 41 is made by flange, welding, or the like. In this way, the board|substrate 40 which laminated|stacked several layers in which the electronic component 41 was arrange|positioned can also be formed.

<Separation layer metamorphism project>

The separation layer modification process S05 is performed after the mold sealing and polishing process S04, for example. In the separation layer modification process S05, as shown in FIG. 4(B), the separation layer 20 is viewed from the side where the separation layer 20 of the glass support 10 does not exist, that is, from the bottom surface 10r of the glass support 10. Light L or heat is irradiated from the irradiating device IR. As the light L, light L or heat of a wavelength capable of changing the quality of the separation layer 20 is irradiated. In the separation layer modification process S05 , the separation layer 20 is degraded, and the strength or the adhesive force to the glass support 10 is reduced. In addition, in FIG. 4(B), the top and bottom of the glass support body 10 is reversed (the substrate 40 is turned downward), and the light L or heat is irradiated from the upper irradiation device IR, but it is not limited to this form. For example, the substrate 40 may be turned upward, and the light L or heat may be irradiated by the irradiating device IR from below the glass support 10 .

<Glass support peeling process>

The glass support peeling process S06 is performed after the separation layer modification process S05, for example. In the glass support peeling process S06, as shown in FIG. 5(A), by lifting the glass support 10 upward with the substrate 40 facing downward, the separation layer 20 is destroyed and the separation layer 20 is removed. The glass support 10 is peeled off from the substrate 40 . For the operation of lifting the glass supporting body 10 upward, a device for lifting the glass supporting body 10 by suction may also be used. At this time, the substrate 40 is sucked to the stage or the like, and is pulled away from the glass support 10 by lifting the glass support 10 . The laminated body 50 including the adhesive layer 30 and the substrate 40 is peeled off from the glass support 10 by the glass support peeling process S06.

In addition, as described above, since the end of the adhesive layer 30 is separated from the end of the separation layer 20, the adhesive layer 30 is prevented from adhering to the glass support 10, and the glass support 10 can be removed in the glass support peeling process S06. It is easily peeled off from the substrate 40 .

<Adhesive material removal process>

Next, the layer removal process S07 is performed after the glass support peeling process S06. In the adhesive layer removal step S07, as shown in FIG. 5(B), a solvent for dissolving the adhesive of the adhesive layer 30 without dissolving the substrate 40 (wiring and the mold 42) is supplied to the adhesive layer 30 superior. Thereby, the adhesive agent is dissolved by the solvent, the adhesive layer 30 is removed from the substrate 40, and the structure in which the plurality of electronic devices 51 are formed into a single plate-like structure is obtained. Thereafter, although not shown, for example, individual electronic devices 51 are obtained by cutting each electronic component 41 . In addition, as a cutting device, an arbitrary device can be used.

As described above, the method of manufacturing the laminate 50 according to the embodiment is to manufacture the laminate 50 in which the rectangular glass support 10 and the separation layer 20 degraded by light absorption or heating are laminated. The method includes the separation layer forming step S01 of forming the separation layer 20 on the central portion of the glass support body 10 so that the end portion 20e is separated from the end portion 10e of the glass support body 10 . In this way, since the end portion 20e of the separation layer 20 is formed in the center portion on the glass support body 10 in a state in which the end portion 20e of the separation layer 20 is separated from the end portion 10e of the glass support body 10, the glass support body 10 and the separation layer 20 are formed by The adhesion is improved and the separation layer 20 is easily peeled off, so that the above-mentioned substrate forming process S03 and subsequent processes (or subsequent processes) can be smoothly performed. layer formation process S02 and subsequent processes), and the laminated body 50 or the electronic device 51 can be easily manufactured.

In the above-described embodiment, the following configuration is exemplified. That is, the range for forming the separation layer 20 is set by adjusting the moving range of the slit nozzle 61 and the opening width of the opening 61a in the separation layer forming process S01. Although it demonstrates as an example, it is not limited to this.

Fig. 12(A) and (B) are engineering drawings showing another example of the manufacturing method of the laminated body. In the separation layer forming process S01, for example, as shown in FIG. 12(A), a shield M is formed in advance on the peripheral edge portion 10g of the glass support body 10, and after the shield M is formed, the shield M is also included. The liquid Q1 is applied to the entire surface of the glass support 10 . After that, as shown in FIG. 12(B), the mask M may be removed with a solvent or the like. By removing the mask M, the liquid Q1 coated on the mask M is removed together with the mask M. Thereby, the edge part 20e of the separation layer 20 can be made into the state isolate|separated from the edge part 10e of the glass support body 10.

In addition, as the mask M, any material that can be removed by a solvent or the like can be used. In addition, as the masking M, a masking tape can also be used. In this case, after the masking tape is attached to the end of the glass support 10 , the liquid Q1 is applied to the entire surface of the glass support 10 . After that, by peeling off the masking tape, the liquid Q1 applied on the masking tape can be removed.

FIG. 13 (A) and (B) are diagrams showing another example of the method of manufacturing the laminate. In the separation layer forming process S01, for example, as shown in FIG. 13(A), the glass support 10 is rotated around the Z axis. In this state, the separation layer 20 is formed by supplying the liquid Q1 to the separation layer forming surface 10f from a dispenser or the like, not shown, and applying the liquid Q1 to the entire surface of the separation layer forming surface 10f. After that, as shown in FIG. 13(B), the portion of the separation layer 20 formed on the peripheral edge portion 10g of the separation layer forming surface 10f may be removed by the solvent S1 or the like. Thereby, the edge part 20e of the separation layer 20 can be made into the state isolate|separated from the edge part 10e of the glass support body 10.

Furthermore, in the above-described embodiment, the following configuration is exemplified in the same manner as in the separation layer forming process S01, that is, by adjusting the moving range of the slit nozzle 62 and the opening of the opening portion 62a in the adhesive layer forming process S02 The configuration of adjusting the range of the adhesive layer 30 is described as an example, but it is not limited to this.

Fig. 14 (A) to (C) are engineering drawings showing another example of the method of manufacturing the laminate. In the adhesive layer forming process S02, for example, as shown in FIG. 14(A), the adhesive layer 30 is formed on the entire surface of the separation layer forming surface 10f of the glass support 10 including the separation layer 20. Next, as shown in FIG. 14(B), the mold 42 covered with the substrate 40 on the adhesive layer 30 is polished (refer to the above-mentioned substrate forming process S03 and mold polishing process S04). Next, as shown in FIG. 14(C), the peripheral portion of the adhesive layer 30 is dissolved with a solvent S2 or the like. Thereby, the edge part 20e of the separation layer 20 can be exposed. In addition, in the example shown in FIG. 14, although the case where the end portion 30e of the adhesive layer 30 and the end portion 20e of the separation layer 20 coincide with each other is shown, since the end portion 20e of the separation layer 20 is exposed, the adhesive layer is prevented from being exposed. 30 is next to the glass support body 10, and in the glass support body peeling process S06, it does not become a hindrance when peeling the glass support body 10.

In addition, as shown in FIG. 14(C), the edge part 30e of the adhesive layer 30 is not limited to the edge part 20e of the separation layer 20 being matched with each other. For example, by increasing the supply amount or supply time of the solvent S2 or the like, the adhesive layer 30 may be dissolved until the end portion 30e of the adhesive layer 30 is separated from the end portion 20e of the separation layer 20 .

<Laminated body manufacturing system>

The laminated body manufacturing system of an embodiment is demonstrated. FIG. 15 is a block diagram schematically showing an example of the laminated body manufacturing system 100 . As shown in FIG. 15, the laminated body manufacturing system 100 includes a separation layer forming apparatus 90, an adhesive layer forming apparatus 91, a substrate forming apparatus 92, a mold polishing apparatus 93, a separation layer modification apparatus 94, and a glass support The peeling device 95 and the adhesive layer removing device 96 are provided.

The separation layer forming apparatus 90 forms the separation layer 20 on the glass support 10, and performs the above-mentioned separation layer forming process S01. The adhesive layer forming apparatus 91 forms the adhesive layer 30 on the separation layer 20, and performs the above-mentioned adhesive layer forming process S02. The substrate forming apparatus 92 forms the substrate 40 on the adhesive layer 30, and performs the above-mentioned substrate forming process S03. The mold polishing apparatus 93 grinds the mold 42 of the substrate 40 as shown in the mold polishing process S04 described above. The separation layer degeneration apparatus 94 irradiates the separation layer 20 with light or heat to degrade the separation layer 20 as shown in the separation layer degeneration step S05 described above. The glass support peeling device 95 peels off the glass support 10 from the substrate 40 as shown in the above-mentioned glass support peeling process S06. Subsequent layer removal device 96 is the same as the above-mentioned adhesive layer removal process S07 As shown, the adhesive layer 30 is removed from the substrate 40 .

In this way, according to the laminated body manufacturing system 100, the above-mentioned separation layer formation process S01, adhesive layer formation process S02, substrate formation process S03, mold polishing process S04, separation layer modification process S05, glass Each process of the support stripping process S06 and the adhesive layer removal process S07.

[Example]

Various peeling tests were performed about the laminated body 50 which formed the separation layer on the glass support by the manufacturing method of the laminated body of the above-mentioned embodiment. Figures 16 (A) to (C) are tables showing the results of the peel tests of the Examples. The laminates 50 of Examples 1 and 2 are the laminates 50 in which the separation layer 20 is formed on the glass support 10 in a state in which the end of the glass support 10 and the end of the separation layer 20 are separated from each other. ℃ temperature for hardening treatment. In addition, the laminates of Comparative Examples 1 and 2 are those in which a separation layer was formed to the end of the glass support body 10 and a hardening treatment was performed at a temperature of 400°C.

The table shown in FIG. 16(A) is a comparison between the glass support 10 and the separation layer after the laminate 50 of Example 1 and the laminate of Comparative Example 1 were immersed in water for 10 minutes, respectively. The results when sprayed with air are shown. As shown to FIG. 16(A), in the laminated body of the comparative example 1, peeling from the separation layer of the glass support body 10 was confirmed. On the other hand, in the laminated body 50 of Example 1, peeling from the separation layer 20 of the glass support body 10 was not confirmed.

In addition, the table shown in FIG. 16(B) is for the laminated body 50 of Example 2 and the laminated body of Comparative Example 2 after the test of FIG. 16(A) was carried out, and then a 5-minute ultra-high temperature test was carried out. After cleaning with sonic waves, the results when air is sprayed between the glass support 10 and the separation layer are shown. As shown in FIG. 16(B), in the laminate of Comparative Example 2, peeling from the separation layer of the glass support 10 was confirmed. On the other hand, in the laminated body 50 of Example 2, peeling from the separation layer 20 of the glass support body 10 was not confirmed.

In addition, the table shown in FIG. 16(C) is for the laminated body 50 of Example 3 and the laminated body of Comparative Example 3 after the test shown in FIG. 16(B) is applied to each separation layer. The tape is attached and the results when peeled off (peel test) are shown. In addition, the laminated body 50 of Example 3 and the laminated body of Comparative Example 3 were cured at a temperature of 360°C. As shown in FIG. 16(C), in the laminate of Comparative Example 3, peeling from the separation layer of the glass support 10 was confirmed by the peeling test. On the other hand, in the laminated body 50 of Example 3, the peeling from the separation layer 20 of the glass support body 10 was not confirmed even when the peeling test was performed.

In this way, in the above-mentioned Examples 1 to 3, it was confirmed that the adhesion of the separation layer 20 to the glass support 10 was improved.

As mentioned above, although embodiment and an Example were demonstrated, this invention is not limited to the above description, Various changes are possible in the range which does not deviate from the summary of this invention.

L1, L2‧‧‧distance

M1, M2‧‧‧distance

10‧‧‧Glass Support

10a, 10b, 10c, 10d, 20a, 20b, 20c, 20d‧‧‧End

10e, 20e‧‧‧End

10f‧‧‧Separation layer forming surface

20‧‧‧Separation layer

20f‧‧‧Adhesion layer forming surface

50‧‧‧Laminated body

Claims (16)

A method for manufacturing a laminated body, which is to manufacture a rectangular glass support and a state in which it can be destroyed by external force by absorbing or heating light, or by making the contact with other layers. A method for forming a laminate in which the separation layers in a state where the strength is lowered, comprises a separation layer forming step of forming the separation layer so that the end portion of the separation layer is separated from the end portion of the glass support. A central portion formed on the glass support body in a separated manner; and a layer forming process, after the separation layer forming process, on the side where the glass support body of the separation layer does not exist, so as to be mutually connected with the separation layer. The adhesive layer is formed by joining together, and the adhesive layer is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer. The method for producing a laminate of claim 1, wherein the end of the separation layer is separated from the end of the glass support by a range of 0.1 mm to 10 mm. The method for producing a laminate according to claim 1 or claim 2, wherein, in the separation layer forming process, the glass support and a slit nozzle capable of applying a liquid for forming the separation layer are formed The relative movement is carried out, and the liquid is applied on the glass support through the slit nozzle. body to form the aforementioned separation layer. The method for manufacturing a laminated body according to claim 3, wherein in the separation layer forming process, by adjusting the relative movement range between the glass support and the slit nozzle, the distance in the movement direction is changed from Both ends of the glass support body are separated from the ends of the separation layer, respectively. The method for manufacturing a laminated body according to claim 3, wherein, in the separation layer formation process, by adjusting the length of the opening width of the slit nozzle, from the direction perpendicular to the moving direction Both ends of the glass support in the direction separate the ends of the separation layer, respectively. The method for producing a laminate according to claim 3, wherein the separation layer forming process includes a step of shielding the outer peripheral end of the glass support, and placing the glass support in the shielded state. The step of applying the liquid on the body, and the step of removing the mask after the liquid is applied. The method for manufacturing a laminate according to claim 1 or claim 2, wherein the separation layer forming process comprises: a step of spin-coating a liquid for forming the separation layer on the glass support, and After spin coating, the edge of the end portion of the aforementioned glass support was liquid cleaning steps. The method for producing a laminate according to claim 1 or claim 2, which includes removing the peripheral edge of the end portion of the adhesive layer to make the end portion of the adhesive layer in a state of being separated from the end portion of the separation layer A step of. A method for manufacturing a laminated body, which is to manufacture a rectangular glass support and a state in which it can be destroyed by external force by absorbing or heating light, or by making the contact with other layers. A method for forming a laminate in which the separation layers in a state where the strength is lowered, comprises a separation layer forming step of forming the separation layer so that the end portion of the separation layer is separated from the end portion of the glass support. A central portion formed on the aforementioned glass support body by means of separation; and a substrate forming process, after the aforementioned separation layer forming process, a substrate having electronic components is formed on the side where the aforementioned glass support body of the aforementioned separation layer does not exist, the aforementioned The substrate is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer. The method for producing a laminate according to any one of the claims 1, 2 or 9 of the scope of the application, wherein after the separation layer forming process, the separation layer is on the side where the glass support does not exist Conductive wiring is formed. A method of manufacturing an electronic device, comprising: a step of manufacturing a laminate by the method of manufacturing a laminate as claimed in claim 9 or claim 10 of the scope of the application, and deteriorating the separation layer, And the step of separating the said glass support body from the said laminated body. A laminate in which a rectangular glass support is transformed into a state that can be destroyed by external force by absorbing or heating light, or the adhesive force between the layers in contact with other layers is reduced. It is characterized in that the separation layer in the state of On the side where the glass support does not exist, an adhesive layer is formed so as to be bonded to the separation layer, and the adhesive layer is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer. layer. A laminate in which a rectangular glass support is transformed into a state that can be destroyed by external force by absorbing or heating light, or the adhesive force between the layers in contact with other layers is reduced. It is characterized in that the separation layer is provided in the center part on the glass support body, and the separation layer is separated from the end part of the glass support body at the end of the separation layer. A substrate having electronic components is formed on the side of the separation layer where the glass support does not exist, and the substrate is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer. A laminated body manufacturing system that manufactures a rectangular glass support and a state in which it can be destroyed by external force by absorbing light or heating, or bonding with other layers. A system of a layered body formed by stacking separation layers in a state of reduced strength, characterized by comprising: separation layer forming means for separating the separation layer from the end of the glass support at the end a central portion formed on the glass support body in a state of The adhesive layer is formed by the method of forming the adhesive layer on the separation layer in a state where the end portion of the adhesive layer is separated from the end portion of the separation layer. A laminated body manufacturing system that manufactures a rectangular glass support and a state in which it can be destroyed by external force by absorbing light or heating, or bonding with other layers. A system of laminar bodies formed by stacking separate layers in a lowered state is characterized by comprising: A separation layer forming apparatus for forming the separation layer on a central portion of the glass support in a state where the end portion is separated from the end of the glass support; and a substrate forming apparatus for forming the separation layer after the separation layer is formed, A substrate having electronic components is formed on the side of the separation layer where the glass support does not exist, and the substrate forming apparatus forms the substrate in the separation layer in a state where the end portion is separated from the end portion of the separation layer. layer. The layered body manufacturing system according to claim 14 or claim 15, wherein the separation layer forming apparatus includes a slit nozzle capable of applying a liquid for forming the separation layer, and a stage, The glass substrate is placed, and the liquid is applied to the center portion on the glass substrate through the slit nozzle while the slit nozzle and the stage are relatively moved.

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