JP2019005999A - Manufacturing method of laminate, manufacturing method of electronic device, laminate, and laminate manufacturing system - Google Patents

Abstract

To easily manufacture a laminate or an electronic device by preventing a separation layer from being easily peeled and smoothly conducting processing thereafter.SOLUTION: There is provided a manufacturing method of a laminate 50 in which a rectangular glass supporter 10 and a separation layer 20 which is modified by absorption of a light or heating are laminated, including a separation layer forming process S01 for forming the separation layer 20 in a center part on the glass supporter 10 so that an end 20e is separated from an end 10e of the glass supporter 10.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a laminate manufacturing method, an electronic device manufacturing method, a laminate, and a laminate manufacturing system.

  In recent years, as an example of a method for manufacturing an electronic device, a so-called fan-out type PLP (Fan-out Panel Level Package) technique is known. In the fan-out type PLP technology, for example, a separation layer that is altered by light absorption or heating is formed on a plate-like support, and a substrate having electronic components is laminated thereon. Thereafter, light or heat is applied to the separation layer to separate the substrate from the support, and the substrate is cut for each electronic component to obtain an electronic device. It has also been proposed to use a rectangular glass support as the support. In the fan-out type PLP technology using such a glass support, a liquid material for forming a separation layer is obtained from a slit nozzle or the like. The separation layer is formed on the glass support by applying to the support and drying (see, for example, Patent Document 1 and Patent Document 2).

JP-A-9-29167 JP 2002-186893 A

  In the fan-out type PLP technology, in order to improve the yield, a substrate including electronic components is widely formed on a glass support. In this case, in order to peel the substrate from the glass support, it is assumed that the separation layer is formed up to the end of the glass support. However, when the separation layer is formed up to the end of the glass support, the adhesion between the separation layer and the glass support is lowered at the end of the glass support, and the separation layer is easily peeled off. There is a problem that the processing of the system is hindered. In particular, when a separation layer is formed by applying a liquid material, the separation layer becomes thick at the end portion to increase rigidity, and the separation layer is pulled toward the center side as the liquid material is dried, and is easily peeled off from the end portion. There is a problem of becoming. Also, when a liquid material is applied to the glass support from a slit nozzle or the like to form a separation layer, the liquid spreads on the glass support even if the application of the liquid is stopped before the end of the glass support, A separation layer will be formed in the state which reached the edge part, and it becomes easy to peel a separation layer like the above.

  In view of the circumstances as described above, the present invention improves the adhesion between the glass support and the separation layer, suppresses the separation layer from being easily peeled off, and allows the subsequent processing to be performed smoothly. It is an object to provide a method for manufacturing a body, a method for manufacturing an electronic device, a laminate, and a laminate manufacturing system.

  In the first aspect of the present invention, there is provided a method for producing a laminate in which a rectangular glass support and a separation layer that is altered by light absorption or heating are laminated, wherein the separation layer has an end portion. There is provided a method for producing a laminate including a separation layer forming step of forming a central portion on the glass support so as to be separated from an end of the glass support.

  In a second aspect of the present invention, an electron comprising: producing a laminate by the above-described laminate production method; and altering the separation layer to separate the glass support from the laminate. A method of manufacturing a device is provided.

  A third aspect of the present invention is a laminate in which a rectangular glass support and a separation layer that is altered by light absorption or heating are laminated, and the separation layer is a center on the glass support. Provided in the part, the separation layer is provided with a laminate in which an end is separated from an end of the glass support.

  According to a fourth aspect of the present invention, there is provided a system for manufacturing a laminate in which a rectangular glass support and a separation layer that is altered by light absorption or heating are laminated, wherein the separation layer has an end portion. There is provided a laminated body manufacturing system including a separation layer forming device that forms a central portion on the glass support in a state of being separated from an end of the glass support.

  According to the present invention, since the end of the separation layer is formed in the central portion on the glass support in a state of being separated from the end of the glass support, the adhesion between the glass support and the separation layer is improved. Thus, the separation layer can be prevented from being easily peeled off, the subsequent processing can be performed smoothly, and a laminate or an electronic device can be easily manufactured.

4 is a flowchart illustrating an example of a method for manufacturing an electronic device according to an embodiment. (A) And (B) is a figure which shows 1 process of the manufacturing method of an electronic device. (A) to (C) are diagrams showing one process of the method for manufacturing the electronic device, following FIG. 2. (A) And (B) is a figure which shows one process of the manufacturing method of an electronic device following FIG. (A) And (B) is a figure which shows one process of the manufacturing method of an electronic device following FIG. It is a perspective view which shows an example of the separation layer forming apparatus which concerns on embodiment. (A) And (B) is a figure which shows an example of a separated layer formation process. (A) And (B) is a figure which shows an example of a separated layer formation process following FIG. It is a figure which shows an example of a separated layer formation process. It is a figure which shows an example of an contact bonding layer formation process. It is a figure which shows an example of an contact bonding layer formation process. (A) And (B) is a figure which shows the other example of the manufacturing method of a laminated body. (A) And (B) is a figure which shows the other example of the manufacturing method of a laminated body. (A) to (C) is a process diagram showing another example of a manufacturing method of a laminate. It is a block diagram showing typically an example of a layered product manufacturing system concerning an embodiment. (A) to (C) is a table showing the results of a peel test in the examples.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Hereinafter, in the drawings, in order to make each configuration easy to understand, a part of the structure is emphasized or a part of the structure is simplified, and an actual structure, shape, scale, or the like may be different.

  FIG. 1 is a flowchart illustrating an example of a method for manufacturing an electronic device according to the embodiment. In this embodiment, an electronic device is manufactured by so-called fan-out type PLP technology. As shown in FIG. 1, the manufacturing method of the electronic device according to the embodiment includes a separation layer forming step (step S01), an adhesive layer forming step (step S02), a substrate forming step (step S03), and a mold polishing step. (Step S04), separation layer alteration step (Step S05), glass support peeling step (Step S06), and adhesive layer removal step (Step S07).

  FIG. 2 to FIG. 5 are diagrams illustrating an example of steps in the method for manufacturing the electronic device according to the embodiment. Hereinafter, in FIGS. 2 to 5, directions in the drawings will be described using an XYZ coordinate system. In this XYZ coordinate system, the plane parallel to the separation layer forming surface on which the separation layer is formed in the glass support is defined as the XY plane. One direction parallel to the XY plane (for example, the short direction of the glass support) is expressed as the X direction, and a direction orthogonal to the X direction (for example, the longitudinal direction of the glass support) is expressed as the Y direction. A direction perpendicular to the XY plane is expressed as a Z direction. That is, the normal direction of the separation layer forming surface is the Z direction. In each of the X direction, the Y direction, and the Z direction, the direction of the arrow in the figure is the + direction, and the direction opposite to the arrow direction is the − direction.

<Separation layer forming step>
In the separation layer formation step S01, for example, as shown in FIGS. 2A and 2B, the separation layer 20 is formed on the separation layer formation surface 10f of the rectangular glass support 10. The separation layer forming surface 10f is planar. Further, in the separation layer forming step S01, the separation layer 20 is formed at the central portion of the separation layer forming surface 10f of the glass support 10 so that the end 20e of the separation layer 20 is separated from the end 10e of the glass support 10. Thus, the stacked body 50 is formed. The glass support 10 is, for example, a glass plate having a thickness of 500 to 1500 μm. The glass support 10 is placed on the stage unit 70 (see FIG. 6) and is adsorbed, so that the separation layer forming surface 10f is formed. It is held in a state with a predetermined flatness.

  In the example shown in FIGS. 2A and 2B, the separation layer 20 is formed in a rectangular shape. The separation layer 20 is not limited to a rectangular shape, and may have another shape. For example, the separation layer 20 may be formed in a circular shape, an elliptical shape, an elliptical shape, or a polygonal shape other than a rectangular shape. When the separation layer 20 is formed in a rectangular shape, the separation layer 20 has four end sides 20a, 20b, 20c, and 20d as end portions 20e. The end sides 20a to 20d are arranged in parallel to the end sides 10a, 10b, 10c, and 10d, which are the end portions 10e of the glass support 10, respectively.

  The end side 20 a of the separation layer 20 is disposed with a distance L <b> 1 between the end side 10 a of the glass support 10. The end side 20b of the separation layer 20 is disposed with a distance L2 from the end side 10b of the glass support 10. Further, the end side 20 c of the separation layer 20 is arranged with a distance M1 between the end side 20 c of the glass support 10. The end side 20d of the separation layer 20 is disposed with a distance M2 from the end side 10d of the glass support 10. The distances L1, L2, M1, and M2 may be the same value or different values.

  In addition, although said distance L1, L2, M1, and M2 can be set in the range of 0.1 mm-10 mm, for example, it is not limited to this range. By setting the values of the distances L1, L2, M1, and M2 to 0.1 mm or more, the effect of separating the end 20e of the separation layer 20 from the end 10e of the glass support 10 is exhibited. Moreover, when the value is 10 mm or less, a suitable area of the separation layer 20 is ensured, and a process with a high yield can be constructed. In addition, although the film thickness of the isolation | separation layer 20 is formed so that it may become uniform or substantially uniform over the front surface, a part of film thickness may differ. For example, the end 20e of the separation layer 20 may be thinner than the other part, or the end 20e may be thicker than the other part.

(Example of production of separation layer)
FIG. 6 is a perspective view showing an example of the separation layer forming apparatus 90 according to the embodiment. As shown in FIG. 6, the separation layer forming apparatus 90 includes a nozzle unit 60, a stage unit 70, and a control unit 80. The nozzle unit 60 is held by a gantry (not shown) and is movable with respect to the stage unit 70. The nozzle unit 60 can discharge a liquid material for forming the separation layer 20 from an opening (slit). The stage unit 70 has a stage on which the glass support 10 can be placed. The control unit 80 controls the liquid material to be applied onto the glass support 10 from the nozzle unit 60 while moving the nozzle unit 60 relative to the stage unit 70. The separation layer forming apparatus 90 may be configured to move the stage unit 70 while fixing the nozzle unit 60, or may be configured to move both the nozzle unit 60 and the stage unit 70.

  7 to 9 are process diagrams showing a state in which the separation layer forming step S01 is performed by the separation layer forming apparatus 90 described above. Prior to the separation layer forming step S01, a slit nozzle 61 for discharging the liquid Q1 for forming the separation layer 20 is installed as the nozzle portion 60 of the separation layer forming apparatus 90. The slit nozzle 61 has an opening 61 a made of a liquid material for forming the separation layer 20. 7 to 9, the stage unit 70 is omitted. The operation of each unit described below is based on an instruction from the control unit 80.

  In the separation layer forming step S01, first, after the glass support 10 is disposed on the stage unit 70, the opening 61a of the slit nozzle 61 is formed on the separation layer formation surface of the glass support 10 as shown in FIG. It is arranged toward 10f. At this time, the opening 61a is disposed at a position separated from the end side 10a of the glass support 10 by a predetermined distance LX1 as a discharge start position of the liquid Q1. Subsequently, the liquid material Q1 is discharged from the opening 61a to the separation layer forming surface 10f. As a result, the liquid Q1 discharged from the opening 61a is sandwiched between the opening 61a and the separation layer forming surface 10f.

  Next, as shown in FIG. 7B, the slit nozzle 61 moves in the X direction while discharging the liquid material Q1 from the opening 61a. By this operation, the liquid material Q1 is continuously discharged in the moving direction (+ X direction) of the slit nozzle 61, and the liquid material Q1 is applied to the separation layer forming surface 10f of the glass support 10. Further, the liquid material Q <b> 1 extends in the direction opposite to the movement direction of the slit nozzle 61 (−X direction) after the slit nozzle 61 moves in the + X direction. By spreading the liquid material Q1, an end side 20a which is one of the end portions 20e of the separation layer 20 is formed.

  Next, as shown in FIG. 8A, the slit nozzle 61 stops moving when the opening 61a reaches a position separated from the end side 10b of the glass support 10 by a predetermined distance LX2, and the opening 61a The discharge of the liquid material Q1 from 61a is stopped. Thereafter, as shown in FIG. 8B, the slit nozzle 61 is raised and the opening 61 a is separated from the glass support 10. Although the discharge of the liquid material Q1 is stopped at the timing when the predetermined distance LX2 is reached, the liquid material Q1 is directed toward the side edge 10b of the glass support 10 due to the opening 61a being separated from the glass support 10. Expands in the + X direction. The edge 20b of the separation layer 20 is formed by the expansion of the liquid material Q1. At this time, the distance LX2 is set so that the liquid Q1 does not spread to the end side 10b of the glass support 10.

  Thus, the relative movement range of the glass support 10 and the slit nozzle 61 is adjusted in consideration of the expansion of the liquid Q1 at both the discharge start and discharge stop positions of the liquid Q1. Thus, the end sides 20a and 20b of the separation layer 20 can be separated from the both end sides 10a and 10b of the glass support 10 in the moving direction (X direction) by distances L1 and L2, respectively.

  In addition, as shown in FIG. 9, when the slit nozzle 61 is moved while discharging the liquid material Q <b> 1 from the opening 61 a of the slit nozzle 61, the liquid material Q <b> 1 applied to the glass support 10 moves the slit nozzle 61. It spreads in the direction orthogonal to the direction (Y direction), that is, the end 10c side (+ Y direction) and 10d side (−Y direction) of the glass support 10. The edges 20c and 20d of the separation layer 20 are formed by the spreading of the liquid material Q1.

  In this case, in the direction (Y direction) orthogonal to the moving direction of the slit nozzle 61, the length of the opening width of the opening 61a (the length in the Y direction) is adjusted, and the glass from the −Y side end of the opening 61a. The distance MY1 is set up to the end 10c of the support 10, and the distance MY2 is set from the + Y side end of the opening 61a to the end 10d of the glass support 10. Thereby, the end sides 20c and 20d of the separation layer 20 can be separated from the both end sides 10c and 10d of the glass support 10 in the direction orthogonal to the moving direction by distances M1 and M2, respectively. For adjusting the length of the opening width of the opening 61a, a closing member or the like for closing a part of the opening 61a may be used, or a dedicated opening that matches the length of the glass support 10 in the Y direction. A slit nozzle 61 having a portion 61a may be used.

  The separation layer 20 is formed of a material that changes in quality by absorbing light, for example. In the present embodiment, the change of the separation layer 20 means that the separation layer 20 is in a state where it can be broken by receiving a slight external force, or a state where the adhesive force with the layer in contact with the separation layer 20 is reduced. The separation layer 20 absorbs light and changes its quality, so that the strength or adhesiveness to the glass support 10 is lowered as compared with that before the change. For this reason, the separated separation layer 20 after the alteration is broken or peeled off from the glass support 10 by applying a slight external force (for example, lifting the glass support 10 or the like).

  The alteration of the separation layer 20 includes decomposition (exothermic or non-exothermic), cross-linking, configuration change or dissociation of functional groups (and curing of the separation layer 20 due to these, degassing, Contraction or expansion) and the like. The alteration of the separation layer 20 occurs as a result of light absorption by the material constituting the separation layer 20. Therefore, the type of alteration of the separation layer 20 can be changed according to the type of material constituting the separation layer 20. Further, the separation layer 20 is not limited to a material that changes in quality by absorbing light. For example, a material that changes quality by absorbing heat applied without depending on light, or a material that changes quality by other solvents may be used.

  The thickness of the separation layer 20 is more preferably, for example, 0.05 to 50 μm, and further preferably 0.3 to 1 μm. If the thickness of the separation layer 20 is within a range of 0.05 to 50 μm, it is possible to irradiate with light for a short time and light with low energy, or for a short time with heating, to be immersed in a solvent for a short time. The desired alteration can be caused in the separation layer 20. The thickness of the separation layer 20 is particularly preferably within a range of 1 μm or less from the viewpoint of productivity.

  Hereinafter, the separation layer 20 that is altered by the energy of the absorbed light will be described. The separation layer 20 is preferably formed only from a material having a structure that absorbs light, but in a range that does not impair the essential characteristics, a material that does not have a structure that absorbs light is added. The separation layer 20 may be formed. Further, it is preferable that the surface of the separation layer 20 on the side facing the adhesive layer 13 is flat (unevenness is not formed), so that the separation layer 20 can be easily formed, and even when pasted. It becomes possible to apply evenly.

The separation layer 20 may be altered by absorbing light irradiated from the laser. That is, the light applied to the separation layer 20 in order to change the quality of the separation layer 20 may be emitted from a laser. Examples of lasers that emit light that irradiates the separation layer 20 include solid-state lasers such as YAG lasers, ruby lasers, glass lasers, YVO ₄ lasers, LD lasers, fiber lasers, liquid lasers such as dye lasers, CO ₂ lasers, Examples thereof include a gas laser such as an excimer laser, an Ar laser, and a He—Ne laser, a laser beam such as a semiconductor laser and a free electron laser, or a non-laser beam. The laser that emits light to irradiate the separation layer 20 can be appropriately selected according to the material constituting the separation layer 20, and irradiates light with a wavelength that can alter the material constituting the separation layer 20. The laser to be selected may be selected.

(Fluorocarbon)
The separation layer 20 may be made of a fluorocarbon. Since the separation layer 20 is composed of fluorocarbon, the separation layer 20 is altered by absorbing light. As a result, the separation layer 20 loses strength or adhesiveness before being irradiated with light. Therefore, by applying a slight external force (for example, lifting the glass support 10 or the like), the separation layer 20 is broken, and the glass support 10 and the substrate 40 can be easily separated. The fluorocarbon constituting the separation layer 20 can be suitably formed by a plasma CVD (chemical vapor deposition) method.

  The fluorocarbon absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength within a range that is absorbed by the fluorocarbon used in the separation layer 20, the fluorocarbon can be suitably altered. The light absorption rate in the separation layer 20 is preferably 80% or more.

As light to irradiate the separation layer 20, a liquid laser such as a solid laser such as a YAG laser, a ruby laser, a glass laser, a YVO4 laser, an LD laser, or a fiber laser, or a dye laser, depending on the wavelength that can be absorbed by the fluorocarbon. A gas laser such as a CO ₂ laser, an excimer laser, an Ar laser, or a He—Ne laser, a laser beam such as a semiconductor laser or a free electron laser, or a non-laser beam may be used as appropriate. The wavelength at which the fluorocarbon can be altered is not limited to this, but for example, a wavelength in the range of 600 nm or less can be used.

(Polymer containing light-absorbing structure in its repeating unit)
The separation layer 20 may contain a polymer containing a light-absorbing structure in its repeating unit. The polymer is altered by irradiation with light. The alteration of the polymer occurs when the structure absorbs the irradiated light. The separation layer 20 has lost its strength or adhesiveness before being irradiated with light as a result of the alteration of the polymer. Therefore, by applying a slight external force (for example, lifting the glass support 10 or the like), the separation layer 20 is broken, and the glass support 10 and the substrate 40 can be easily separated.

  The above-mentioned structure having light absorptivity is a chemical structure that absorbs light and alters a polymer containing the structure as a repeating unit. The structure is, for example, an atomic group including a conjugated π electron system composed of a substituted or unsubstituted benzene ring, condensed ring, or heterocyclic ring. More specifically, the structure may be a cardo structure, or a benzophenone structure, a diphenyl sulfoxide structure, a diphenyl sulfone structure (bisphenyl sulfone structure), a diphenyl structure or a diphenylamine structure present in the side chain of the polymer.

  When the structure is present in the side chain of the polymer, the structure can be represented by the following formula:

(In the formula, each R is independently an alkyl group, an aryl group, a halogen, a hydroxyl group, a ketone group, a sulfoxide group, a sulfone group or an N (R ¹ ) (R ² ) group (where R ¹ and R ² is each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), Z is absent or is —CO—, —SO ₂ —, —SO— or —NH—, and n Is 0 or an integer of 1 to 5.)
In addition, the polymer includes, for example, a repeating unit represented by any one of (a) to (d) among the following formulas, is represented by (e), or (f) Contains structure in its main chain.

(In the formula, l is an integer of 1 or more, m is an integer of 0 or 1-2, and X is any one of the formulas shown in the above chemical formula [Chemical Formula 1] in (a) to (e)). And (f) is any one of the formulas shown in the above [Chemical Formula 1] or is not present, and Y ₁ and Y ₂ are each independently —CO— or —SO ₂ —. L is preferably an integer of 10 or less.)
Examples of the benzene ring, condensed ring and heterocyclic ring represented by the above chemical formula [Chemical Formula 1] include phenyl, substituted phenyl, benzyl, substituted benzyl, naphthalene, substituted naphthalene, anthracene, substituted anthracene, anthraquinone, substituted anthraquinone, acridine, Examples include substituted acridine, azobenzene, substituted azobenzene, fluorene, substituted fluorene, fluorenone, substituted fluorenone, carbazole, substituted carbazole, N-alkylcarbazole, dibenzofuran, substituted dibenzofuran, phenanthrene, substituted phenanthrene, pyrene and substituted pyrene. When the exemplified substituent further has a substituent, the substituent is, for example, alkyl, aryl, halogen atom, alkoxy, nitro, aldehyde, cyano, amide, dialkylamino, sulfonamide, imide, carboxylic acid, Selected from carboxylic acid esters, sulfonic acids, sulfonic acid esters, alkylamino and arylamino.

Among the substituents represented by the above chemical formula [Chemical Formula 1], as an example of the fifth substituent having two phenyl groups and Z being —SO ₂ —, bis (2 , 4-dihydroxyphenyl) sulfone, bis (3,4-dihydroxyphenyl) sulfone, bis (3,5-dihydroxyphenyl) sulfone, bis (3,6-dihydroxyphenyl) sulfone, bis (4-hydroxyphenyl) sulfone, Examples thereof include bis (3-hydroxyphenyl) sulfone, bis (2-hydroxyphenyl) sulfone, and bis (3,5-dimethyl-4-hydroxyphenyl) sulfone.

  Of the substituents represented by the above chemical formula [Chemical Formula 1], as an example of the fifth substituent having two phenyl groups and Z being —SO—, bis (2, 3-dihydroxyphenyl) sulfoxide, bis (5-chloro-2,3-dihydroxyphenyl) sulfoxide, bis (2,4-dihydroxyphenyl) sulfoxide, bis (2,4-dihydroxy-6-methylphenyl) sulfoxide, bis ( 5-chloro-2,4-dihydroxyphenyl) sulfoxide, bis (2,5-dihydroxyphenyl) sulfoxide, bis (3,4-dihydroxyphenyl) sulfoxide, bis (3,5-dihydroxyphenyl) sulfoxide, bis (2, 3,4-trihydroxyphenyl) sulfoxide, bis (2,3,4-trihydroxy-6-methyl) Enyl) -sulfoxide, bis (5-chloro-2,3,4-trihydroxyphenyl) sulfoxide, bis (2,4,6-trihydroxyphenyl) sulfoxide, bis (5-chloro-2,4,6-tri) Hydroxyphenyl) sulfoxide and the like.

  Among the substituents represented by the above chemical formula [Chemical Formula 1], as an example of the fifth substituent having two phenyl groups and Z is —C (═O) —, 2,4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2', 5,6'-tetrahydroxybenzophenone, 2-hydroxy-4 -Methoxybenzophenone, 2-hydroxy-4-octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,6-dihydroxy-4-methoxybenzophenone, 2,2 '-Dihydroxy-4,4'-dimethoxybenzophenone, 4-amino-2'-hydroxybenzophenone, 4 Dimethylamino-2'-hydroxybenzophenone, 4-diethylamino-2'-hydroxybenzophenone, 4-dimethylamino-4'-methoxy-2'-hydroxybenzophenone, 4-dimethylamino-2 ', 4'-dihydroxybenzophenone, and Examples include 4-dimethylamino-3 ′, 4′-dihydroxybenzophenone.

  When the structure is present in the side chain of the polymer, the proportion of the repeating unit containing the structure in the polymer is such that the light transmittance of the separation layer 20 is 0.001% or more, 10 % Or less. If the polymer is prepared so that the ratio falls within such a range, the separation layer 20 can sufficiently absorb light and can be reliably and rapidly altered. That is, the glass support 10 can be easily removed from the laminate 50, and the light irradiation time necessary for the removal can be shortened.

  The said structure can absorb the light which has a wavelength of a desired range by selection of the kind. For example, the wavelength of light that can be absorbed by the above structure is more preferably in the range of 100 nm to 2,000 nm. Within this range, the wavelength of light that can be absorbed by the structure is on the shorter wavelength side, for example, in the range of 100 nm to 500 nm. For example, the structure can alter the polymer containing the structure by absorbing ultraviolet light, preferably having a wavelength in the range of about 300 nm to 370 nm.

  The light that can be absorbed by the above structure is, for example, a high-pressure mercury lamp (wavelength: 254 nm or more, 436 nm or less), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157 nm). , Light emitted from a XeCl laser (wavelength: 308 nm), XeF laser (wavelength: 351 nm) or solid-state UV laser (wavelength: 355 nm), or g-line (wavelength: 436 nm), h-line (wavelength: 405 nm) or i-line ( Wavelength: 365 nm).

  Although the separation layer 20 described above contains a polymer containing the above structure as a repeating unit, the separation layer 20 may further contain components other than the polymer. Examples of the component include a filler, a plasticizer, and a component that can improve the peelability of the glass support 10. These components are appropriately selected from conventionally known substances or materials that do not hinder or promote the absorption of light by the above structure and the alteration of the polymer.

(Inorganic)
The separation layer 20 may be made of an inorganic material. The separation layer 20 is made of an inorganic material, and is thereby altered by absorbing light. As a result, the separation layer 20 loses strength or adhesiveness before being irradiated with light. Therefore, by applying a slight external force (for example, lifting the glass support 10 or the like), the separation layer 20 is broken, and the glass support 10 and the substrate 40 can be easily separated.

The said inorganic substance should just be the structure which changes in quality by absorbing light, for example, 1 or more types of inorganic substances selected from the group which consists of a metal, a metal compound, and carbon can be used conveniently. The metal compound refers to a compound containing a metal atom, and can be, for example, a metal oxide or a metal nitride. Examples of such inorganic materials include, but are not limited to, gold, silver, copper, iron, nickel, aluminum, titanium, chromium, SiO ₂ , SiN, Si ₃ N ₄ , TiN, and carbon. One or more inorganic substances selected from the group consisting of: Carbon is a concept that may include an allotrope of carbon, for example, diamond, fullerene, diamond-like carbon, carbon nanotube, and the like.

  The inorganic material absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer with light having a wavelength within a range that is absorbed by the inorganic material used for the separation layer 20, the inorganic material can be suitably altered.

The light applied to the separation layer 20 made of an inorganic material may be, for example, a solid-state laser such as a YAG laser, a ruby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, or a dye, depending on the wavelength that can be absorbed by the inorganic material. A liquid laser such as a laser, a gas laser such as a CO ₂ laser, an excimer laser, an Ar laser, or a He—Ne laser, a laser beam such as a semiconductor laser or a free electron laser, or a non-laser beam may be used as appropriate.

  The separation layer 20 made of an inorganic material can be formed on the glass support 10 by a known technique such as sputtering, chemical vapor deposition (CVD), plating, plasma CVD, or spin coating. The thickness of the separation layer 20 made of an inorganic material is not particularly limited as long as it is a film thickness that can sufficiently absorb the light to be used. For example, the film thickness is in the range of 0.05 μm or more and 10 μm or less. Is more preferable. Alternatively, an adhesive may be applied in advance to both surfaces or one surface of an inorganic film (for example, a metal film) made of an inorganic material constituting the separation layer 20 and attached to the glass support 10 and the substrate 40.

  When a metal film is used as the separation layer 20, laser reflection or charging of the film may occur depending on the film quality of the separation layer 20, the type of laser light source, laser output, and the like. Therefore, it is preferable to take measures against these problems by providing an antireflection film or an antistatic film on the upper and lower sides of the separation layer 20 or one of them.

(Compound having infrared absorbing structure)
The separation layer 20 may be formed of a compound having an infrared absorbing structure. The compound is altered by absorbing infrared rays. The separation layer 20 has lost its strength or adhesiveness before being irradiated with infrared rays as a result of the alteration of the compound. Therefore, by applying a slight external force (for example, lifting the support), the separation layer 20 is broken, and the glass support 10 and the substrate 40 can be easily separated.

Examples of the compound having an infrared absorptive structure or a compound having an infrared absorptive structure include alkanes, alkenes (vinyl, trans, cis, vinylidene, trisubstituted, tetrasubstituted, conjugated, cumulene, Cyclic), alkyne (monosubstituted, disubstituted), monocyclic aromatic (benzene, monosubstituted, disubstituted, trisubstituted), alcohol and phenol (free OH, intramolecular hydrogen bond, intermolecular hydrogen bond, saturation) Secondary, saturated tertiary, unsaturated secondary, unsaturated tertiary), acetal, ketal, aliphatic ether, aromatic ether, vinyl ether, oxirane ring ether, peroxide ether, ketone, dialkylcarbonyl, Aromatic carbonyl, 1,3-diketone enol, o-hydroxy aryl ketone, dialkyl aldehyde, aromatic aldehyde, carboxylic acid (dimer, Rubonic acid anion), formate ester, acetate ester, conjugated ester, non-conjugated ester, aromatic ester, lactone (β-, γ-, δ-), aliphatic acid chloride, aromatic acid chloride, acid anhydride ( Conjugated, non-conjugated, cyclic, acyclic), primary amide, secondary amide, lactam, primary amine (aliphatic, aromatic), secondary amine (aliphatic, aromatic), secondary Tertiary amine (aliphatic, aromatic), primary amine salt, secondary amine salt, tertiary amine salt, ammonium ion, aliphatic nitrile, aromatic nitrile, carbodiimide, aliphatic isonitrile, aromatic isonitrile, Isocyanate ester, thiocyanate ester, aliphatic isothiocyanate ester, aromatic isothiocyanate ester, aliphatic nitro compound, aromatic nitro compound, nitroamine, nitrosamine, glass Esters, nitrites, nitroso bonds (aliphatic, aromatic, monomer, dimer), sulfur compounds such as mercaptans and thiophenol and thiolic acid, thiocarbonyl groups, sulfoxides, sulfones, sulfonyl chlorides, primary Sulfonamide, secondary sulfonamide, sulfate ester, carbon-halogen bond, Si-A ¹ bond (A ¹ is H, C, O or halogen), PA ² bond (A ² is H, C or O), or Ti—O bonds.

As a structure containing halogen bond, for _{example, -CH 2 Cl, -CH 2 Br} , -CH 2 I, -CF 2 - - the _{carbon, - CF 3, -CH = CF} 2, -CF = CF 2, fluoride Aryl chloride and aryl chloride.

Examples of the structure containing the Si—A ¹ bond include SiH, SiH ₂ , SiH ₃ , Si—CH ₃ , Si—CH ₂ —, Si—C ₆ H ₅ , SiO-aliphatic, Si—OCH ₃ , Si— _{OCH 2 CH 3, Si-OC} 6 H 5, Si-O-Si, Si-OH, SiF, SiF 2, and SiF _3, and the like. As a structure including a Si—A ¹ bond, a siloxane skeleton and a silsesquioxane skeleton are particularly preferably formed.

Examples of the structure containing the P—A ² bond include PH, PH ₂ , P—CH ₃ , P—CH ₂ —, P—C ₆ H ₅ , A ³ ₃ —PO— (A ³ is aliphatic or aromatic. _{^{family), (A 4 O) 3}} -P-O (A 4 _{alkyl), P-OCH 3, P} -OCH 2 CH 3, P-OC 6 H 5, P-O-P, P-OH, and O = P-OH and the like can be mentioned.

  The said structure can absorb the infrared rays which have the wavelength of a desired range by selection of the kind. Specifically, the wavelength of infrared rays that can be absorbed by the above structure is, for example, in the range of 1 μm or more and 20 μm or less, and more preferably in the range of 2 μm or more and 15 μm or less. Furthermore, in the case where the structure is a Si—O bond, a Si—C bond, or a Ti—O bond, it may be in the range of 9 μm or more and 11 μm or less. In addition, those skilled in the art can easily understand the infrared wavelength that can be absorbed by each structure. For example, as an absorption band in each structure, Non-Patent Document: SILVERSTEIN / BASSLER / MORRILL, “Identification method by spectrum of organic compound (5th edition) —Combination of MS, IR, NMR and UV” (published in 1992) The description on page 146 to page 151 can be referred to.

  As the compound having an infrared-absorbing structure used for forming the separation layer 20, among the compounds having the structure as described above, it can be dissolved in a solvent for coating, and is solidified and solidified. There is no particular limitation as long as the layer can be formed. However, in order to effectively alter the compound in the separation layer 20 and facilitate separation of the glass support 10 and the substrate 40, the absorption of infrared rays in the separation layer 20 is large. It is preferable that the infrared transmittance when irradiated is low. Specifically, the infrared transmittance in the separation layer 20 is preferably lower than 90%, and the infrared transmittance is more preferably lower than 80%.

  For example, the compound having a siloxane skeleton is a copolymer of a repeating unit represented by the following chemical formula [Chemical Formula 3] and a repeating unit represented by the following chemical formula [Chemical Formula 4]. A certain resin or a resin that is a copolymer of a repeating unit represented by the following chemical formula [Chemical Formula 4] and a repeating unit derived from an acrylic compound can be used.

(In the chemical formula [Chemical Formula 4], R ³ is hydrogen, an alkyl group having 10 or less carbon atoms, or an alkoxy group having 10 or less carbon atoms.)
Among them, as a compound having a siloxane skeleton, t-butylstyrene (TBST) which is a copolymer of a repeating unit represented by the above chemical formula [Chemical Formula 3] and a repeating unit represented by the following Chemical Formula [Chemical Formula 5] -A dimethylsiloxane copolymer is more preferable, and includes a repeating unit represented by the above chemical formula [Chemical Formula 3] and a repeating unit represented by the following Chemical Formula [Chemical Formula 5] in a ratio of 1: 1. More preferred is coalescence.

  Examples of the compound having a silsesquioxane skeleton include a resin that is a copolymer of a repeating unit represented by the following chemical formula [Chemical Formula 6] and a repeating unit represented by the following chemical formula [Chemical Formula 7]. Can be used.

(In the above chemical formula [Chemical Formula 6], R ⁴ is hydrogen or an alkyl group having 1 to 10 carbon atoms, and in the above chemical formula [Chemical Formula 7], R ⁵ has 1 to 10 carbon atoms. It is an alkyl group or a phenyl group.)
Other compounds having a silsesquioxane skeleton include JP 2007-258663 A (published on October 4, 2007), JP 2010-120901 A (published on June 3, 2010), Each silsesquioxane resin disclosed in JP 2009-263316 A (published on November 12, 2009) and JP 2009-263596 A (published on November 12, 2009) is preferably used. Can do.

  Among them, the compound having a silsesquioxane skeleton is more preferably a repeating unit represented by the following chemical formula [Chemical Formula 8] and a copolymer of a repeating unit represented by the following chemical formula [Chemical Formula 9]. A copolymer containing a repeating unit represented by the chemical formula [Chemical Formula 8] and a repeating unit represented by the following chemical formula [Chemical Formula 9] at 7: 3 is more preferable.

  The polymer having a silsesquioxane skeleton may have a random structure, a ladder structure, and a cage structure, and any structure may be used.

Examples of the compound containing a Ti-O bond include (i) tetra-i-propoxytitanium, tetra-n-butoxytitanium, tetrakis (2-ethylhexyloxy) titanium, and titanium-i-propoxyoctylene glycolate. (ii) di -i- propoxy bis (acetylacetonato) titanium, and propane di oxytitanium bis (ethylacetoacetate) chelate titanium such as; alkoxy titanium etc. _{(iii) i-C 3 H} 7 O - [- _{Ti (O-i-C 3} H 7) 2 -O-] n -i-C 3 H 7, and _{n-C 4 H 9 O -} [- Ti (O-n-C 4 H 9) 2 -O _-] n _-n-C 4 titanium polymers such as _{H 9;} (iv) tri -n- butoxy titanium monostearate, titanium stearate, di -i- propoxytitanium di- Examples include isostearate and acylate titanium such as (2-n-butoxycarbonylbenzoyloxy) tributoxytitanium; (v) water-soluble titanium compounds such as di-n-butoxy-bis (triethanolaminato) titanium and the like. It is done.

Among them, as a compound containing a Ti—O bond, di-n-butoxy bis (triethanolaminato) titanium (Ti (OC ₄ H ₉ ) ₂ [OC ₂ H ₄ N (C ₂ H ₄ OH) ₂ ] ₂ ) is preferred.

  Although the separation layer 20 described above contains a compound having an infrared absorbing structure, the separation layer 20 may further contain a component other than the above compound. Examples of the component include a filler, a plasticizer, and a component that can improve the peelability of the glass support 10. These components are appropriately selected from conventionally known substances or materials that do not interfere with or promote infrared absorption by the above structure and alteration of the compound.

(Infrared absorbing material)
The separation layer 20 may contain an infrared absorbing material. The separation layer 20 is configured to contain an infrared absorbing material, and is thereby altered by absorbing light. As a result, the separation layer 20 loses its strength or adhesiveness before being irradiated with light. Therefore, by applying a slight external force (for example, lifting the glass support 10 or the like), the separation layer 20 is broken, and the glass support 10 and the substrate 40 can be easily separated.

  The infrared absorbing material only needs to have a structure that is altered by absorbing infrared rays. For example, carbon black, iron particles, or aluminum particles can be suitably used. The infrared absorbing material absorbs light having a wavelength in a specific range depending on the type. By irradiating the separation layer 20 with light having a wavelength within a range that is absorbed by the infrared absorbing material used for the separation layer 20, the infrared absorbing material can be suitably altered.

<Adhesive layer forming step>
The adhesive layer forming step S02 is performed after the separation layer forming step S01. In the adhesive layer forming step S02, for example, as shown in FIG. 3A, the separation layer 20 is bonded to the side where the glass support 10 is not present, that is, the adhesive layer forming surface 20f, so that the separation layer 20 is in contact with each other. Layer 30 is formed. In the adhesive layer forming step S02, the adhesive layer 30 is formed on the separation layer 20 in a state where the end 30e of the adhesive layer 30 is separated from the end 20e of the separation layer 20. For example, first, the adhesive layer 30 is formed on the entire surface of the adhesive layer forming surface 20 f of the separation layer 20. Thereafter, the peripheral edge of the end portion 30 e of the adhesive layer 30 is removed so that the end portion 30 e of the adhesive layer 30 is separated from the end portion 20 e of the separation layer 20.

  In the example shown in FIG. 3A, the adhesive layer 30 has end sides 30a and 30b. For example, the end sides 30a and 30b are arranged in parallel to the end sides 20a and 20b of the separation layer 20, respectively. The end side 30a of the adhesive layer 30 is disposed with a distance L3 from the end side 20a of the separation layer 20. The end side 30b of the adhesive layer 30 is disposed with a distance L4 from the end side 20b of the separation layer 20. The distance L3 and the distance L4 may be the same value or different values.

(Production example of adhesive layer)
In the adhesive layer forming step S02, a liquid material containing an adhesive may be applied to the separation layer 20, or an adhesive tape having an adhesive applied on both sides may be attached to the separation layer 20. The method for applying the adhesive is not particularly limited, and examples thereof include spin coating, dipping, roller blade, doctor blade, spray, and slit nozzle methods. Moreover, after apply | coating an adhesive agent on the separated layer 20, you may dry by heating etc. As the adhesive, various adhesives known in the art such as acrylic, novolak, naphthoquinone, hydrocarbon, polyimide, and elastomer can be used.

  10 and 11 are process diagrams showing how the adhesive layer forming process S02 is performed. In the adhesive layer forming step S02, an adhesive layer forming apparatus having the same configuration as that of the separation layer forming apparatus 90 is used. The adhesive layer forming step S02 may be performed using the same apparatus as the separation layer forming apparatus 90. In that case, prior to the adhesive layer forming step S02, a slit nozzle 62 for discharging the liquid material Q2 for forming the adhesive layer 30 is installed in place of the slit nozzle 61. In the slit nozzle 62, the dimension of the opening 62 a in the direction (Y direction) orthogonal to the moving direction (X direction) is smaller than the dimension of the opening 61 a of the slit nozzle 61.

  In the adhesive layer forming step S02, as shown in FIG. 10, after the glass support 10 is disposed on the stage portion 70, the opening 62a of the slit nozzle 62 is disposed toward the adhesive layer forming surface 20f of the separation layer 20, The liquid material Q2 is discharged from the opening 62a to the adhesive layer forming surface 20f. At this time, the discharge start position of the liquid material Q2 by the opening 62a is set at a position away from the end side 10a of the glass support 10 by a predetermined distance LX3.

  Thereafter, the liquid material Q2 is discharged from the opening 62a while moving the slit nozzle 62 in the + Y direction. By this operation, the liquid material Q2 is applied in the moving direction (+ X direction) of the slit nozzle 62. Further, the liquid Q2 spreads in the direction opposite to the movement direction of the slit nozzle 62 (−X direction). The edge 30a of the adhesive layer 30 is formed by the spreading of the liquid material Q2. The distance LX3 is set so that the liquid Q2 does not flow to the end side 20a of the separation layer 20. When the opening 62a of the slit nozzle 62 reaches a position away from the end side 20b of the separation layer 20 by a predetermined distance LX4, the movement of the slit nozzle 62 is stopped and the discharge of the liquid Q2 from the opening 62a is stopped. . Thereafter, the slit nozzle 62 is raised, and the opening 62 a is separated from the separation layer 20. Although the discharge of the liquid material Q2 stops at the timing when the predetermined distance LX4 is reached, the liquid material Q2 spreads toward the end 20b of the separation layer 20 due to the opening 62a being separated from the separation layer 20. The edge 30b of the adhesive layer 30 is formed by the spread of the liquid Q2. At this time, the distance LX4 is set so that the liquid Q2 does not flow to the end side 20b of the separation layer 20.

  In this way, by adjusting the relative movement range of the separation layer 20 (glass support 10) and the slit nozzle 62, the ends of the adhesive layer 30 are respectively separated from the both ends 20a and 20b of the separation layer 20 in the movement direction. The sides 30a and 30b can be separated by distances L3 and L4.

  In addition, as shown in FIG. 11, when the slit nozzle 62 is moved while discharging the liquid Q2 from the opening 62a of the slit nozzle 62, the liquid Q2 applied on the separation layer 20 is moved by the slit nozzle 62. It spreads in the direction orthogonal to the direction (Y direction), that is, in the end 20c side (+ Y direction) and 20d side (−Y direction) of the separation layer 20, respectively. The edges 30c and 30d of the adhesive layer 30 are formed by the spreading of the liquid material Q2.

  In this case, the length of the opening 62a (the length in the Y direction) is adjusted in the direction orthogonal to the moving direction of the slit nozzle 62 (Y direction), and separated from the −Y side end of the opening 62a. The distance MY3 is set up to the edge 20c of the layer 20, and the distance MY4 is set from the + Y side edge of the opening 62a to the edge 20d of the separation layer 20. As a result, the end sides 30c and 30d of the adhesive layer 30 can be separated from the both end sides 20c and 20d of the separation layer 20 in the direction orthogonal to the moving direction by distances M3 and M4, respectively. Adjustment of the length of the opening width of the opening 62a is the same as that of the slit nozzle 61 described above.

  The resin contained in the adhesive layer 30 is not particularly limited as long as it has adhesiveness, for example, a hydrocarbon resin, an acrylic-styrene resin, a maleimide resin, an elastomer resin, or a combination thereof. Can be mentioned.

The glass transition temperature (Tg) of the adhesive varies depending on the type and molecular weight of the resin, and a compound such as a plasticizer for the adhesive. The type and molecular weight of the resin contained in the adhesive can be appropriately selected according to the type of the substrate and the support, but the Tg of the resin used for the adhesive is in the range of −60 ° C. or higher and 200 ° C. or lower. The inside is preferable, and the inside of the range of −25 ° C. or higher and 150 ° C. or lower is more preferable. When the Tg of the resin used for the adhesive is in the range of −60 ° C. or more and 200 ° C. or less, the adhesive force of the adhesive layer 30 can be suitably reduced without requiring excessive energy for cooling. Moreover, you may adjust Tg of the contact bonding layer 30 by mix | blending a plasticizer, resin of a low polymerization degree, etc. suitably. The glass transition temperature (Tg) can be measured using, for example, a known differential scanning calorimeter (DSC).
(Hydrocarbon resin)
The hydrocarbon resin is a resin that has a hydrocarbon skeleton and is obtained by polymerizing a monomer composition. As the hydrocarbon resin, cycloolefin polymer (hereinafter sometimes referred to as “resin (A)”), and at least one resin selected from the group consisting of terpene resin, rosin resin and petroleum resin (hereinafter referred to as “resin (A)”). Resin (B) ”), and the like, but is not limited thereto.

  The resin (A) may be a resin obtained by polymerizing a monomer component containing a cycloolefin monomer. Specific examples include a ring-opening (co) polymer of a monomer component containing a cycloolefin monomer, and a resin obtained by addition (co) polymerization of a monomer component containing a cycloolefin monomer.

  Examples of the cycloolefin monomer contained in the monomer component constituting the resin (A) include bicyclic compounds such as norbornene and norbornadiene, tricyclic compounds such as dicyclopentadiene and dihydroxypentadiene, tetracyclododecene, and the like. Tetracyclics, pentacyclics such as cyclopentadiene trimers, heptacyclics such as tetracyclopentadiene, or alkyl (methyl, ethyl, propyl, butyl, etc.) substitutions of these polycyclics, alkenyls (vinyl, etc.) Substitution, alkylidene (ethylidene, etc.) substitution, aryl (phenyl, tolyl, naphthyl, etc.) substitution, etc. are mentioned. Among these, norbornene-based monomers selected from the group consisting of norbornene, tetracyclododecene, and alkyl-substituted products thereof are particularly preferable.

  The monomer component constituting the resin (A) may contain another monomer copolymerizable with the above-described cycloolefin-based monomer, and preferably contains, for example, an alkene monomer. Examples of the alkene monomer include ethylene, propylene, 1-butene, isobutene, 1-hexene, α-olefin and the like. The alkene monomer may be linear or branched.

  Moreover, it is preferable from a viewpoint of high heat resistance (low thermal decomposition and thermal weight reduction property) to contain a cycloolefin monomer as a monomer component which comprises resin (A). The ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is preferably 5 mol% or more, more preferably 10 mol% or more, and further preferably 20 mol% or more. preferable. Further, the ratio of the cycloolefin monomer to the whole monomer component constituting the resin (A) is not particularly limited, but is preferably 80 mol% or less from the viewpoint of solubility and stability over time in a solution, More preferably, it is 70 mol% or less.

  Moreover, you may contain a linear or branched alkene monomer as a monomer component which comprises resin (A). The ratio of the alkene monomer to the whole monomer component constituting the resin (A) is preferably 10 to 90 mol%, more preferably 20 to 85 mol% from the viewpoint of solubility and flexibility. 30 to 80 mol% is more preferable.

  The resin (A) is a resin having no polar group, such as a resin obtained by polymerizing a monomer component composed of a cycloolefin monomer and an alkene monomer, at high temperatures. It is preferable for suppressing generation of gas.

  The polymerization method and polymerization conditions for polymerizing the monomer components are not particularly limited, and may be set as appropriate according to conventional methods.

  Examples of commercially available products that can be used as the resin (A) include “TOPAS” manufactured by Polyplastics Co., Ltd., “APEL” manufactured by Mitsui Chemicals, Inc., “ZEONOR” and “ZEONEX” manufactured by Zeon Corporation. And “ARTON” manufactured by JSR Corporation.

  The glass transition temperature (Tg) of the resin (A) is preferably 60 ° C. or higher, and particularly preferably 70 ° C. or higher. When the glass transition temperature of the resin (A) is 60 ° C. or higher, softening of the adhesive layer 30 can be further suppressed when the laminate is exposed to a high temperature environment.

  The resin (B) is at least one resin selected from the group consisting of terpene resins, rosin resins and petroleum resins. Specifically, examples of the terpene resin include terpene resins, terpene phenol resins, modified terpene resins, hydrogenated terpene resins, hydrogenated terpene phenol resins, and the like. Examples of the rosin resin include rosin, rosin ester, hydrogenated rosin, hydrogenated rosin ester, polymerized rosin, polymerized rosin ester, and modified rosin. Examples of petroleum resins include aliphatic or aromatic petroleum resins, hydrogenated petroleum resins, modified petroleum resins, alicyclic petroleum resins, coumarone-indene petroleum resins, and the like. Among these, hydrogenated terpene resins and hydrogenated petroleum resins are more preferable.

  Although the softening point of resin (B) is not specifically limited, It is preferable that it is 80-160 degreeC. When the softening point of the resin (B) is 80 ° C. or higher, the laminate can be suppressed from being softened when exposed to a high temperature environment, and adhesion failure does not occur. On the other hand, when the softening point of the resin (B) is 160 ° C. or less, the peeling rate when peeling the laminate is good.

  Although the weight average molecular weight of resin (B) is not specifically limited, It is preferable that it is 300-3,000. When the weight average molecular weight of the resin (B) is 300 or more, the heat resistance is sufficient, and the degassing amount is reduced under a high temperature environment. On the other hand, when the weight average molecular weight of the resin (B) is 3,000 or less, the peeling rate when peeling the laminate is good. In addition, the weight average molecular weight of resin (B) in this embodiment means the molecular weight of polystyrene conversion measured by gel permeation chromatography (GPC).

  In addition, you may use what mixed resin (A) and resin (B) as resin. By mixing, heat resistance and peeling speed are improved. For example, the mixing ratio of the resin (A) and the resin (B) is (A) :( B) = 80: 20 to 55:45 (mass ratio). Since it is excellent in tolerance and flexibility, it is preferable.

(Acrylic-styrene resin)
Examples of the acrylic-styrene resin include a resin obtained by polymerization using styrene or a styrene derivative and (meth) acrylic acid ester as monomers.

  Examples of the (meth) acrylic acid ester include a (meth) acrylic acid alkyl ester having a chain structure, a (meth) acrylic acid ester having an aliphatic ring, and a (meth) acrylic acid ester having an aromatic ring. . Examples of the (meth) acrylic acid alkyl ester having a chain structure include an acrylic long-chain alkyl ester having an alkyl group having 15 to 20 carbon atoms and an acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms. . As acrylic long-chain alkyl esters, acrylic or methacrylic acid whose alkyl group is n-pentadecyl group, n-hexadecyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-eicosyl group, etc. Examples include alkyl esters. The alkyl group may be branched.

  Examples of the acrylic alkyl ester having an alkyl group having 1 to 14 carbon atoms include known acrylic alkyl esters used in existing acrylic adhesives. For example, an alkyl group of acrylic acid or methacrylic acid in which the alkyl group is a methyl group, ethyl group, propyl group, butyl group, 2-ethylhexyl group, isooctyl group, isononyl group, isodecyl group, dodecyl group, lauryl group, tridecyl group, etc. Examples include esters.

  Examples of (meth) acrylic acid ester having an aliphatic ring include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate, norbornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl. (Meth) acrylate, tetracyclododecanyl (meth) acrylate, dicyclopentanyl (meth) acrylate and the like can be mentioned, and isobornyl methacrylate and dicyclopentanyl (meth) acrylate are more preferable.

  The (meth) acrylic acid ester having an aromatic ring is not particularly limited. Examples of the aromatic ring include a phenyl group, a benzyl group, a tolyl group, a xylyl group, a biphenyl group, a naphthyl group, and an anthracenyl group. A phenoxymethyl group, a phenoxyethyl group, and the like. The aromatic ring may have a chain or branched alkyl group having 1 to 5 carbon atoms. Specifically, phenoxyethyl acrylate is preferable.

(Maleimide resin)
Examples of maleimide resins include N-methylmaleimide, N-ethylmaleimide, Nn-propylmaleimide, N-isopropylmaleimide, Nn-butylmaleimide, N-isobutylmaleimide, N-sec as monomers. -Butylmaleimide, N-tert-butylmaleimide, Nn-pentylmaleimide, Nn-hexylmaleimide, Nn-heptylmaleimide, Nn-octylmaleimide, N-laurylmaleimide, N-stearylmaleimide, etc. Male having an aliphatic hydrocarbon group such as maleimide having an alkyl group, N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide A resin obtained by polymerizing an aromatic maleimide having an aryl group such as N, N-phenylmaleimide, Nm-methylphenylmaleimide, N-o-methylphenylmaleimide, and Np-methylphenylmaleimide. It is done.

  For example, a cycloolefin copolymer which is a copolymer of a repeating unit represented by the following chemical formula [Chemical Formula 10] and a repeating unit represented by the following chemical formula [Chemical Formula 11] can be used as the resin of the adhesive component.

(In the above chemical formula [Chemical Formula 11], n is 0 or an integer of 1 to 3)
As such cycloolefin copolymer, APL 8008T, APL 8009T, APL 6013T (all manufactured by Mitsui Chemicals, Inc.) and the like can be used.

(Elastomer)
The elastomer preferably contains a styrene unit as a constituent unit of the main chain, and the “styrene unit” may have a substituent. Examples of the substituent include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkoxyalkyl group having 1 to 5 carbon atoms, an acetoxy group, and a carboxyl group. Further, the content of the styrene unit is more preferably in the range of 14 wt% or more and 50 wt% or less. Furthermore, the elastomer preferably has a weight average molecular weight in the range of 10,000 to 200,000.

  If the content of the styrene unit is in the range of 14% by weight or more and 50% by weight or less, and the weight average molecular weight of the elastomer is in the range of 10,000 or more and 200,000 or less, the hydrocarbon solvent described later Therefore, the first adhesive layer can be removed more easily and quickly. Further, since the content of the styrene unit and the weight average molecular weight are within the above ranges, a resist solvent (eg, PGMEA, PGME, etc.), acid (hydrogen fluoride) exposed when the wafer is subjected to a resist lithography process. Acid, etc.) and alkali (TMAH etc.).

  In addition, you may further mix the (meth) acrylic acid ester mentioned above with the elastomer.

  Further, the content of styrene units is more preferably 17% by weight or more, and more preferably 40% by weight or less.

  A more preferable range of the weight average molecular weight is 20,000 or more, and a more preferable range is 150,000 or less.

  As the elastomer, various elastomers can be used as long as the content of styrene units is in the range of 14% by weight to 50% by weight and the weight average molecular weight of the elastomer is in the range of 10,000 to 200,000. Can be used. For example, polystyrene-poly (ethylene / propylene) block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer (SBS), styrene-butadiene-butylene-styrene block copolymer (SBBS). And hydrogenated products thereof, styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (styrene-isoprene-styrene block copolymer) (SEPS), styrene-ethylene-ethylene- Propylene-styrene block copolymer (SEEPS), styrene-ethylene-ethylene-propylene-styrene block copolypropylene in which styrene block is reactively crosslinked (Septon V9461 (manufactured by Kuraray Co., Ltd.)) The styrene unit content and the weight average molecular weight are within the above-mentioned ranges.

  Of the elastomers, hydrogenated products are more preferable. If it is a hydrogenated product, the stability to heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Further, among elastomers, those having both ends of a styrene block polymer are more preferable. This is because styrene having high thermal stability is blocked at both ends, thereby exhibiting higher heat resistance.

  More specifically, the elastomer is more preferably a hydrogenated product of a block copolymer of styrene and conjugated diene. Stability against heat is improved, and degradation such as decomposition and polymerization hardly occurs. Moreover, higher heat resistance is exhibited by blocking styrene having high thermal stability at both ends. Furthermore, it is more preferable from the viewpoint of solubility in hydrocarbon solvents and resistance to resist solvents.

  Examples of commercially available products that can be used as an elastomer included in the adhesive constituting the adhesive layer 30 include “Kepte (trade name)” manufactured by Kuraray Co., Ltd. “Hibler (trade name)” manufactured by Kuraray Co., Ltd., Asahi Kasei Corporation “Tuff Tech (trade name)” manufactured by JSR Corporation, “Dynalon (trade name)” manufactured by JSR Corporation, and the like can be mentioned.

  The content of the elastomer contained in the adhesive constituting the adhesive layer 30 is, for example, preferably in the range of 50 parts by weight or more and 99 parts by weight or less, with the total amount of the adhesive composition being 100 parts by weight, and 60 parts by weight or more. The range of 99 parts by weight or less is more preferable, and the range of 70 parts by weight or more and 95 parts by weight or less is most preferable. By setting it within these ranges, the wafer and the support can be suitably bonded together while maintaining the heat resistance.

  A plurality of types of elastomers may be mixed. That is, the adhesive constituting the adhesive layer 30 may include a plurality of types of elastomers. It is sufficient that at least one of the plurality of types of elastomers includes a styrene unit as a constituent unit of the main chain. Further, at least one of the plurality of types of elastomers has a styrene unit content in the range of 14 wt% or more and 50 wt% or less, or a weight average molecular weight of 10,000 or more and 200,000 or less. If it is within the range, it is within the scope of the present invention. Moreover, when the adhesive agent which comprises the contact bonding layer 30 contains several types of elastomers, you may adjust so that content of a styrene unit may become in said range as a result of mixing. For example, Septon 4033 of Septon (trade name) manufactured by Kuraray Co., Ltd. having a styrene unit content of 30% by weight and Septon 2063 of Septon (trade name) having a styrene unit content of 13% by weight is 1 weight ratio. When mixed in a one-to-one relationship, the styrene content with respect to the total elastomer contained in the adhesive is 21 to 22% by weight, and therefore 14% by weight or more. For example, when a styrene unit of 10% by weight and 60% by weight are mixed at a weight ratio of 1: 1, it becomes 35% by weight and falls within the above range. The present invention may be in such a form. Moreover, it is most preferable that the plurality of types of elastomers included in the adhesive constituting the adhesive layer 30 all contain styrene units within the above range and have a weight average molecular weight within the above range.

  Note that the adhesive layer 30 is preferably formed using a resin other than a photocurable resin (for example, a UV curable resin). By using a resin other than the photocurable resin, it is possible to prevent a residue from remaining around the minute unevenness of the substrate to be supported after the adhesive layer 30 is peeled or removed. In particular, the adhesive constituting the adhesive layer 30 is preferably not soluble in any solvent but soluble in a specific solvent. This is because the adhesive layer 30 can be removed by dissolving it in a solvent without applying physical force to the substrate 40. Even when the adhesive layer 30 is removed, the adhesive layer 30 can be easily removed without damaging or deforming the substrate 40 even from the substrate 40 having a reduced strength.

(Diluted solvent)
Examples of the dilution solvent used when forming the adhesive layer 30 (and the separation layer 14 described later) include linear carbonization such as hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, and tridecane. Hydrogen, branched hydrocarbons having 4 to 15 carbon atoms, for example, cyclic hydrocarbons such as cyclohexane, cycloheptane, cyclooctane, naphthalene, decahydronaphthalene, tetrahydronaphthalene, p-menthane, o-menthane, m-menthane, Diphenylmentane, 1,4-terpine, 1,8-terpine, bornane, norbornane, pinan, tujang, karan, longifolene, geraniol, nerol, linalool, citral, citronellol, menthol, isomenthol, neomenthol, α-terpineol, β -Tell Pinole, γ-terpineol, terpinen-1-ol, terpinen-4-ol, dihydroterpinyl acetate, 1,4-cineole, 1,8-cineole, borneol, carvone, yonon, thuyon, camphor, d-limonene, terpene solvents such as l-limonene and dipentene; lactones such as γ-butyrolactone; ketones such as acetone, methyl ethyl ketone, cyclohexanone (CH), methyl-n-pentyl ketone, methyl isopentyl ketone, 2-heptanone; ethylene glycol , Polyhydric alcohols such as diethylene glycol, propylene glycol, dipropylene glycol; ethylene glycol monoacetate, diethylene glycol monoacetate, propylene glycol monoacetate, or dipropylene glycol Ether bonds such as monomethyl ethers such as monomethyl ethers, monoethyl ethers, monopropyl ethers, monobutyl ethers such as monomethyl ethers, monophenyl ethers, etc. Derivatives of polyhydric alcohols such as compounds having a propylene glycol monomethyl ether acetate (PGMEA) or propylene glycol monomethyl ether (PGME) among these; cyclic ethers such as dioxane, methyl lactate, Ethyl lactate (EL), methyl acetate, ethyl acetate, butyl acetate, methoxybutyl acetate, methyl pyruvate, ethyl pyruvate, methyl methoxypropionate, ethyl ethoxypropionate, etc. Le acids; anisole, ethylbenzyl ether, cresyl methyl ether, diphenyl ether, can be mentioned dibenzyl ether, phenetole, the aromatic organic solvent such as butyl phenyl ether.

(Other ingredients)
The adhesive constituting the adhesive layer 30 may further contain other miscible materials as long as the essential properties are not impaired. For example, various conventional additives such as additional resins, plasticizers, adhesion aids, stabilizers, colorants, thermal polymerization inhibitors and surfactants for improving the performance of the adhesive may be further used. it can.

<Substrate formation process>
The substrate forming step S03 is performed after the adhesive layer forming step S02, for example. In the substrate forming step S03, the substrate 40 having the electronic component 41 is formed on the side of the separation layer 20 where the glass support 10 is not present. That is, the substrate 40 is formed on the substrate forming surface 30 f of the adhesive layer 30. In the substrate forming step S03, the substrate 40 is formed on the adhesive layer 30 in a state where the end 40e of the substrate 40 is separated from the end 20e of the separation layer 20. In the substrate forming step S03, first, as shown in FIG. 3B, a plurality of electronic components 41 are arranged on the substrate forming surface 30f of the adhesive layer 30. The number of electronic components arranged is arbitrary. The electronic component 41 includes, for example, a chip formed using a semiconductor or the like. The electronic component 41 is bonded and fixed by the adhesive layer 30.

  Thereafter, as shown in FIG. 3C, a mold 42 is formed so as to cover the entire surface of the substrate formation surface 30 f of the adhesive layer 30 including the electronic component 41. By forming the mold 42, the electronic component 41 is held in a state embedded in the mold 42. The mold 42 may be formed so as to expose a part (for example, the upper surface) of the electronic component 41. Further, the mold 42 is formed using, for example, a material that can transmit light that alters the separation layer 20. Examples of such a material include glass, silicon, acrylic resin, and the like.

  Note that the electronic component 41 may not be arranged in the substrate forming step S03. When the electronic component 41 is not disposed, for example, the mold 42 may be simply formed on the substrate formation surface 30f of the adhesive layer 30, or an electronic circuit rewired to the mold 42 may be formed. That is, the formed substrate 40 may not include the electronic component 41. Moreover, since the edge part of the separation layer 20 is separated from the edge part of the glass support body 10 as described above, the separation layer 20 is prevented from being peeled off from the glass support body 10 during the process of the substrate forming step S03. Therefore, the steps after the substrate forming step S03 can be appropriately performed.

<Mold polishing process>
The mold polishing step S04 is performed after the substrate forming step S03. In the mold polishing step S04, as shown in FIG. 4A, the side of the mold 42 where the glass support 10 does not exist, that is, the upper surface 42a of the mold 42 is polished to expose the electronic component 41. By the mold polishing step S04, the upper surface (the surface on the + Z side) of the electronic component 41 and the upper surface 42a of the mold 42 become substantially the same surface. In the mold polishing step S04, for example, the mold is polished by a known method. In the substrate forming step S03, when the mold 42 is formed by exposing a part of the electronic component 41, the mold polishing step S04 can be omitted.

  Note that after the mold polishing step S04, wiring may be formed of a conductive material on the upper surfaces (the surface on the + Z side or the surface on which the glass support 10 does not exist) of the electronic component 41 and the mold 42. Further, the electronic component 41 may be disposed so as to be electrically connected to the wiring, and the mold 42 may be formed so as to cover the electronic component 41. Bumps, solder, and the like are used for connection between the wiring and the electronic component 41. As described above, the substrate 40 in which a plurality of layers on which the electronic component 41 is arranged may be formed.

<Separation layer alteration process>
The separation layer alteration step S05 is performed, for example, after the mold polishing step S04. In the separation layer alteration step S05, as shown in FIG. 4B, from the irradiation device IR to the separation layer 20 from the side where the separation layer 20 of the glass support 10 does not exist, that is, from the bottom surface 10r of the glass support 10. Irradiate light L or heat. The light L is irradiated with light L or heat having a wavelength that can alter the separation layer 20. By the separation layer alteration step S05, the separation layer 20 is altered, and the strength or the adhesive force to the glass support 10 is reduced. In FIG. 4B, the glass support 10 is turned upside down (with the substrate 40 facing downward), and the light L or heat is irradiated from the upper irradiation device IR, but this is not limitative. For example, the light L or heat may be irradiated from below the glass support 10 by the irradiation device IR with the substrate 40 facing upward.

<Glass support peeling process>
The glass support peeling step S06 is performed, for example, after the separation layer alteration step S05. In the glass support peeling step S06, as shown in FIG. 5A, the separation layer 20 is broken by lifting the glass support 10 upward with the substrate 40 facing downward, and the glass support is separated from the substrate 40. 10 is peeled off. For the operation of lifting the glass support 10 upward, an apparatus for adsorbing and lifting the glass support 10 may be used. At this time, the substrate 40 is attracted to a stage or the like, and is pulled away from the glass support 10 by lifting the glass support 10. The laminated body 50 including the adhesive layer 30 and the substrate 40 is peeled from the glass support 10 by the glass support peeling process S06.

  In addition, since the edge part of the contact bonding layer 30 has left | separated from the edge part of the isolation | separation layer 20 as mentioned above, it has prevented that the contact bonding layer 30 adheres to the glass support body 10, and glass support body peeling process S06. The glass support 10 can be easily peeled from the substrate 40.

<Adhesive removal process>
The adhesive layer removing step S07 is performed after the glass support peeling step S06. In the adhesive layer removing step S07, as shown in FIG. 5B, a solvent that does not dissolve the substrate 40 (wiring and mold 42) and dissolves the adhesive of the adhesive layer 30 is supplied onto the adhesive layer 30. . As a result, the adhesive is dissolved by the solvent, and the adhesive layer 30 is removed from the substrate 40, so that a structure in which the plurality of electronic devices 51 are formed into one plate shape is obtained. Thereafter, although not shown, for example, individual electronic devices 51 are obtained by dicing each electronic component 41. Note that any device can be used as the dicing device.

  As mentioned above, the manufacturing method of the laminated body 50 which concerns on embodiment is the method of manufacturing the laminated body 50 by which the rectangular-shaped glass support body 10 and the separated layer 20 which changes in quality by light absorption or a heating were laminated | stacked. And the separation layer forming process S01 which forms the separation layer 20 in the center part on the glass support body 10 so that the edge part 20e is spaced apart from the edge part 10e of the glass support body 10 is included. Thereby, since the edge part 20e of the separation layer 20 is formed in the center part on the glass support body 10 in the state spaced apart from the edge part 10e of the glass support body 10, the adhesiveness of the glass support body 10 and the separation layer 20 is formed. The separation layer 20 can be prevented from being easily peeled off by improving the above, and the steps after the substrate forming step S03 (or the steps after the adhesive layer forming step S02) can be performed smoothly. The device 51 can be easily manufactured.

  In the separation layer forming step S01, the above-described embodiment has been described by taking as an example a configuration in which the range in which the separation layer 20 is formed is set by adjusting the movement range of the slit nozzle 61 and the opening width of the opening 61a. However, it is not limited to this.

  12A and 12B are process diagrams showing another example of a method for manufacturing a laminate. In the separation layer forming step S01, for example, as shown in FIG. 12A, the masking M is formed in advance on the peripheral edge 10g of the glass support 10, and after the masking M is formed, the glass support including the masking M is supported. The liquid material Q1 is applied to the entire surface of the body 10. Thereafter, as shown in FIG. 12B, the masking M may be removed with a solvent or the like. By removing the masking M, the liquid material Q1 applied over the masking M is removed together with the masking M. Thereby, the edge part 20e of the separation layer 20 can be made into the state spaced apart from the edge part 10e of the glass support body 10. FIG.

  The masking M can be made of any material that can be removed with a solvent or the like. A masking tape may be used as the masking M. In this case, after the masking tape is applied to the end of the glass support 10, the liquid material Q <b> 1 is applied to the entire surface of the glass support 10. Thereafter, the liquid Q1 applied on the masking tape can be removed by removing the masking tape.

  FIGS. 13A and 13B are process diagrams illustrating another example of a method for manufacturing a laminate. In the separation layer formation step S01, for example, as shown in FIG. 13A, the liquid material Q1 is supplied from a dispenser or the like (not shown) to the separation layer formation surface 10f in a state where the glass support 10 is rotated around the Z axis. Then, the liquid material Q1 is applied to the entire surface of the separation layer forming surface 10f to form the separation layer 20. Thereafter, as shown in FIG. 13B, a portion of the separation layer 20 formed on the peripheral portion 10g of the separation layer forming surface 10f may be removed with a solvent S1 or the like. Thereby, the edge part 20e of the separation layer 20 can be made into the state spaced apart from the edge part 10e of the glass support body 10. FIG.

  In the above-described embodiment, similarly to the separation layer forming step S01, the range of the adhesive layer 30 is adjusted by adjusting the moving range of the slit nozzle 62 and the opening width of the opening 62a in the adhesive layer forming step S02. However, the present invention is not limited to this.

  14A to 14C are process diagrams showing another example of a method for manufacturing a laminate. In the adhesive layer forming step S02, for example, as shown in FIG. 14A, the adhesive layer 30 is formed on the entire surface of the separation layer forming surface 10f of the glass support 10 including the separation layer 20. Subsequently, as shown in FIG. 14B, the mold 42 covering the substrate 40 is polished on the adhesive layer 30 (see the substrate forming step S03 and the mold polishing step S04 described above). Subsequently, as shown in FIG. 14C, the peripheral edge of the adhesive layer 30 is dissolved with a solvent S2 or the like. As a result, the end 20e of the separation layer 20 can be exposed. In the example shown in FIG. 14, the end 30 e of the adhesive layer 30 corresponds to the end 20 e of the separation layer 20. However, since the end 20 e of the separation layer 20 is exposed, the adhesive layer 30 is prevented from adhering to the glass support 10 and does not hinder the peeling of the support 10 to be peeled in the glass support peeling step S06.

  As shown in FIG. 14C, the end portion 30 e of the adhesive layer 30 is not limited to coincide with the end portion 20 e of the separation layer 20. For example, the adhesive layer 30 may be dissolved until the end 30e of the adhesive layer 30 is separated from the end 20e of the separation layer 20 by increasing the supply amount or supply time of the solvent S2 or the like.

<Laminated body production system>
The laminated body manufacturing system according to the embodiment will be described. FIG. 15 is a block diagram schematically showing an example of the laminate manufacturing system 100. As shown in FIG. 15, the laminate manufacturing system 100 includes a separation layer forming apparatus 90, an adhesive layer forming apparatus 91, a substrate forming apparatus 92, a mold polishing apparatus 93, a separation layer alteration apparatus 94, and a glass support. A peeling device 95 and an adhesive layer removing device 96 are provided.

  The separation layer forming apparatus 90 forms the separation layer 20 on the glass support 10 and executes the separation layer formation step S01 described above. The adhesive layer forming apparatus 91 forms the adhesive layer 30 on the separation layer 20, and executes the above-described adhesive layer forming step S02. The substrate forming apparatus 92 forms the substrate 40 on the adhesive layer 30 and executes the above-described substrate forming step S03. The mold polishing apparatus 93 polishes the mold 42 of the substrate 40 as shown in the mold polishing step S04 described above. As shown in the separation layer alteration step S05 described above, the separation layer alteration device 94 alters the separation layer 20 by irradiating the separation layer 20 with light or heat. The glass support peeling apparatus 95 peels the glass support 10 from the board | substrate 40, as shown to above-described glass support peeling process S06. The adhesive layer removing device 96 removes the adhesive layer 30 from the substrate 40 as shown in the adhesive layer removing step S07 described above.

  Thus, according to the laminate manufacturing system 100, the separation layer formation step S01, the adhesive layer formation step S02, the substrate formation step S03, the mold polishing step S04, the separation layer alteration step S05, the glass support peeling step S06, And each process of adhesion layer removal process S07 can be performed efficiently.

  Various peel tests were performed on the laminate 50 in which the separation layer was formed on the glass support by the laminate production method according to the above-described embodiment. FIGS. 16A to 16C are tables showing the results of the peel tests in the examples. The laminated body 50 which concerns on Example 1, 2 is with respect to the laminated body 50 which formed the separation layer 20 in the glass support body 10 in the state which spaced apart the edge part of the glass support body 10, and the edge part of the separation layer 20. FIG. And a curing treatment at a temperature of 400 ° C. Moreover, the laminated body which concerns on the comparative examples 1 and 2 performed the curing process at the temperature of 400 degreeC with respect to the laminated body which formed the separation layer to the edge part of the glass support body 10. FIG.

  In the table shown in FIG. 16A, the laminated body 50 according to Example 1 and the laminated body according to Comparative Example 1 are each immersed in water for 10 minutes, and then air is directed between the glass support 10 and the separation layer. The result when injecting is shown. As shown in FIG. 16A, in the laminate according to Comparative Example 1, separation of the separation layer from the glass support 10 was observed. On the other hand, in the laminated body 50 which concerns on Example 1, peeling of the glass support body 10 separation layer 20 was not recognized.

  In addition, the table shown in FIG. 16B shows that the laminate 50 according to Example 2 and the laminate according to Comparative Example 2 were subjected to ultrasonic cleaning for 5 minutes after the test in FIG. Is shown, and then the results are shown when air is jetted between the glass support 10 and the separation layer. As shown in FIG. 16B, in the laminate according to Comparative Example 2, peeling of the separation layer from the glass support 10 was observed. On the other hand, in the laminated body 50 which concerns on Example 2, peeling of the separation layer 20 from the glass support body 10 was not recognized.

  Also, the table shown in FIG. 16C shows that the laminate 50 according to Example 3 and the laminate according to Comparative Example 3 were tested in FIG. It shows the result when it is attached and peeled off (peeling test). In addition, the laminated body 50 which concerns on Example 3, and the laminated body which concerns on the comparative example 3 performed the curing process at the temperature of 360 degreeC. As shown in FIG. 16C, in the laminate according to Comparative Example 3, peeling of the separation layer from the glass support 10 was observed by a peeling test. On the other hand, in the laminated body 50 which concerns on Example 3, peeling of the separation layer 20 from the glass support body 10 was not recognized even when the peeling test was done.

  Thus, in Examples 1 to 3 described above, it was confirmed that the adhesion of the separation layer 20 to the glass support 10 was improved.

  While the embodiments and examples have been described above, the present invention is not limited to the above description, and various modifications can be made without departing from the gist of the present invention.

L: Light, L1, L2, L3, L4, LX1, LX2, LX3, LX4 ... Distance, M ... Masking, M1, M2, M3, M4, MX1, MX2, MX3, MX4 ... Distance, Q1, Q2 ... Liquid, S ... Solvent, 10 ... Glass support, 10a, 10b, 10c, 10d, 20a, 20b, 20c, 20d, 30a, 30b, 30c, 30d ... Edges, 10e, 20e, 30e, 40e ... ends, 10f ... separation layer forming surface, 10g ... peripheral edge, 10r ... bottom, 20 ... separation layer, 20f ... Adhesion layer forming surface, 30 ... Adhesive layer, 30f ... Substrate forming surface, 40 ... Substrate, 41 ... Electronic component, 42 ... Mold, 42a ... Upper surface, 50 ... Lamination Body 51 ... Electronic device 60, 61, 62 ... Slit Slurry, 61a, 62a ... opening, 70 ... stage, 80 ... nozzle controller, 90 ... separation layer forming device, 91 ... adhesive layer forming device, 92 ... substrate forming device 93 ... Mold polishing device, 94 ... Separation layer alteration device, 95 ... Glass support peeling device, 96 ... Adhesive layer removal device, 100 ... Laminate manufacturing system

In the aspect of the present invention, a rectangular glass support and a separation layer that is transformed into a state that can be broken by receiving external force due to absorption or heating of light, or a state in which the adhesive force with a layer in contact with others is reduced, A separation layer forming step in which a separation layer is formed in a central portion on the glass support so that the end portion is separated from the end of the glass support, and the separation layer After the forming step, an adhesive layer forming step of forming an adhesive layer on the side where the glass support of the separating layer does not exist so that the separating layer and each other are in contact with each other. Provided is a method for manufacturing a laminate, which is formed on a separation layer in a state of being separated from an end portion.
In the aspect of the present invention, a rectangular glass support and a separation layer that is transformed into a state that can be broken by receiving external force due to absorption or heating of light, or a state in which the adhesive force with a layer in contact with others is reduced, A separation layer forming step in which a separation layer is formed in a central portion on the glass support so that the end portion is separated from the end of the glass support, and the separation layer Forming a substrate having an electronic component on the side where the glass support of the separation layer does not exist after the formation step, and the substrate is separated from the end portion of the separation layer with the end portion being separated from the end portion of the separation layer. A method for manufacturing a laminate formed thereon is provided.
In the aspect of the present invention, a rectangular glass support and a separation layer that is transformed into a state that can be broken by receiving external force due to absorption or heating of light, or a state in which the adhesive force with a layer in contact with others is reduced, In which a separation layer is provided at a central portion on the glass support, and the separation layer has an end portion separated from an end portion of the glass support, and the glass support of the separation layer Provided is a laminate in which an adhesive layer is formed on the side where the separation layer does not exist so that the separation layer is in contact with the separation layer, and the adhesion layer is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer Is done.
In the aspect of the present invention, a rectangular glass support and a separation layer that is transformed into a state that can be broken by receiving external force due to absorption or heating of light , or a state in which the adhesive force with a layer in contact with others is reduced , In which a separation layer is provided at a central portion on the glass support, and the separation layer has an end portion separated from an end portion of the glass support, and the glass support of the separation layer There is provided a laminate in which a substrate having an electronic component is formed on a side where the substrate does not exist, and the substrate is formed on the separation layer in a state where the end portion is separated from the end portion of the separation layer.
In the aspect of the present invention, a rectangular glass support and a separation layer that is transformed into a state that can be broken by receiving external force due to absorption or heating of light, or a state in which the adhesive force with a layer in contact with others is reduced, A separation layer forming apparatus for forming a separation layer at a central portion on the glass support with the end portion being separated from the end of the glass support, and a separation layer Is formed on the side where the glass support of the separation layer does not exist, and the adhesive layer forming device forms an adhesive layer so that the separation layer and each other come into contact with each other. A laminate manufacturing system is provided in which the end portion is formed on the separation layer in a state of being separated from the end portion of the separation layer.
In the aspect of the present invention, a rectangular glass support and a separation layer that is transformed into a state that can be broken by receiving external force due to absorption or heating of light, or a state in which the adhesive force with a layer in contact with others is reduced, A separation layer forming apparatus for forming a separation layer at a central portion on the glass support with the end portion being separated from the end of the glass support, and a separation layer Forming a substrate having an electronic component on the side where the glass support of the separation layer does not exist, and the substrate forming device includes a substrate, the end of which is an end of the separation layer A laminate manufacturing system is provided which is formed on the separation layer in a state of being separated from the laminate.
In the first aspect of the present invention, there is provided a method for producing a laminate in which a rectangular glass support and a separation layer that is altered by light absorption or heating are laminated, wherein the separation layer has an end portion. There is provided a method for producing a laminate including a separation layer forming step of forming a central portion on the glass support so as to be separated from an end of the glass support.

Claims (17)

A method for producing a laminate in which a rectangular glass support and a separation layer that is altered by light absorption or heating are laminated,
The manufacturing method of a laminated body including the separation layer formation process which forms the said separation layer in the center part on the said glass support body so that an edge part may space apart from the edge part of the said glass support body.   The manufacturing method of the laminated body of Claim 1 in which the edge part of the said separation layer is spaced apart in the range of 0.1 mm-10 mm with respect to the edge part of the said glass support body.   In the separation layer forming step, the glass support and a slit nozzle capable of applying a liquid for forming the separation layer are relatively moved, and the liquid is applied onto the glass support by the slit nozzle. The method for producing a laminate according to claim 1 or 2, wherein the separation layer is formed.   In the separation layer forming step, by adjusting the relative movement range of the glass support and the slit nozzle, the ends of the separation layer are separated from both ends of the glass support in the movement direction, respectively. The manufacturing method of the laminated body of Claim 3.   In the separation layer forming step, by adjusting the length of the opening width of the slit nozzle, the ends of the separation layer are separated from both ends of the glass support in the direction orthogonal to the moving direction, respectively. The manufacturing method of the laminated body of claim | item 3 or claim 4. The separation layer forming step includes
Masking the outer peripheral edge of the glass support;
Applying the liquid on the glass support in the masked state;
The manufacturing method of the laminated body of Claim 3 including removing the said masking after application | coating of the said liquid. The separation layer forming step includes
Spin-coating a liquid for forming the separation layer on the glass support;
The manufacturing method of the laminated body of Claim 1 or 2 including wash | cleaning the edge part periphery of the said glass support body with a chemical | medical solution after spin coating. After the separation layer forming step,
The manufacturing method of the laminated body as described in any one of Claim 1 to 7 which forms an contact bonding layer so that the said separated layer may mutually contact in the side in which the said glass support body does not exist of the said separated layer.   The method for manufacturing a laminate according to claim 8, wherein the adhesive layer includes an end portion formed on the separation layer in a state of being separated from an end portion of the separation layer.   The manufacturing method of the laminated body of Claim 9 including removing the edge part edge part of the said adhesive layer, and making the edge part of the said adhesive layer spaced apart from the edge part of the said separation layer. After the separation layer forming step,
The manufacturing method of the laminated body as described in any one of Claim 1 to 10 which forms the board | substrate which has an electronic component in the side in which the said glass support body does not exist of the said separation layer.   The method for manufacturing a laminated body according to claim 11, wherein the substrate includes an end portion formed on the separation layer in a state of being separated from an end portion of the separation layer. After the separation layer forming step,
The manufacturing method of the laminated body as described in any one of Claim 1 to 10 which forms the wiring which has electroconductivity in the side in which the said glass support body does not exist of the said separation layer. Producing a laminate by the method for producing a laminate according to any one of claims 11 to 13,
Altering the separation layer to separate the glass support from the laminate, a method for manufacturing an electronic device. A laminated body in which a rectangular glass support and a separation layer that is altered by light absorption or heating are laminated,
The separation layer is provided in a central portion on the glass support;
The separation layer is a laminate in which an end portion is separated from an end portion of the glass support. A system for producing a laminate in which a rectangular glass support and a separation layer that changes in quality by light absorption or heating are laminated,
A laminate manufacturing system including a separation layer forming device that forms the separation layer in a central portion on the glass support with an end portion being separated from an end of the glass support. The separation layer forming apparatus includes:
A slit nozzle capable of applying a liquid for forming the separation layer, and a stage on which the glass substrate is placed,
The laminate manufacturing system according to claim 16, wherein the liquid is applied to the central portion on the glass substrate by the slit nozzle while relatively moving the slit nozzle and the stage.

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