KR102351929B1 - 브레이크 장치 - Google Patents

브레이크 장치 Download PDF

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Publication number
KR102351929B1
KR102351929B1 KR1020150047233A KR20150047233A KR102351929B1 KR 102351929 B1 KR102351929 B1 KR 102351929B1 KR 1020150047233 A KR1020150047233 A KR 1020150047233A KR 20150047233 A KR20150047233 A KR 20150047233A KR 102351929 B1 KR102351929 B1 KR 102351929B1
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KR
South Korea
Prior art keywords
brittle material
material substrate
support bar
auxiliary support
stages
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KR1020150047233A
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English (en)
Korean (ko)
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KR20160024734A (ko
Inventor
타쿠로 미타니
유이치 가네히라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20160024734A publication Critical patent/KR20160024734A/ko
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    • H01L21/78—
    • H01L24/799—

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020150047233A 2014-08-26 2015-04-03 브레이크 장치 Active KR102351929B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-171059 2014-08-26
JP2014171059A JP6446912B2 (ja) 2014-08-26 2014-08-26 ブレーク装置

Publications (2)

Publication Number Publication Date
KR20160024734A KR20160024734A (ko) 2016-03-07
KR102351929B1 true KR102351929B1 (ko) 2022-01-14

Family

ID=55540184

Family Applications (1)

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KR1020150047233A Active KR102351929B1 (ko) 2014-08-26 2015-04-03 브레이크 장치

Country Status (4)

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JP (1) JP6446912B2 (enExample)
KR (1) KR102351929B1 (enExample)
CN (1) CN106142369B (enExample)
TW (1) TWI654063B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797154B (zh) * 2018-01-31 2023-04-01 日商三星鑽石工業股份有限公司 膜剝離機構及基板裂斷系統
TW202041343A (zh) * 2018-12-18 2020-11-16 日商三星鑽石工業股份有限公司 陶瓷片的製造方法及陶瓷片製造用之煅燒前片的製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100175834A1 (en) 2009-01-13 2010-07-15 Shin-Kan Liu Wafer splitting laminate mechanism
JP2012183644A (ja) * 2011-03-03 2012-09-27 Denso Corp 基板の分割方法及び分割装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004026539A (ja) * 2002-06-24 2004-01-29 Nakamura Tome Precision Ind Co Ltd ガラス基板の割断加工方法及びその装置
JP4589201B2 (ja) * 2005-08-23 2010-12-01 株式会社ディスコ 基板の切削装置
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
TWI508153B (zh) * 2010-04-30 2015-11-11 三星鑽石工業股份有限公司 Disconnection device and disconnection method of brittle material substrate
JP5182339B2 (ja) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP5187421B2 (ja) * 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
KR101217398B1 (ko) * 2011-02-25 2013-01-02 앰코 테크놀로지 코리아 주식회사 웨이퍼 다이싱 장치 및 이를 이용한 웨이퍼 다이싱 방법
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
JP6039363B2 (ja) 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100175834A1 (en) 2009-01-13 2010-07-15 Shin-Kan Liu Wafer splitting laminate mechanism
JP2012183644A (ja) * 2011-03-03 2012-09-27 Denso Corp 基板の分割方法及び分割装置

Also Published As

Publication number Publication date
TW201607717A (zh) 2016-03-01
JP2016043638A (ja) 2016-04-04
TWI654063B (zh) 2019-03-21
CN106142369B (zh) 2019-10-15
KR20160024734A (ko) 2016-03-07
CN106142369A (zh) 2016-11-23
JP6446912B2 (ja) 2019-01-09

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