KR102350155B1 - 산화물 반도체 박막, 박막 트랜지스터 및 스퍼터링 타겟 - Google Patents

산화물 반도체 박막, 박막 트랜지스터 및 스퍼터링 타겟 Download PDF

Info

Publication number
KR102350155B1
KR102350155B1 KR1020200059612A KR20200059612A KR102350155B1 KR 102350155 B1 KR102350155 B1 KR 102350155B1 KR 1020200059612 A KR1020200059612 A KR 1020200059612A KR 20200059612 A KR20200059612 A KR 20200059612A KR 102350155 B1 KR102350155 B1 KR 102350155B1
Authority
KR
South Korea
Prior art keywords
thin film
oxide semiconductor
atoms
atm
semiconductor thin
Prior art date
Application number
KR1020200059612A
Other languages
English (en)
Korean (ko)
Other versions
KR20200138001A (ko
Inventor
고헤이 니시야마
모토타카 오치
유미 데라마에
다카오 가와라다
Original Assignee
가부시키가이샤 고베 세이코쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 고베 세이코쇼 filed Critical 가부시키가이샤 고베 세이코쇼
Publication of KR20200138001A publication Critical patent/KR20200138001A/ko
Application granted granted Critical
Publication of KR102350155B1 publication Critical patent/KR102350155B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
    • H01L29/247—Amorphous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/085—Oxides of iron group metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • H01L29/78693—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate the semiconducting oxide being amorphous

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1020200059612A 2019-05-30 2020-05-19 산화물 반도체 박막, 박막 트랜지스터 및 스퍼터링 타겟 KR102350155B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019101384A JP6756875B1 (ja) 2019-05-30 2019-05-30 ディスプレイ用酸化物半導体薄膜、ディスプレイ用薄膜トランジスタ及びスパッタリングターゲット
JPJP-P-2019-101384 2019-05-30

Publications (2)

Publication Number Publication Date
KR20200138001A KR20200138001A (ko) 2020-12-09
KR102350155B1 true KR102350155B1 (ko) 2022-01-11

Family

ID=72432430

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200059612A KR102350155B1 (ko) 2019-05-30 2020-05-19 산화물 반도체 박막, 박막 트랜지스터 및 스퍼터링 타겟

Country Status (4)

Country Link
JP (1) JP6756875B1 (zh)
KR (1) KR102350155B1 (zh)
CN (1) CN112018168A (zh)
TW (1) TWI718952B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023155091A1 (zh) * 2022-02-17 2023-08-24 京东方科技集团股份有限公司 金属氧化物薄膜晶体管、阵列基板及显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004103957A (ja) 2002-09-11 2004-04-02 Japan Science & Technology Corp ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
WO2009081885A1 (ja) 2007-12-25 2009-07-02 Idemitsu Kosan Co., Ltd. 酸化物半導体電界効果型トランジスタ及びその製造方法
JP2010135773A (ja) * 2008-11-07 2010-06-17 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005088726A1 (ja) 2004-03-12 2005-09-22 Japan Science And Technology Agency アモルファス酸化物及び薄膜トランジスタ
CN103258857B (zh) * 2007-12-13 2016-05-11 出光兴产株式会社 使用了氧化物半导体的场效应晶体管及其制造方法
JP5644111B2 (ja) * 2007-12-26 2014-12-24 コニカミノルタ株式会社 金属酸化物半導体およびその製造方法、半導体素子、薄膜トランジスタ
JP5442234B2 (ja) * 2008-10-24 2014-03-12 株式会社半導体エネルギー研究所 半導体装置及び表示装置
JP2010118407A (ja) 2008-11-11 2010-05-27 Idemitsu Kosan Co Ltd エッチング耐性を有する薄膜トランジスタ、及びその製造方法
JP6029816B2 (ja) * 2010-09-28 2016-11-24 積水化学工業株式会社 金属酸化物半導体薄膜の製造方法
US9224820B2 (en) 2012-05-31 2015-12-29 Samsung Corning Advanced Glass, Llc Oxide semiconductor sputtering target, method of manufacturing thin-film transistors using the same, and thin film transistor manufactured using the same
WO2016157016A1 (en) * 2015-03-27 2016-10-06 Semiconductor Energy Laboratory Co., Ltd. Transistor and electronic device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004103957A (ja) 2002-09-11 2004-04-02 Japan Science & Technology Corp ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
WO2009081885A1 (ja) 2007-12-25 2009-07-02 Idemitsu Kosan Co., Ltd. 酸化物半導体電界効果型トランジスタ及びその製造方法
JP2010135773A (ja) * 2008-11-07 2010-06-17 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法

Also Published As

Publication number Publication date
CN112018168A (zh) 2020-12-01
TW202043511A (zh) 2020-12-01
JP2020194945A (ja) 2020-12-03
KR20200138001A (ko) 2020-12-09
TWI718952B (zh) 2021-02-11
JP6756875B1 (ja) 2020-09-16

Similar Documents

Publication Publication Date Title
JP5977569B2 (ja) 薄膜トランジスタ構造、ならびにその構造を備えた薄膜トランジスタおよび表示装置
US10644165B2 (en) Thin-film transistor, method of fabricating thin-film transistor, and display device
KR101758538B1 (ko) 박막 트랜지스터 및 표시 장치
KR20110068181A (ko) 산화물 반도체 박막 트랜지스터, 그 제조방법 및 산화물 반도체 박막 트랜지스터를 구비한 유기전계 발광소자
KR20150038310A (ko) 박막 트랜지스터 및 표시 장치
US9076721B2 (en) Oxynitride channel layer, transistor including the same and method of manufacturing the same
US9893193B2 (en) Thin-film transistor including a gate electrode with a side wall insulating layer and display device
KR20170037647A (ko) 박막 트랜지스터
JP2012028481A (ja) 電界効果型トランジスタ及びその製造方法
CN111226307B (zh) 氧化物半导体薄膜、薄膜晶体管和溅射靶
KR102350155B1 (ko) 산화물 반도체 박막, 박막 트랜지스터 및 스퍼터링 타겟
TW201405835A (zh) 製造薄膜電晶體的方法
JP2011258804A (ja) 電界効果型トランジスタ及びその製造方法
KR102590698B1 (ko) 산화물 반도체 박막, 박막 트랜지스터 및 스퍼터링 타겟
KR20220099559A (ko) 산화물 반도체 박막, 박막 트랜지스터 및 스퍼터링 타깃
TWI834014B (zh) 氧化物半導體薄膜、薄膜電晶體及濺鍍靶
WO2019107043A1 (ja) 酸化物半導体薄膜、薄膜トランジスタ及びスパッタリングターゲット

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant