KR102341045B1 - 기판 처리 장치 및 물품 제조 방법 - Google Patents

기판 처리 장치 및 물품 제조 방법 Download PDF

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Publication number
KR102341045B1
KR102341045B1 KR1020180133278A KR20180133278A KR102341045B1 KR 102341045 B1 KR102341045 B1 KR 102341045B1 KR 1020180133278 A KR1020180133278 A KR 1020180133278A KR 20180133278 A KR20180133278 A KR 20180133278A KR 102341045 B1 KR102341045 B1 KR 102341045B1
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KR
South Korea
Prior art keywords
chuck
cleaning
substrate
region
processing apparatus
Prior art date
Application number
KR1020180133278A
Other languages
English (en)
Korean (ko)
Other versions
KR20190054927A (ko
Inventor
겐타 기타
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20190054927A publication Critical patent/KR20190054927A/ko
Application granted granted Critical
Publication of KR102341045B1 publication Critical patent/KR102341045B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
KR1020180133278A 2017-11-13 2018-11-02 기판 처리 장치 및 물품 제조 방법 KR102341045B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-218410 2017-11-13
JP2017218410A JP6956604B2 (ja) 2017-11-13 2017-11-13 基板処理装置および物品製造方法

Publications (2)

Publication Number Publication Date
KR20190054927A KR20190054927A (ko) 2019-05-22
KR102341045B1 true KR102341045B1 (ko) 2021-12-20

Family

ID=66495976

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180133278A KR102341045B1 (ko) 2017-11-13 2018-11-02 기판 처리 장치 및 물품 제조 방법

Country Status (3)

Country Link
JP (1) JP6956604B2 (ja)
KR (1) KR102341045B1 (ja)
CN (1) CN109782549B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6896036B2 (ja) 2019-09-30 2021-06-30 キヤノン株式会社 情報処理装置、判定方法、インプリント装置、リソグラフィシステム、物品の製造方法及びプログラム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144013A (ja) 1999-10-12 2001-05-25 Asm Lithography Bv リトグラフ投影装置
JP2010153407A (ja) 2008-12-23 2010-07-08 Nikon Corp 清掃方法及び装置、並びに露光方法及び装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3395797B2 (ja) * 1993-08-31 2003-04-14 株式会社ニコン 露光装置
JPH07130637A (ja) * 1993-10-29 1995-05-19 Canon Inc 半導体製造装置
US5507874A (en) * 1994-06-03 1996-04-16 Applied Materials, Inc. Method of cleaning of an electrostatic chuck in plasma reactors
JP3450584B2 (ja) * 1996-04-09 2003-09-29 キヤノン株式会社 半導体露光装置
JP4876345B2 (ja) * 2001-08-22 2012-02-15 株式会社ニコン シミュレーション方法及び装置、並びに、これを用いた研磨方法及び装置
US20060005767A1 (en) * 2004-06-28 2006-01-12 Applied Materials, Inc. Chamber component having knurled surface
JP4316595B2 (ja) * 2006-09-13 2009-08-19 株式会社東芝 液浸補助板の洗浄方法と液浸露光方法及びパターン形成方法
JP5896625B2 (ja) * 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
US9808841B2 (en) * 2011-09-05 2017-11-07 Toshiba Memory Corporation Reticle chuck cleaner and reticle chuck cleaning method
CN103128073A (zh) * 2011-12-01 2013-06-05 无锡华润上华科技有限公司 晶圆清洗方法、晶圆清洗装置以及晶圆
JP2015176934A (ja) * 2014-03-13 2015-10-05 株式会社東芝 静電チャッククリーナ、クリーニング方法、および露光装置
CN106353973B (zh) * 2016-11-18 2018-09-11 京东方科技集团股份有限公司 一种防掩膜板划伤系统及曝光系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144013A (ja) 1999-10-12 2001-05-25 Asm Lithography Bv リトグラフ投影装置
JP2010153407A (ja) 2008-12-23 2010-07-08 Nikon Corp 清掃方法及び装置、並びに露光方法及び装置

Also Published As

Publication number Publication date
JP6956604B2 (ja) 2021-11-02
CN109782549A (zh) 2019-05-21
KR20190054927A (ko) 2019-05-22
CN109782549B (zh) 2021-09-07
JP2019090884A (ja) 2019-06-13

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