KR102328501B1 - 필름의 오려내기 방법 - Google Patents

필름의 오려내기 방법 Download PDF

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Publication number
KR102328501B1
KR102328501B1 KR1020187035530A KR20187035530A KR102328501B1 KR 102328501 B1 KR102328501 B1 KR 102328501B1 KR 1020187035530 A KR1020187035530 A KR 1020187035530A KR 20187035530 A KR20187035530 A KR 20187035530A KR 102328501 B1 KR102328501 B1 KR 102328501B1
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South Korea
Prior art keywords
cut
film
polarizer
cutting
laser light
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Korean (ko)
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KR20190015290A (ko
Inventor
코타 나카이
나오타카 히구치
카츠노리 타카다
마사키 이와모토
유키 오세
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR102328501B1 publication Critical patent/KR102328501B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Polarising Elements (AREA)
  • Laser Beam Processing (AREA)
KR1020187035530A 2016-06-10 2017-06-01 필름의 오려내기 방법 Active KR102328501B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016116147A JP6754621B2 (ja) 2016-06-10 2016-06-10 フィルムの切り抜き方法
JPJP-P-2016-116147 2016-06-10
PCT/JP2017/020377 WO2017213009A1 (ja) 2016-06-10 2017-06-01 フィルムの切り抜き方法

Publications (2)

Publication Number Publication Date
KR20190015290A KR20190015290A (ko) 2019-02-13
KR102328501B1 true KR102328501B1 (ko) 2021-11-18

Family

ID=60578611

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187035530A Active KR102328501B1 (ko) 2016-06-10 2017-06-01 필름의 오려내기 방법

Country Status (5)

Country Link
JP (1) JP6754621B2 (enExample)
KR (1) KR102328501B1 (enExample)
CN (1) CN109313303B (enExample)
TW (1) TWI757301B (enExample)
WO (1) WO2017213009A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113454500A (zh) * 2019-02-08 2021-09-28 日东电工株式会社 光学薄膜的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010017990A (ja) 2008-07-14 2010-01-28 Seiko Epson Corp 基板分割方法
JP2014191051A (ja) 2013-03-26 2014-10-06 Nitto Denko Corp 偏光子のレーザー加工方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06269967A (ja) * 1993-03-25 1994-09-27 Fanuc Ltd レーザ加工方法及びその装置
JP4233999B2 (ja) * 2003-12-25 2009-03-04 日東電工株式会社 積層型偏光板およびその製造方法
JP2005326831A (ja) 2004-04-13 2005-11-24 Nitto Denko Corp 光学部材、その製造方法、およびそれを用いた画像表示装置
JP4732790B2 (ja) * 2005-04-28 2011-07-27 日本合成化学工業株式会社 ポリビニルアルコール系フィルムの製造方法、ポリビニルアルコール系フィルムおよび偏光膜、偏光板
JP2007319888A (ja) * 2006-05-31 2007-12-13 Sharp Corp 被加工脆性部材のレーザー溶断方法
JP4808106B2 (ja) * 2006-08-23 2011-11-02 日東電工株式会社 光学フィルムの切断方法
US8817373B2 (en) * 2007-07-06 2014-08-26 Nitto Denko Corporation Microcrack free polarization plate
JP5558026B2 (ja) * 2008-05-07 2014-07-23 日東電工株式会社 偏光板、およびその製造方法
US8584490B2 (en) * 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
JP5824218B2 (ja) * 2011-02-24 2015-11-25 伊藤光学工業株式会社 防眩光学要素
KR102041658B1 (ko) * 2012-12-18 2019-11-08 스미또모 가가꾸 가부시키가이샤 광학 표시 디바이스의 생산 방법 및 광학 표시 디바이스의 생산 시스템
JP2014182274A (ja) * 2013-03-19 2014-09-29 Fujifilm Corp 偏光板、液晶表示装置、および液晶表示装置の製造方法。
JP6127707B2 (ja) * 2013-05-16 2017-05-17 住友化学株式会社 光学表示デバイスの生産システム及び生産方法
JP6227279B2 (ja) * 2013-05-17 2017-11-08 住友化学株式会社 光学部材貼合体の製造装置及び製造方法
JP2015108663A (ja) * 2013-12-03 2015-06-11 住友化学株式会社 光学部材貼合体の製造装置
KR20160015160A (ko) * 2014-07-30 2016-02-12 스미또모 가가꾸 가부시키가이샤 방현 필름
US20160033699A1 (en) * 2014-08-04 2016-02-04 Nitto Denko Corporation Polarizing plate
KR101817388B1 (ko) * 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010017990A (ja) 2008-07-14 2010-01-28 Seiko Epson Corp 基板分割方法
JP2014191051A (ja) 2013-03-26 2014-10-06 Nitto Denko Corp 偏光子のレーザー加工方法

Also Published As

Publication number Publication date
KR20190015290A (ko) 2019-02-13
WO2017213009A1 (ja) 2017-12-14
JP2017219800A (ja) 2017-12-14
TWI757301B (zh) 2022-03-11
CN109313303A (zh) 2019-02-05
JP6754621B2 (ja) 2020-09-16
CN109313303B (zh) 2021-04-20
TW201801841A (zh) 2018-01-16

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