KR102324621B1 - 레이저 에칭 가공용 도전성 페이스트, 도전성 박막, 도전성 적층체 - Google Patents

레이저 에칭 가공용 도전성 페이스트, 도전성 박막, 도전성 적층체 Download PDF

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KR102324621B1
KR102324621B1 KR1020167021707A KR20167021707A KR102324621B1 KR 102324621 B1 KR102324621 B1 KR 102324621B1 KR 1020167021707 A KR1020167021707 A KR 1020167021707A KR 20167021707 A KR20167021707 A KR 20167021707A KR 102324621 B1 KR102324621 B1 KR 102324621B1
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South Korea
Prior art keywords
thin film
resin
conductive
laser
conductive paste
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KR1020167021707A
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English (en)
Korean (ko)
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KR20160111945A (ko
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겐이치 에구치
야스히로 사카모토
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도요보 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Quality & Reliability (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
KR1020167021707A 2014-01-22 2015-01-21 레이저 에칭 가공용 도전성 페이스트, 도전성 박막, 도전성 적층체 KR102324621B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014009319 2014-01-22
JPJP-P-2014-009319 2014-01-22
PCT/JP2015/051520 WO2015111614A1 (ja) 2014-01-22 2015-01-21 レーザーエッチング加工用導電性ペースト、導電性薄膜、導電性積層体

Publications (2)

Publication Number Publication Date
KR20160111945A KR20160111945A (ko) 2016-09-27
KR102324621B1 true KR102324621B1 (ko) 2021-11-11

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Family Applications (1)

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KR1020167021707A KR102324621B1 (ko) 2014-01-22 2015-01-21 레이저 에칭 가공용 도전성 페이스트, 도전성 박막, 도전성 적층체

Country Status (5)

Country Link
JP (1) JP6638393B2 (ja)
KR (1) KR102324621B1 (ja)
CN (1) CN106415735B (ja)
TW (1) TWI655644B (ja)
WO (1) WO2015111614A1 (ja)

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EP3245948B1 (en) * 2015-01-14 2021-03-24 Toyobo Co., Ltd. Stretchable electrode sheet and biological information measurement interface
CN106169344A (zh) * 2016-08-01 2016-11-30 合肥佳瑞林电子技术有限公司 一种电位器绕组短路加工工艺
JP2018035286A (ja) * 2016-09-01 2018-03-08 パナソニックＩｐマネジメント株式会社 導電性樹脂組成物及びそれを用いた電子回路部材
CN108022669B (zh) * 2016-11-03 2020-06-12 北京中科纳通电子技术有限公司 一种手机触摸屏专用超低温固化激光蚀刻导电银浆
CN106782748B (zh) * 2017-03-03 2018-04-24 东南大学 一种制作银纳米线柔性透明导电薄膜的方法
CN106898411A (zh) * 2017-03-20 2017-06-27 北京市合众创能光电技术有限公司 一种适合激光刻蚀加工的低温固化触摸屏导电银浆料
KR20200043969A (ko) * 2017-08-24 2020-04-28 도요보 가부시키가이샤 도전성 페이스트, 입체 인쇄 회로, 터치 센서 및 이들의 제법
WO2019198624A1 (ja) * 2018-04-12 2019-10-17 東洋紡株式会社 導電性ペースト
WO2020056617A1 (zh) * 2018-09-19 2020-03-26 深圳市汇顶科技股份有限公司 忆阻器电极及其制备方法、忆阻器和阻变式存储器
CN109894751B (zh) * 2019-03-11 2020-12-29 中国航发北京航空材料研究院 一种金属箔材表面纤维丝凹槽的刻蚀方法
CN113436781B (zh) * 2021-07-27 2023-11-21 北京中科纳通电子技术有限公司 耐磨性的导电浆料及其制备方法

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JP2006079912A (ja) * 2004-09-09 2006-03-23 Sumitomo Electric Ind Ltd 導電性ペースト及びその製造方法
JP2014002992A (ja) * 2012-06-14 2014-01-09 Pelnox Ltd レーザーエッチング用導電性ペースト組成物

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JP2008013809A (ja) * 2006-07-05 2008-01-24 Az Electronic Materials Kk レーザーアブレーションによる機能膜の製造法およびそれに用いるレーザーアブレーション加工用組成物
KR20110074634A (ko) * 2007-01-10 2011-06-30 히다치 가세고교 가부시끼가이샤 회로 부재 접속용 접착제 및 이것을 이용한 반도체 장치
JP5289859B2 (ja) * 2008-08-13 2013-09-11 日本写真印刷株式会社 導電性パターン被覆体の製造方法および導電性パターン被覆体
JP5236557B2 (ja) 2009-03-31 2013-07-17 太陽ホールディングス株式会社 レーザーを用いたパターン形成方法
KR101223408B1 (ko) * 2009-10-15 2013-01-16 도요보 가부시키가이샤 도전성 페이스트, 도전성 막, 터치 패널 및 도전성 박막의 제조 방법
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JP2006079912A (ja) * 2004-09-09 2006-03-23 Sumitomo Electric Ind Ltd 導電性ペースト及びその製造方法
JP2014002992A (ja) * 2012-06-14 2014-01-09 Pelnox Ltd レーザーエッチング用導電性ペースト組成物

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Publication number Publication date
TW201535419A (zh) 2015-09-16
JP6638393B2 (ja) 2020-01-29
JPWO2015111614A1 (ja) 2017-03-23
KR20160111945A (ko) 2016-09-27
TWI655644B (zh) 2019-04-01
CN106415735B (zh) 2018-04-10
CN106415735A (zh) 2017-02-15
WO2015111614A1 (ja) 2015-07-30

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