KR102321864B1 - 도전성 필름형 접착제, 필름형 접착제 부착 다이싱 테이프 및 반도체 장치의 제조 방법 - Google Patents

도전성 필름형 접착제, 필름형 접착제 부착 다이싱 테이프 및 반도체 장치의 제조 방법 Download PDF

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KR102321864B1
KR102321864B1 KR1020150160938A KR20150160938A KR102321864B1 KR 102321864 B1 KR102321864 B1 KR 102321864B1 KR 1020150160938 A KR1020150160938 A KR 1020150160938A KR 20150160938 A KR20150160938 A KR 20150160938A KR 102321864 B1 KR102321864 B1 KR 102321864B1
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South Korea
Prior art keywords
film adhesive
adhesive
resin
dicing tape
weight
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KR1020150160938A
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English (en)
Korean (ko)
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KR20160063985A (ko
Inventor
유키 스고
유타 기무라
미츠아키 후스마다
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닛토덴코 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
KR1020150160938A 2014-11-27 2015-11-17 도전성 필름형 접착제, 필름형 접착제 부착 다이싱 테이프 및 반도체 장치의 제조 방법 KR102321864B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-240028 2014-11-27
JP2014240028A JP6396189B2 (ja) 2014-11-27 2014-11-27 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20160063985A KR20160063985A (ko) 2016-06-07
KR102321864B1 true KR102321864B1 (ko) 2021-11-05

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KR1020150160938A KR102321864B1 (ko) 2014-11-27 2015-11-17 도전성 필름형 접착제, 필름형 접착제 부착 다이싱 테이프 및 반도체 장치의 제조 방법

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JP (1) JP6396189B2 (zh)
KR (1) KR102321864B1 (zh)
CN (1) CN105647405B (zh)
TW (1) TWI714540B (zh)

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JP6815132B2 (ja) * 2016-08-31 2021-01-20 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
JP6877982B2 (ja) * 2016-12-08 2021-05-26 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
US11168235B2 (en) * 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
JP7350653B2 (ja) * 2017-11-13 2023-09-26 日東電工株式会社 焼結接合用組成物、焼結接合用シート、および焼結接合用シート付きダイシングテープ
JP7250468B6 (ja) * 2018-10-12 2023-04-25 三井化学株式会社 電子装置の製造方法および粘着性フィルム
JP2020084159A (ja) * 2018-11-30 2020-06-04 京セラ株式会社 導電性接着用シート、その製造方法及び半導体装置
KR20200117497A (ko) 2019-04-04 2020-10-14 주식회사 케이씨씨 반도체용 접착제 조성물 및 이를 포함하는 반도체용 접착 필름
JP7137895B2 (ja) * 2019-04-24 2022-09-15 京セラ株式会社 導電性接着用シート、導電性接着用シートの製造方法及び半導体装置
WO2021005661A1 (ja) 2019-07-05 2021-01-14 昭和電工マテリアルズ株式会社 ダイシング・ダイボンディング一体型フィルム、ダイボンディングフィルム、及び半導体装置の製造方法
KR20220044162A (ko) * 2019-08-01 2022-04-06 린텍 가부시키가이샤 지지 시트 부착 필름상 소성 재료, 롤체, 적층체, 및 장치의 제조 방법
JP7287477B2 (ja) * 2019-09-12 2023-06-06 株式会社レゾナック 半導体装置の製造方法、接着剤層の選定方法、並びに、ダイシング・ダイボンディング一体型フィルムの製造方法
JP7190418B2 (ja) * 2019-11-08 2022-12-15 日東電工株式会社 熱硬化性シート及びダイシングダイボンドフィルム
JP7210421B2 (ja) * 2019-11-08 2023-01-23 日東電工株式会社 熱硬化性シート及びダイシングダイボンドフィルム
CN113831865A (zh) * 2020-06-24 2021-12-24 日东电工株式会社 热固性片及切割芯片接合薄膜
JP2022015193A (ja) 2020-07-08 2022-01-21 昭和電工マテリアルズ株式会社 ダイシング・ダイボンディング一体型フィルム、ダイボンディングフィルム、及び半導体装置の製造方法
JP2022015188A (ja) 2020-07-08 2022-01-21 昭和電工マテリアルズ株式会社 ダイシング・ダイボンディング一体型フィルム、ダイボンディングフィルム、及び半導体装置の製造方法
WO2022137551A1 (ja) 2020-12-25 2022-06-30 昭和電工マテリアルズ株式会社 フィルム状接着剤、ダイシング・ダイボンディング一体型フィルム、並びに半導体装置及びその製造方法
KR20230122600A (ko) 2020-12-25 2023-08-22 가부시끼가이샤 레조낙 필름상 접착제 및 그 제조 방법, 다이싱·다이본딩 일체형 필름, 및 반도체 장치 및 그 제조 방법
WO2022137552A1 (ja) 2020-12-25 2022-06-30 昭和電工マテリアルズ株式会社 フィルム状接着剤及びその製造方法、ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置及びその製造方法
CN117321744A (zh) * 2021-06-16 2023-12-29 日东电工株式会社 导电性片材和切割芯片接合薄膜
WO2023106177A1 (ja) * 2021-12-06 2023-06-15 東レ株式会社 Ｌｅｄ実装基板の製造方法
WO2023190950A1 (ja) * 2022-03-31 2023-10-05 リンテック株式会社 積層体の製造方法

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US20100001237A1 (en) * 2007-03-26 2010-01-07 Fornes Timothy D Method for producing heterogeneous composites
JP2014216611A (ja) * 2013-04-30 2014-11-17 日東電工株式会社 フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法

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KR20160063985A (ko) 2016-06-07
JP2016103524A (ja) 2016-06-02
TWI714540B (zh) 2021-01-01
CN105647405A (zh) 2016-06-08
TW201631674A (zh) 2016-09-01
CN105647405B (zh) 2021-08-24
JP6396189B2 (ja) 2018-09-26

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