KR102316440B1 - 공정 장치 - Google Patents

공정 장치 Download PDF

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Publication number
KR102316440B1
KR102316440B1 KR1020167013021A KR20167013021A KR102316440B1 KR 102316440 B1 KR102316440 B1 KR 102316440B1 KR 1020167013021 A KR1020167013021 A KR 1020167013021A KR 20167013021 A KR20167013021 A KR 20167013021A KR 102316440 B1 KR102316440 B1 KR 102316440B1
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KR
South Korea
Prior art keywords
transfer
telescoping
carriage
sealable chamber
substrate
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KR1020167013021A
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English (en)
Korean (ko)
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KR20160072217A (ko
Inventor
로버트 티. 케이브니
율리시스 길크리스트
Original Assignee
브룩스 오토메이션 인코퍼레이티드
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Publication of KR20160072217A publication Critical patent/KR20160072217A/ko
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Publication of KR102316440B1 publication Critical patent/KR102316440B1/ko
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    • H01L21/67742—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H01L21/67173—
    • H01L21/67739—
    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
KR1020167013021A 2013-10-18 2014-10-16 공정 장치 Active KR102316440B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361892849P 2013-10-18 2013-10-18
US61/892,849 2013-10-18
US201361904908P 2013-11-15 2013-11-15
US61/904,908 2013-11-15
PCT/US2014/060893 WO2015057959A1 (en) 2013-10-18 2014-10-16 Processing apparatus

Publications (2)

Publication Number Publication Date
KR20160072217A KR20160072217A (ko) 2016-06-22
KR102316440B1 true KR102316440B1 (ko) 2021-10-22

Family

ID=52828696

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167013021A Active KR102316440B1 (ko) 2013-10-18 2014-10-16 공정 장치

Country Status (5)

Country Link
US (1) US10777438B2 (https=)
JP (1) JP6594304B2 (https=)
KR (1) KR102316440B1 (https=)
CN (1) CN105814677B (https=)
WO (1) WO2015057959A1 (https=)

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US10381266B2 (en) 2012-03-27 2019-08-13 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US11437269B2 (en) 2012-03-27 2022-09-06 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
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US9953984B2 (en) 2015-02-11 2018-04-24 Lam Research Corporation Tungsten for wordline applications
US10170320B2 (en) 2015-05-18 2019-01-01 Lam Research Corporation Feature fill with multi-stage nucleation inhibition
US9978605B2 (en) 2015-05-27 2018-05-22 Lam Research Corporation Method of forming low resistivity fluorine free tungsten film without nucleation
US9972504B2 (en) 2015-08-07 2018-05-15 Lam Research Corporation Atomic layer etching of tungsten for enhanced tungsten deposition fill
US9978610B2 (en) 2015-08-21 2018-05-22 Lam Research Corporation Pulsing RF power in etch process to enhance tungsten gapfill performance
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
JP6663774B2 (ja) * 2016-03-30 2020-03-13 東京エレクトロン株式会社 基板搬送方法及び基板処理システム
US10573522B2 (en) 2016-08-16 2020-02-25 Lam Research Corporation Method for preventing line bending during metal fill process
US10566211B2 (en) 2016-08-30 2020-02-18 Lam Research Corporation Continuous and pulsed RF plasma for etching metals
US11482434B2 (en) * 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
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US10211099B2 (en) 2016-12-19 2019-02-19 Lam Research Corporation Chamber conditioning for remote plasma process
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EP3596752B1 (en) * 2017-03-15 2025-01-08 Lam Research Corporation Reduced footprint platform architecture with linear vacuum transfer module
WO2018185858A1 (ja) 2017-04-04 2018-10-11 株式会社Ｍｕｊｉｎ 制御装置、ピッキングシステム、物流システム、プログラム、制御方法、及び、生産方法
DE112017007399B4 (de) 2017-04-04 2021-09-23 Mujin, Inc. Steuervorrichtung, Greifsystem, Verteilersystem, Programm, Steuerverfahren und Herstellungsverfahren
DE112017007394B4 (de) 2017-04-04 2020-12-03 Mujin, Inc. Informationsverarbeitungsvorrichtung, Greifsystem, Verteilersystem, Programm und Informationsverarbeitungsverfahren
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CN110520259B (zh) 2017-04-04 2021-09-21 牧今科技 控制装置、拾取系统、物流系统、存储介质以及控制方法
CN107009354B (zh) * 2017-04-24 2020-05-12 上海宇航系统工程研究所 用于板块拼接的2sps+rrprr机器人抓取机构
US10903107B2 (en) 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
KR20250073535A (ko) 2017-08-14 2025-05-27 램 리써치 코포레이션 3차원 수직 nand 워드라인을 위한 금속 충진 프로세스
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
US11264254B2 (en) * 2018-03-20 2022-03-01 Tokyo Electron Limited Substrate processing tool with integrated metrology and method of using
KR102806630B1 (ko) 2018-05-03 2025-05-12 램 리써치 코포레이션 3d nand 구조체들에 텅스텐 및 다른 금속들을 증착하는 방법
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
CN112840447B (zh) 2018-10-04 2025-11-21 应用材料公司 运输系统
JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
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US20010000048A1 (en) * 1990-08-29 2001-03-22 Shigekazu Kato Vacuum processing apparatus and operating method therefor
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JP2004265947A (ja) 2003-02-24 2004-09-24 Tokyo Electron Ltd 搬送装置及び真空処理装置並びに常圧搬送装置
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Also Published As

Publication number Publication date
US20160293467A1 (en) 2016-10-06
CN105814677B (zh) 2019-06-18
JP6594304B2 (ja) 2019-10-23
KR20160072217A (ko) 2016-06-22
WO2015057959A1 (en) 2015-04-23
JP2016540374A (ja) 2016-12-22
CN105814677A (zh) 2016-07-27
US10777438B2 (en) 2020-09-15

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