KR102311128B1 - 취성재료 기판의 레이저 가공방법 및 레이저 가공장치 - Google Patents

취성재료 기판의 레이저 가공방법 및 레이저 가공장치 Download PDF

Info

Publication number
KR102311128B1
KR102311128B1 KR1020170035046A KR20170035046A KR102311128B1 KR 102311128 B1 KR102311128 B1 KR 102311128B1 KR 1020170035046 A KR1020170035046 A KR 1020170035046A KR 20170035046 A KR20170035046 A KR 20170035046A KR 102311128 B1 KR102311128 B1 KR 102311128B1
Authority
KR
South Korea
Prior art keywords
brittle material
laser beam
processing
material substrate
laser
Prior art date
Application number
KR1020170035046A
Other languages
English (en)
Korean (ko)
Other versions
KR20180013680A (ko
Inventor
사토시 고쿠세이
켄이치 마에다
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20180013680A publication Critical patent/KR20180013680A/ko
Application granted granted Critical
Publication of KR102311128B1 publication Critical patent/KR102311128B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020170035046A 2016-07-29 2017-03-21 취성재료 기판의 레이저 가공방법 및 레이저 가공장치 KR102311128B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016149323A JP6810951B2 (ja) 2016-07-29 2016-07-29 脆性材料基板のレーザー加工方法およびレーザー加工装置
JPJP-P-2016-149323 2016-07-29

Publications (2)

Publication Number Publication Date
KR20180013680A KR20180013680A (ko) 2018-02-07
KR102311128B1 true KR102311128B1 (ko) 2021-10-12

Family

ID=61075511

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170035046A KR102311128B1 (ko) 2016-07-29 2017-03-21 취성재료 기판의 레이저 가공방법 및 레이저 가공장치

Country Status (4)

Country Link
JP (1) JP6810951B2 (ja)
KR (1) KR102311128B1 (ja)
CN (1) CN107662054B (ja)
TW (1) TWI724138B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115087512A (zh) * 2020-02-10 2022-09-20 三菱电机株式会社 激光加工方法及激光加工装置
CN116673618A (zh) * 2023-07-07 2023-09-01 珠海市申科谱工业科技有限公司 医疗塑料导管激光打孔工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020033558A1 (en) * 2000-09-20 2002-03-21 Fahey Kevin P. UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
KR101226200B1 (ko) * 2009-06-30 2013-01-28 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저광에 의한 유리 기판 가공 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6720519B2 (en) * 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
JP2005021917A (ja) * 2003-06-30 2005-01-27 Sumitomo Heavy Ind Ltd 樹脂層への穴あけ方法
JP4614844B2 (ja) * 2005-08-05 2011-01-19 住友重機械工業株式会社 レーザ加工方法及びレーザ加工装置
JP2010024064A (ja) * 2008-07-15 2010-02-04 Seiko Epson Corp 構造体の製造方法、液滴吐出ヘッド
CN101462204A (zh) * 2009-01-16 2009-06-24 华中科技大学 卷烟接装纸激光打孔方法和设备
JP4734437B2 (ja) * 2009-04-17 2011-07-27 沓名 宗春 繊維強化複合材料のレーザ加工方法
JP5667347B2 (ja) * 2009-06-30 2015-02-12 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板加工装置
CN101610643B (zh) * 2009-07-14 2010-12-01 华中科技大学 一种激光加工盲孔的方法
JP2012071325A (ja) * 2010-09-28 2012-04-12 Seiko Epson Corp 基板の加工方法
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
WO2013128994A1 (en) * 2012-02-10 2013-09-06 Asahi Glass Company, Limited A device for drilling a substrate using a plurality of dc voltage output; method of drilling a substrate using such device
CN203124973U (zh) * 2012-12-27 2013-08-14 重庆川仪自动化股份有限公司 用于激光打孔的自动上料夹具
JP6162975B2 (ja) * 2013-02-22 2017-07-12 株式会社フジクラ 微細孔を備えた基板の製造方法
FR3012059B1 (fr) * 2013-10-17 2016-01-08 Centre Nat Rech Scient Methode et dispositif de micro-usinage par laser
CN105669014B (zh) * 2014-11-21 2018-12-28 大族激光科技产业集团股份有限公司 一种采用激光刻划玻璃加工方法
CN104759754B (zh) * 2015-04-14 2016-09-14 大族激光科技产业集团股份有限公司 一种应用于圆管材料的激光加工设备

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020033558A1 (en) * 2000-09-20 2002-03-21 Fahey Kevin P. UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
KR101226200B1 (ko) * 2009-06-30 2013-01-28 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저광에 의한 유리 기판 가공 장치

Also Published As

Publication number Publication date
CN107662054A (zh) 2018-02-06
JP2018015798A (ja) 2018-02-01
KR20180013680A (ko) 2018-02-07
TWI724138B (zh) 2021-04-11
CN107662054B (zh) 2021-06-18
TW201803678A (zh) 2018-02-01
JP6810951B2 (ja) 2021-01-13

Similar Documents

Publication Publication Date Title
US11820119B2 (en) Laser lift off systems and methods that overlap irradiation zones to provide multiple pulses of laser irradiation per location at an interface between layers to be separated
US20110132885A1 (en) Laser machining and scribing systems and methods
TWI469841B (zh) 使用經傾斜的雷射掃描來加工工作件的方法和設備
JP2009066613A (ja) 脆性材料基板の分断装置および分断方法
CN105163897A (zh) 锥度控制的射束角协调及工件运动
JP2020104167A (ja) レーザー加工装置およびビームローテータユニット
KR102311128B1 (ko) 취성재료 기판의 레이저 가공방법 및 레이저 가공장치
TW202045289A (zh) 雷射鑽孔裝置及方法
TWI715745B (zh) 脆性材料基板之雷射加工方法及雷射加工裝置
JP6920762B2 (ja) 脆性材料基板のレーザー加工装置
KR102353478B1 (ko) 취성재료 기판의 레이저 가공방법 및 레이저 가공장치
WO2015136948A1 (ja) レーザ加工方法
TWI579089B (zh) 玻璃基板之雷射加工裝置
JP7045623B2 (ja) マルチレーザー切断の方法とシステム
JP2004209508A (ja) レーザ加工方法及びレーザ加工装置
JP7302824B2 (ja) 基材の加工方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant