KR102299122B1 - 정전 용량을 나타내는 데이터를 취득하는 방법 - Google Patents

정전 용량을 나타내는 데이터를 취득하는 방법 Download PDF

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KR102299122B1
KR102299122B1 KR1020170038184A KR20170038184A KR102299122B1 KR 102299122 B1 KR102299122 B1 KR 102299122B1 KR 1020170038184 A KR1020170038184 A KR 1020170038184A KR 20170038184 A KR20170038184 A KR 20170038184A KR 102299122 B1 KR102299122 B1 KR 102299122B1
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KR
South Korea
Prior art keywords
data sets
electrode
processor
sensor
measuring device
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KR1020170038184A
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English (en)
Korean (ko)
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KR20170113262A (ko
Inventor
깃페이 스기타
도모히데 미나미
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20170113262A publication Critical patent/KR20170113262A/ko
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Publication of KR102299122B1 publication Critical patent/KR102299122B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
KR1020170038184A 2016-03-28 2017-03-27 정전 용량을 나타내는 데이터를 취득하는 방법 KR102299122B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2016-063649 2016-03-28
JP2016063649 2016-03-28
JP2016110095A JP6586394B2 (ja) 2016-03-28 2016-06-01 静電容量を表すデータを取得する方法
JPJP-P-2016-110095 2016-06-01

Publications (2)

Publication Number Publication Date
KR20170113262A KR20170113262A (ko) 2017-10-12
KR102299122B1 true KR102299122B1 (ko) 2021-09-06

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Application Number Title Priority Date Filing Date
KR1020170038184A KR102299122B1 (ko) 2016-03-28 2017-03-27 정전 용량을 나타내는 데이터를 취득하는 방법

Country Status (3)

Country Link
JP (1) JP6586394B2 (zh)
KR (1) KR102299122B1 (zh)
TW (1) TWI714743B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11899516B1 (en) 2023-07-13 2024-02-13 T-Mobile Usa, Inc. Creation of a digital twin for auto-discovery of hierarchy in power monitoring

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109964308B (zh) * 2017-10-25 2023-12-19 应用材料公司 用于真空腔室的载体、测试系统和方法、真空处理系统
JP7029983B2 (ja) * 2018-03-09 2022-03-04 東京エレクトロン株式会社 測定器及び測定器のずれ量を求める方法
JP7037964B2 (ja) * 2018-03-09 2022-03-17 東京エレクトロン株式会社 測定器、及びフォーカスリングを検査するためのシステムの動作方法
JP7126466B2 (ja) * 2018-12-12 2022-08-26 東京エレクトロン株式会社 基板処理システム、搬送方法、および搬送プログラム
US11581206B2 (en) 2020-03-06 2023-02-14 Applied Materials, Inc. Capacitive sensor for chamber condition monitoring
JP2022046096A (ja) 2020-09-10 2022-03-23 東京エレクトロン株式会社 実行装置及び実行方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091204A (ja) 1999-09-24 2001-04-06 Fotonikusu:Kk 距離測定装置
JP2006186171A (ja) 2004-12-28 2006-07-13 Toshiba Corp 半導体製造装置及び半導体装置の製造方法
JP2009054993A (ja) 2007-08-02 2009-03-12 Tokyo Electron Ltd 位置検出用治具
JP2009054665A (ja) 2007-08-24 2009-03-12 Tokyo Electron Ltd 搬送アームの移動位置の調整方法及び位置検出用治具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2878913B2 (ja) * 1992-09-14 1999-04-05 株式会社ミツトヨ 変位測定装置
NL1017593C2 (nl) * 2001-03-14 2002-09-17 Asm Int Inspectiesysteem ten behoeve van procesapparaten voor het behandelen van substraten, alsmede een sensor bestemd voor een dergelijk inspectiesysteem en een werkwijze voor het inspecteren van procesapparaten.
JP3913026B2 (ja) * 2001-10-18 2007-05-09 サムタク株式会社 リニアスケールの信号処理装置及び方法
US6813543B2 (en) * 2002-10-08 2004-11-02 Brooks-Pri Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
JP2004319857A (ja) * 2003-04-18 2004-11-11 Matsushita Electric Ind Co Ltd 半導体製造装置のモニタリングシステム
TW200520632A (en) * 2003-09-05 2005-06-16 Tokyo Electron Ltd Focus ring and plasma processing apparatus
JP4782990B2 (ja) * 2004-05-31 2011-09-28 株式会社ミツトヨ 表面倣い測定装置、表面倣い測定方法、表面倣い測定プログラムおよび記録媒体
JP4562551B2 (ja) * 2005-03-02 2010-10-13 北斗電子工業株式会社 インピーダンス検出装置
JP5105399B2 (ja) * 2006-08-08 2012-12-26 東京エレクトロン株式会社 データ収集方法，基板処理装置，基板処理システム
JP5102500B2 (ja) * 2007-01-22 2012-12-19 東京エレクトロン株式会社 基板処理装置
JP5009870B2 (ja) * 2008-07-22 2012-08-22 日本特殊陶業株式会社 静電容量式センサの異常検出装置
JP5582823B2 (ja) * 2010-02-26 2014-09-03 東京エレクトロン株式会社 自動整合装置及びプラズマ処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001091204A (ja) 1999-09-24 2001-04-06 Fotonikusu:Kk 距離測定装置
JP2006186171A (ja) 2004-12-28 2006-07-13 Toshiba Corp 半導体製造装置及び半導体装置の製造方法
JP2009054993A (ja) 2007-08-02 2009-03-12 Tokyo Electron Ltd 位置検出用治具
JP2009054665A (ja) 2007-08-24 2009-03-12 Tokyo Electron Ltd 搬送アームの移動位置の調整方法及び位置検出用治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11899516B1 (en) 2023-07-13 2024-02-13 T-Mobile Usa, Inc. Creation of a digital twin for auto-discovery of hierarchy in power monitoring

Also Published As

Publication number Publication date
KR20170113262A (ko) 2017-10-12
TWI714743B (zh) 2021-01-01
TW201809689A (zh) 2018-03-16
JP2017183683A (ja) 2017-10-05
JP6586394B2 (ja) 2019-10-02

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