KR102268200B1 - 에폭시 수지 경화제 조성물, 에폭시 수지 조성물 및 경화물 - Google Patents

에폭시 수지 경화제 조성물, 에폭시 수지 조성물 및 경화물 Download PDF

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Publication number
KR102268200B1
KR102268200B1 KR1020170061619A KR20170061619A KR102268200B1 KR 102268200 B1 KR102268200 B1 KR 102268200B1 KR 1020170061619 A KR1020170061619 A KR 1020170061619A KR 20170061619 A KR20170061619 A KR 20170061619A KR 102268200 B1 KR102268200 B1 KR 102268200B1
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KR
South Korea
Prior art keywords
epoxy resin
carbon atoms
curing agent
group
hydrocarbon group
Prior art date
Application number
KR1020170061619A
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English (en)
Korean (ko)
Other versions
KR20170131262A (ko
Inventor
도모유키 다카시마
가즈오 이시하라
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
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Publication of KR20170131262A publication Critical patent/KR20170131262A/ko
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Publication of KR102268200B1 publication Critical patent/KR102268200B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B32B2260/023—Two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
KR1020170061619A 2016-05-19 2017-05-18 에폭시 수지 경화제 조성물, 에폭시 수지 조성물 및 경화물 KR102268200B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-100162 2016-05-19
JP2016100162A JP6758087B2 (ja) 2016-05-19 2016-05-19 エポキシ樹脂硬化剤組成物、エポキシ樹脂組成物及び硬化物

Publications (2)

Publication Number Publication Date
KR20170131262A KR20170131262A (ko) 2017-11-29
KR102268200B1 true KR102268200B1 (ko) 2021-06-22

Family

ID=60416892

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170061619A KR102268200B1 (ko) 2016-05-19 2017-05-18 에폭시 수지 경화제 조성물, 에폭시 수지 조성물 및 경화물

Country Status (4)

Country Link
JP (1) JP6758087B2 (zh)
KR (1) KR102268200B1 (zh)
CN (1) CN107417890B (zh)
TW (1) TWI728112B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6924000B2 (ja) * 2016-05-20 2021-08-25 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
CN112236477B (zh) * 2018-09-21 2023-06-23 Dic株式会社 树脂组合物、硬化物、层叠体及电子构件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012057079A (ja) 2010-09-10 2012-03-22 Nippon Steel Chem Co Ltd 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3900682A1 (de) * 1989-01-12 1990-07-19 Bayer Ag Diglycidylverbindungen, ihre herstellung und ihre verwendung in haertbaren epoxid-gemischen
JPH0848747A (ja) * 1994-08-09 1996-02-20 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP3734602B2 (ja) * 1997-05-29 2006-01-11 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物および半導体封止用エポキシ樹脂組成物
JP5320130B2 (ja) * 2009-03-31 2013-10-23 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP5885331B2 (ja) * 2011-07-27 2016-03-15 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
TWI631173B (zh) * 2012-10-11 2018-08-01 新日鐵住金化學股份有限公司 Epoxy resin composition and hardened material
US9850375B2 (en) 2013-08-23 2017-12-26 Elite Electronic Material (Kunshan) Co. Ltd. Resin composition, copper clad laminate and printed circuit board using same
CN105331053B (zh) * 2014-07-22 2017-12-05 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012057079A (ja) 2010-09-10 2012-03-22 Nippon Steel Chem Co Ltd 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
TWI728112B (zh) 2021-05-21
TW201809059A (zh) 2018-03-16
JP2017206621A (ja) 2017-11-24
CN107417890A (zh) 2017-12-01
CN107417890B (zh) 2021-07-20
JP6758087B2 (ja) 2020-09-23
KR20170131262A (ko) 2017-11-29

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