KR102266688B1 - 트레이 및 웨이퍼 고정 장치 - Google Patents

트레이 및 웨이퍼 고정 장치 Download PDF

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Publication number
KR102266688B1
KR102266688B1 KR1020150084935A KR20150084935A KR102266688B1 KR 102266688 B1 KR102266688 B1 KR 102266688B1 KR 1020150084935 A KR1020150084935 A KR 1020150084935A KR 20150084935 A KR20150084935 A KR 20150084935A KR 102266688 B1 KR102266688 B1 KR 102266688B1
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South Korea
Prior art keywords
electrostatic
electrode
tray
support
electrostatic adsorption
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KR1020150084935A
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English (en)
Korean (ko)
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KR20150146408A (ko
Inventor
고키 다마가와
노리오 시라이와
다다요시 요시카와
나오토 와타나베
미키 사이토
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신꼬오덴기 고교 가부시키가이샤
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    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H01L21/6831—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1020150084935A 2014-06-23 2015-06-16 트레이 및 웨이퍼 고정 장치 Active KR102266688B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014128275A JP6377975B2 (ja) 2014-06-23 2014-06-23 基板固定装置
JPJP-P-2014-128275 2014-06-23

Publications (2)

Publication Number Publication Date
KR20150146408A KR20150146408A (ko) 2015-12-31
KR102266688B1 true KR102266688B1 (ko) 2021-06-21

Family

ID=54870313

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150084935A Active KR102266688B1 (ko) 2014-06-23 2015-06-16 트레이 및 웨이퍼 고정 장치

Country Status (4)

Country Link
US (1) US9837297B2 (https=)
JP (1) JP6377975B2 (https=)
KR (1) KR102266688B1 (https=)
TW (1) TWI640054B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101910727B1 (ko) * 2015-01-20 2018-10-22 엔지케이 인슐레이터 엘티디 웨이퍼 지지 구조체
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
US10770270B2 (en) * 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
US20180096867A1 (en) * 2016-09-30 2018-04-05 Momentive Performance Materials Inc. Heating apparatus with controlled thermal contact
KR20200133031A (ko) * 2016-11-07 2020-11-25 어플라이드 머티어리얼스, 인코포레이티드 기판을 홀딩하기 위한 캐리어, 프로세싱 시스템에서의 캐리어의 사용, 캐리어를 이용하는 프로세싱 시스템, 및 기판의 온도를 제어하기 위한 방법
JP6986937B2 (ja) * 2017-01-05 2021-12-22 東京エレクトロン株式会社 プラズマ処理装置
JP6858035B2 (ja) 2017-02-27 2021-04-14 新光電気工業株式会社 基板固定具及び基板固定装置
JP6969182B2 (ja) * 2017-07-06 2021-11-24 東京エレクトロン株式会社 プラズマ処理装置
US20190105748A1 (en) * 2017-10-11 2019-04-11 Samsung Electronics Co., Ltd. Seal-less airlock wafer stage
JP7049108B2 (ja) * 2017-12-25 2022-04-06 日本特殊陶業株式会社 静電チャック
DE102018127658A1 (de) * 2018-11-06 2020-05-07 Asm Assembly Systems Gmbh & Co. Kg Elektrostatisches Aufspannen von Elektronikplatten
US12300473B2 (en) 2019-03-08 2025-05-13 Applied Materials, Inc. Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber
JP7110482B2 (ja) 2019-03-18 2022-08-01 日本碍子株式会社 静電チャック
WO2020239400A1 (en) * 2019-05-29 2020-12-03 Asml Holding N.V. Split double sided wafer and reticle clamps
JP7349845B2 (ja) * 2019-08-13 2023-09-25 東京エレクトロン株式会社 基板処理システムにおける搬送方法
JP7386086B2 (ja) * 2020-01-07 2023-11-24 日本特殊陶業株式会社 保持装置
JP7683605B2 (ja) * 2020-06-29 2025-05-27 住友大阪セメント株式会社 静電チャック装置
CN118077045A (zh) * 2021-10-20 2024-05-24 日本特殊陶业株式会社 保持装置
JP2024071016A (ja) * 2022-11-14 2024-05-24 新光電気工業株式会社 トレイ及び基板固定装置
US20240186121A1 (en) * 2022-12-06 2024-06-06 Applied Materials, Inc. Thermal choke plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095665A (ja) 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置
JP2014534620A (ja) 2011-10-06 2014-12-18 エーエスエムエル ネザーランズ ビー．ブイ． チャック、リソグラフィ装置及びチャックを使用する方法

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JP2767282B2 (ja) * 1989-05-30 1998-06-18 日本真空技術株式会社 基板保持装置
JPH05259048A (ja) * 1992-03-09 1993-10-08 Nippon Telegr & Teleph Corp <Ntt> 試料加工用装置、試料搬送用装置及び試料搬送・加工用装置
JP3596127B2 (ja) * 1995-12-04 2004-12-02 ソニー株式会社 静電チャック、薄板保持装置、半導体製造装置、搬送方法及び半導体の製造方法
JP4256503B2 (ja) * 1997-10-30 2009-04-22 東京エレクトロン株式会社 真空処理装置
JP4302428B2 (ja) * 2003-05-09 2009-07-29 信越化学工業株式会社 静電吸着機能を有するウエーハ加熱装置
JP2006056731A (ja) * 2004-08-18 2006-03-02 Taiheiyo Cement Corp 窒化アルミニウム焼結体およびそれを用いた静電チャック
DE102005056364B3 (de) * 2005-11-25 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bipolarer Trägerwafer und mobile, bipolare, elektrostatische Waferanordnung
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
JP2010098012A (ja) * 2008-10-14 2010-04-30 Ulvac Japan Ltd エッチング装置及びエッチング方法
JP2012074650A (ja) * 2010-09-30 2012-04-12 Samco Inc プラズマ処理用トレイ及びプラズマ処理装置
JP5638405B2 (ja) * 2010-10-08 2014-12-10 パナソニック株式会社 基板のプラズマ処理方法
JP6285620B2 (ja) * 2011-08-26 2018-02-28 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
JP6007039B2 (ja) * 2012-09-18 2016-10-12 株式会社アルバック 搬送トレー及び基板保持方法
JP5595549B2 (ja) * 2013-03-28 2014-09-24 パナソニック株式会社 プラズマ処理装置用トレイ、プラズマ処理装置、及びプラズマ処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004095665A (ja) 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置
JP2014534620A (ja) 2011-10-06 2014-12-18 エーエスエムエル ネザーランズ ビー．ブイ． チャック、リソグラフィ装置及びチャックを使用する方法

Also Published As

Publication number Publication date
US20150371885A1 (en) 2015-12-24
JP6377975B2 (ja) 2018-08-22
JP2016009715A (ja) 2016-01-18
KR20150146408A (ko) 2015-12-31
TWI640054B (zh) 2018-11-01
US9837297B2 (en) 2017-12-05
TW201613019A (en) 2016-04-01

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