KR102239538B1 - 임프린트 방법, 임프린트 장치, 형, 및 물품 제조 방법 - Google Patents
임프린트 방법, 임프린트 장치, 형, 및 물품 제조 방법 Download PDFInfo
- Publication number
- KR102239538B1 KR102239538B1 KR1020170155286A KR20170155286A KR102239538B1 KR 102239538 B1 KR102239538 B1 KR 102239538B1 KR 1020170155286 A KR1020170155286 A KR 1020170155286A KR 20170155286 A KR20170155286 A KR 20170155286A KR 102239538 B1 KR102239538 B1 KR 102239538B1
- Authority
- KR
- South Korea
- Prior art keywords
- region
- imprint material
- imprint
- substrate
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H01L21/0274—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2016-233246 | 2016-11-30 | ||
| JP2016233246A JP6824713B2 (ja) | 2016-11-30 | 2016-11-30 | インプリント方法、インプリント装置、型、および物品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180062360A KR20180062360A (ko) | 2018-06-08 |
| KR102239538B1 true KR102239538B1 (ko) | 2021-04-14 |
Family
ID=62564769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170155286A Active KR102239538B1 (ko) | 2016-11-30 | 2017-11-21 | 임프린트 방법, 임프린트 장치, 형, 및 물품 제조 방법 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6824713B2 (https=) |
| KR (1) | KR102239538B1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102379451B1 (ko) * | 2021-04-27 | 2022-03-28 | 창원대학교 산학협력단 | 대면적 패턴 제작용 몰드, 이의 제조 방법 및 이를 이용한 패턴 성형 방법 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10976657B2 (en) * | 2018-08-31 | 2021-04-13 | Canon Kabushiki Kaisha | System and method for illuminating edges of an imprint field with a gradient dosage |
| EP4398040A3 (en) | 2018-11-08 | 2025-07-02 | Canon Kabushiki Kaisha | Imprint apparatus and product manufacturing method |
| JP2020096138A (ja) * | 2018-12-14 | 2020-06-18 | キヤノン株式会社 | インプリント装置、情報処理装置及び物品の製造方法 |
| JP7149870B2 (ja) * | 2019-02-08 | 2022-10-07 | キヤノン株式会社 | インプリント装置および物品製造方法 |
| JP7179655B2 (ja) * | 2019-03-14 | 2022-11-29 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| US11249397B2 (en) * | 2019-11-22 | 2022-02-15 | Canon Kabushiki Kaisha | Method of forming a cured layer by controlling drop spreading |
| JP7466375B2 (ja) * | 2020-05-19 | 2024-04-12 | キヤノン株式会社 | インプリント方法、インプリント装置及び物品の製造方法 |
| JP7710313B2 (ja) * | 2021-05-27 | 2025-07-18 | キヤノン株式会社 | モールド、インプリント装置、および物品の製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003295428A (ja) | 2001-03-29 | 2003-10-15 | Dainippon Printing Co Ltd | パターン形成体の製造方法およびそれに用いるフォトマスク |
| JP2008100378A (ja) * | 2006-10-17 | 2008-05-01 | Dainippon Printing Co Ltd | パターン形成体の製造方法 |
| JP2009260293A (ja) | 2008-03-18 | 2009-11-05 | Canon Inc | ナノインプリント方法及びナノインプリントに用いられるモールド |
| JP2013069918A (ja) | 2011-09-22 | 2013-04-18 | Toshiba Corp | インプリント方法およびインプリント装置 |
| JP2013161866A (ja) | 2012-02-02 | 2013-08-19 | Toshiba Corp | インプリント方法およびテンプレート |
| JP2014027016A (ja) | 2012-07-24 | 2014-02-06 | Canon Inc | インプリント装置、および、物品製造方法 |
| JP2014160754A (ja) | 2013-02-20 | 2014-09-04 | Dainippon Printing Co Ltd | インプリントモールド、インプリント方法及び半導体装置の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705299A (en) * | 1992-12-16 | 1998-01-06 | Texas Instruments Incorporated | Large die photolithography |
| JP2006162754A (ja) * | 2004-12-03 | 2006-06-22 | Dainippon Printing Co Ltd | パターン形成体およびその製造方法 |
| US8011916B2 (en) * | 2005-09-06 | 2011-09-06 | Canon Kabushiki Kaisha | Mold, imprint apparatus, and process for producing structure |
| KR20080105524A (ko) * | 2007-05-31 | 2008-12-04 | 삼성전자주식회사 | 마스크 몰드 및 그 제작방법과 제작된 마스크 몰드를이용한 대면적 미세패턴 성형방법 |
| JP4963718B2 (ja) * | 2009-10-23 | 2012-06-27 | キヤノン株式会社 | インプリント方法及びインプリント装置、それを用いた物品の製造方法 |
| CN102782580B (zh) * | 2010-02-26 | 2015-04-22 | 株式会社尼康 | 图案形成方法 |
| KR101623695B1 (ko) * | 2011-11-04 | 2016-05-23 | 가부시키가이샤 니콘 | 기판 처리 장치, 및 기판 처리 방법 |
| JP6351412B2 (ja) * | 2014-07-15 | 2018-07-04 | キヤノン株式会社 | インプリント装置及び方法、物品の製造方法、並びにプログラム |
| JP2016183251A (ja) * | 2015-03-26 | 2016-10-20 | Jnc株式会社 | 光硬化性組成物およびその用途 |
-
2016
- 2016-11-30 JP JP2016233246A patent/JP6824713B2/ja active Active
-
2017
- 2017-11-21 KR KR1020170155286A patent/KR102239538B1/ko active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003295428A (ja) | 2001-03-29 | 2003-10-15 | Dainippon Printing Co Ltd | パターン形成体の製造方法およびそれに用いるフォトマスク |
| JP2008100378A (ja) * | 2006-10-17 | 2008-05-01 | Dainippon Printing Co Ltd | パターン形成体の製造方法 |
| JP2009260293A (ja) | 2008-03-18 | 2009-11-05 | Canon Inc | ナノインプリント方法及びナノインプリントに用いられるモールド |
| JP2013069918A (ja) | 2011-09-22 | 2013-04-18 | Toshiba Corp | インプリント方法およびインプリント装置 |
| JP2013161866A (ja) | 2012-02-02 | 2013-08-19 | Toshiba Corp | インプリント方法およびテンプレート |
| JP2014027016A (ja) | 2012-07-24 | 2014-02-06 | Canon Inc | インプリント装置、および、物品製造方法 |
| JP2014160754A (ja) | 2013-02-20 | 2014-09-04 | Dainippon Printing Co Ltd | インプリントモールド、インプリント方法及び半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102379451B1 (ko) * | 2021-04-27 | 2022-03-28 | 창원대학교 산학협력단 | 대면적 패턴 제작용 몰드, 이의 제조 방법 및 이를 이용한 패턴 성형 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018092996A (ja) | 2018-06-14 |
| JP6824713B2 (ja) | 2021-02-03 |
| KR20180062360A (ko) | 2018-06-08 |
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