KR102226987B1 - 광 후경화성 수지 조성물 - Google Patents

광 후경화성 수지 조성물 Download PDF

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Publication number
KR102226987B1
KR102226987B1 KR1020157024550A KR20157024550A KR102226987B1 KR 102226987 B1 KR102226987 B1 KR 102226987B1 KR 1020157024550 A KR1020157024550 A KR 1020157024550A KR 20157024550 A KR20157024550 A KR 20157024550A KR 102226987 B1 KR102226987 B1 KR 102226987B1
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KR
South Korea
Prior art keywords
curable resin
resin composition
cation
weight
group
Prior art date
Application number
KR1020157024550A
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English (en)
Korean (ko)
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KR20160047425A (ko
Inventor
야스오 와타나베
도쿠시게 시치리
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20160047425A publication Critical patent/KR20160047425A/ko
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Publication of KR102226987B1 publication Critical patent/KR102226987B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/22—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the initiator used in polymerisation
    • C08G2650/24—Polymeric initiators

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020157024550A 2013-08-26 2014-07-31 광 후경화성 수지 조성물 KR102226987B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-174579 2013-08-26
JP2013174579 2013-08-26
PCT/JP2014/070189 WO2015029689A1 (ja) 2013-08-26 2014-07-31 光後硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20160047425A KR20160047425A (ko) 2016-05-02
KR102226987B1 true KR102226987B1 (ko) 2021-03-11

Family

ID=52586263

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157024550A KR102226987B1 (ko) 2013-08-26 2014-07-31 광 후경화성 수지 조성물

Country Status (5)

Country Link
JP (1) JP5799177B2 (ja)
KR (1) KR102226987B1 (ja)
CN (1) CN105026456B (ja)
TW (1) TWI641650B (ja)
WO (1) WO2015029689A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6560985B2 (ja) * 2014-01-23 2019-08-14 デンカ株式会社 樹脂組成物
KR102392860B1 (ko) * 2016-10-19 2022-04-29 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
WO2019146736A1 (ja) * 2018-01-26 2019-08-01 味の素株式会社 封止用硬化性樹脂組成物
KR20210098943A (ko) * 2018-11-28 2021-08-11 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 경화물, 및, 유기 el 표시 소자
KR20210105875A (ko) * 2018-12-18 2021-08-27 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 경화물, 및, 유기 el 표시 소자
KR20210132001A (ko) * 2019-02-21 2021-11-03 덴카 주식회사 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005241977A (ja) 2004-02-26 2005-09-08 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP2006135128A (ja) * 2004-11-08 2006-05-25 Seiko Epson Corp 導電性材料用組成物、導電性材料、導電層、電子デバイスおよび電子機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07238148A (ja) * 1994-02-25 1995-09-12 Hitachi Chem Co Ltd 感光性ポリアミドエポキシ樹脂組成物
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
WO2009116618A1 (ja) * 2008-03-21 2009-09-24 積水化学工業株式会社 硬化性組成物、異方性導電材料及び接続構造体
JP2012025935A (ja) * 2010-06-25 2012-02-09 Sumitomo Bakelite Co Ltd 樹脂組成物、透明複合基板および表示素子基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005241977A (ja) 2004-02-26 2005-09-08 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板
JP2006135128A (ja) * 2004-11-08 2006-05-25 Seiko Epson Corp 導電性材料用組成物、導電性材料、導電層、電子デバイスおよび電子機器

Also Published As

Publication number Publication date
JP5799177B2 (ja) 2015-10-21
CN105026456B (zh) 2017-10-17
JPWO2015029689A1 (ja) 2017-03-02
TWI641650B (zh) 2018-11-21
WO2015029689A1 (ja) 2015-03-05
CN105026456A (zh) 2015-11-04
KR20160047425A (ko) 2016-05-02
TW201510056A (zh) 2015-03-16

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