KR102214040B1 - 반도체소자 테스트용 핸들러의 가압장치 및 그 작동 방법 - Google Patents

반도체소자 테스트용 핸들러의 가압장치 및 그 작동 방법 Download PDF

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Publication number
KR102214040B1
KR102214040B1 KR1020170028422A KR20170028422A KR102214040B1 KR 102214040 B1 KR102214040 B1 KR 102214040B1 KR 1020170028422 A KR1020170028422 A KR 1020170028422A KR 20170028422 A KR20170028422 A KR 20170028422A KR 102214040 B1 KR102214040 B1 KR 102214040B1
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KR
South Korea
Prior art keywords
advancing
moving distance
retreating
semiconductor devices
advance
Prior art date
Application number
KR1020170028422A
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English (en)
Korean (ko)
Other versions
KR20180101892A (ko
Inventor
나윤성
이승화
태의성
Original Assignee
(주)테크윙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)테크윙 filed Critical (주)테크윙
Priority to KR1020170028422A priority Critical patent/KR102214040B1/ko
Priority to TW107105942A priority patent/TWI656348B/zh
Priority to CN201810168539.6A priority patent/CN108526031B/zh
Publication of KR20180101892A publication Critical patent/KR20180101892A/ko
Application granted granted Critical
Publication of KR102214040B1 publication Critical patent/KR102214040B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020170028422A 2017-03-06 2017-03-06 반도체소자 테스트용 핸들러의 가압장치 및 그 작동 방법 KR102214040B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020170028422A KR102214040B1 (ko) 2017-03-06 2017-03-06 반도체소자 테스트용 핸들러의 가압장치 및 그 작동 방법
TW107105942A TWI656348B (zh) 2017-03-06 2018-02-22 半導體元件測試用分選機的加壓裝置及其操作方法
CN201810168539.6A CN108526031B (zh) 2017-03-06 2018-02-28 半导体元件测试用分选机的加压装置及其操作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170028422A KR102214040B1 (ko) 2017-03-06 2017-03-06 반도체소자 테스트용 핸들러의 가압장치 및 그 작동 방법

Publications (2)

Publication Number Publication Date
KR20180101892A KR20180101892A (ko) 2018-09-14
KR102214040B1 true KR102214040B1 (ko) 2021-02-09

Family

ID=63486394

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170028422A KR102214040B1 (ko) 2017-03-06 2017-03-06 반도체소자 테스트용 핸들러의 가압장치 및 그 작동 방법

Country Status (3)

Country Link
KR (1) KR102214040B1 (zh)
CN (1) CN108526031B (zh)
TW (1) TWI656348B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200071357A (ko) * 2018-12-11 2020-06-19 (주)테크윙 전자부품 테스트용 핸들러
TWI827473B (zh) * 2023-02-22 2023-12-21 鴻勁精密股份有限公司 電子元件作業機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070181644A1 (en) 2004-06-08 2007-08-09 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
TW200848700A (en) 2007-02-07 2008-12-16 Canon Kk Measurement apparatus for measuring surface map
JP2016213384A (ja) 2015-05-12 2016-12-15 株式会社東芝 半導体装置の製造装置及び製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU445483A1 (ru) * 1972-06-26 1974-10-05 Предприятие П/Я 5237 Полуавтомат дл сортировки диафрагм по толщине
JPH09218242A (ja) * 1996-02-08 1997-08-19 Mitsubishi Electric Corp 半導体検査装置および回路基板
US20020027294A1 (en) * 2000-07-21 2002-03-07 Neuhaus Herbert J. Electrical component assembly and method of fabrication
JP4197659B2 (ja) * 2003-05-30 2008-12-17 富士通マイクロエレクトロニクス株式会社 電子部品用コンタクタ及びこれを用いた試験方法
KR20080008462A (ko) * 2006-07-20 2008-01-24 삼성전자주식회사 신호 검사 장치
KR100840209B1 (ko) * 2006-08-16 2008-06-23 미래산업 주식회사 반도체 소자 테스트 핸들러
TWI334033B (en) * 2007-06-15 2010-12-01 Hon Tech Inc Pressing mechanism provided with a plurality of press heads
IT1392682B1 (it) * 2009-01-20 2012-03-16 Mecal S R L Procedimento di tipo migliorato per l'aggraffatura di terminali metallici su cavi elettrici e pressa per la realizzazione di questo procedimento
JP2011038930A (ja) * 2009-08-12 2011-02-24 Renesas Electronics Corp プローブカード及び被検査装置のテスト方法
JP2012174822A (ja) * 2011-02-21 2012-09-10 Juki Corp マウンタ装置の加圧制御ヘッド
CN103977964B (zh) * 2013-02-07 2017-04-12 泰克元有限公司 测试分选机用施压装置
DE102013222433A1 (de) * 2013-11-05 2015-05-21 Robert Bosch Gmbh Verfahren zum Herstellen einer Flip-Chip-Schaltungsanordnung und Flip-Chip-Schaltungsanordnung
KR102200697B1 (ko) * 2015-01-12 2021-01-12 (주)테크윙 테스트핸들러용 가압장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070181644A1 (en) 2004-06-08 2007-08-09 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
TW200848700A (en) 2007-02-07 2008-12-16 Canon Kk Measurement apparatus for measuring surface map
JP2016213384A (ja) 2015-05-12 2016-12-15 株式会社東芝 半導体装置の製造装置及び製造方法

Also Published As

Publication number Publication date
CN108526031A (zh) 2018-09-14
TWI656348B (zh) 2019-04-11
KR20180101892A (ko) 2018-09-14
TW201835587A (zh) 2018-10-01
CN108526031B (zh) 2020-12-04

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