1334033 九、發明說明： 【發明所屬之技術領域】 時，於I胡喊行下壓複數個電子元件作業 效提行測試《，而有 件之具纽下絲移醇確取放電子元 【先前技術】 比===分=A_IC、類 機招Γ 邏料1 C為例，係應用於主 ===運俾= 並裝設，電=模组= 保成後賴經過，試作業’以淘汰出不良品，而確 …以測試記憶體I C之測試裝置為例，請參閱第卜 套座11之測試電路板1及壓接機構2 了 用以儲存資料’並裝配於模組電路板上， ，以便-次執行複數個配ΐ複數個測試套座11(例如3 2個） 位二==憶=之=業，而壓接機構2係 板g頭:Π2之底部係二_各』=1 =動，2 1帶動面板2 2及3 2個下壓頭2 3同步下降位移， 々各下1頭2 3將記憶體I c置人於減應之測試套座丄， 並由升降驅動源21驅動各下壓頭23同步下壓各記憶體工c， 5 13340331334033 IX. Description of invention: [In the technical field of invention] When I screamed and pressed a number of electronic components, the operation efficiency test was carried out, and there was a piece of the wire that was removed from the alcohol. Technology] ratio === points = A_IC, class machine to recruit 逻 1 1 for the example, is applied to the main === 俾 俾 = and installed, electricity = module = after the completion of the insurance Eliminate the defective product, and indeed... Take the test device for testing the memory IC as an example. Please refer to the test circuit board 1 and the crimping mechanism 2 of the socket set 11 for storing data and assembling it on the module circuit board. , in order to - execute a plurality of test sets of multiple test sets 11 (for example, 3 2), bit 2 == recall = = industry, and the crimping mechanism 2 is the plate g head: the bottom of the Π 2 is two _ each =1 = moving, 2 1 driving the panel 2 2 and 3 2 lower pressing heads 2 3 synchronously descending displacement, 々 each lower head 2 3 placing the memory I c in the reduced test set 丄, and lifting The driving source 21 drives each of the lower indenters 23 to simultaneously press down each memory c, 5 1334033
使各記憶體IC與測試套座1 1之各接點相接觸，以便測試電路 板1一次同時執行3 2個記憶體I C之測試作業。 惟’壓接機構之設計即為使記憶體IC能與測試套座之各接 點確實相接觸，期以提升測試品質，若壓接機構未能使記憶體 1 C與測試套座之各接點確實接觸，則勢必影響測試品質，反觀 此一壓接機構2係直接於大面積之面板2 2上固設3 2個下壓頭 2 3，並由一升降驅動源21帶動3 2個下壓頭2 3同步下降位 移，以一次壓抵複數個記憶體丨c執行測試作業，此易導致升降 驅動源21於帶動大面積之3 2個下壓頭2 3同步下壓作動時， 該3 2個下壓頭2 3會因配置位置不同或元件組裝累積誤差，而 以不同之下壓力道下壓各記憶體丨c，以致各記憶體1c之受力 不均，致使部份受力較小之記憶體〗c無法確實與測試套座丄工 之接點相接觸，造成各測試套座之測試品質不一之缺失。 故，如何設計一種於一次同時執行複數個電子元件測試作業 時’可使各電子元件能均勻受力’以確實與測試套座之接點相接 觸，而有效提升測試品質之具多組下壓頭之壓接機構，即為業者 研發之標的。 【發明内容】 本發明之目的一，係提供一種具多組下壓頭之壓接機立 設有-上方裝設複數健缸及氣管之第_承板，該第—承板係^ 一升降驅動源驅動作升降位移，並於下方鎖固第二承板，該 承板係於姉應第-承板之錢缸位置設有具吸嘴之 ^及嘴連通於第β板之氣管；藉此，於升降驅動源 ，下壓頭執行下壓電子元件作業時，可_各壓 對應之下壓賴抵電子元件，而使複數個電子元件^ =， =實與測試套座之接點相接觸，翻有效提相試品質^實用 -HP. 0 減ί發Ϊ之目的二，賴接機構係於第二承板之内部開設有複 數個第一谷置空_以裝設下壓頭’並於各第二容置空間與下壓 6 1334033 ’於通氣道312停止注入氣體後，則可使各歷虹3 4利用 申彈性上升復位，第一承板31之下方係鎖固 第-承板3 5 ’該紅承板3 5係於相對應第—承板3 :上 氣管33位置裝設有通氣件35i，並於相對應第_承板 ^各壓虹3 4位朗設有第二容置空間3 5 2，各第二容置空 3 5 2用以裝設-呈階級狀且具有吸嘴3 6 i之下壓頭3 6 吸嘴3 6 1係以管體連通於通氣件3 5 i，用以取、放電子^ ，而下壓頭3 6之下段部係凸伸出第二承板3 5之下方，再以一 第二承板3 5上之;t位板3 7將下壓頭3 6 P^l，而各下 =頭3 6係於吸嘴3 61之兩側分別設有一為導梢3 6 2之導 二^f3 5之第二容置空間3 5 2與下壓頭3 6間設 有子動、〜構，該汙動結構係於第二承板3 5之第二 ^，頂面設有呈錐狀之導槽3 5 3，並於下_3 6相g 置5 2之導槽3 5 3位置設有彈簧3 6 3及珠體 ^ 6 4 ’且使珠體3 6 4頂置於導槽3 5 3，由於第二容置空間 5 2與下咖3 6間具有贿，且下_3 6係 而可使下壓頭3 6作水平及垂直之浮動位移，又該第二 ϊ:Γίΐ設有複數個導具3 8，各導具3 8之前端係設有-套 5 ^端==:=繼_3 8 2 ’轉菁 性位ί 第 而可使套合件3 81作彈 之』ίί第3，該壓接機構3可應用於執行測試記憶體1 C ΐΐΠ 於測試電路板4之測試套座4 1上方，並可視 數量，而設置姆應數量之下壓頭3 6，例如 頭3 6 ;請參閱第1 G圖，雜接機構3之3 2個下 =3 6均吸取記憶體ί。後，—具有3 2個置人邮丄之導件 …八5係位移至測試套座41之上方，該導件 孔5 1之側方相對應下屢頭3 6之導梢3 6 2位£3=二Each of the memory ICs is brought into contact with each of the contacts of the test socket 1 1 so that the test circuit board 1 performs the test operation of 32 memory I C at the same time. However, the design of the crimping mechanism is such that the memory IC can be in contact with the contacts of the test socket to improve the test quality. If the crimping mechanism fails to connect the memory 1 C to the test socket. If the point is in contact, it will inevitably affect the quality of the test. In contrast, the crimping mechanism 2 directly fixes 32 lower pressing heads 2 3 on the large-area panel 2 2 and drives 3 2 lowers by a lifting drive source 21 The indenter 2 3 synchronously descends the displacement, and performs a test operation by pressing a plurality of memories 丨c at a time, which is easy to cause the lifting and lowering driving source 21 to actuate the pressing of the large-area 32 indenters 2 3 simultaneously. The two lower pressing heads 2 3 will press the memory 丨c under different pressure channels due to different configuration positions or cumulative error of component assembly, so that the stress of each memory 1c is uneven, resulting in partial stress. The memory of the small memory can not be surely contacted with the joint of the test socket, resulting in the lack of test quality of each test socket. Therefore, how to design a multi-group downforce that can effectively improve the test quality by performing a plurality of electronic component test operations at the same time, so that each electronic component can be uniformly stressed to be in contact with the contact of the test socket. The crimping mechanism of the head is the standard developed by the manufacturer. SUMMARY OF THE INVENTION One object of the present invention is to provide a first embodiment of a crimping machine having a plurality of sets of lower indenters, a plurality of health cylinders and a gas pipe, and the first plate The driving source is driven to be lifted and displaced, and the second carrier plate is locked under the support plate. The carrier plate is disposed at the position of the cylinder of the Yingying first-supporting plate, and the gas pipe with the nozzle and the mouth connected to the β-plate; Therefore, when the lower pressing head performs the operation of pressing the electronic component, the lower pressing head can press the electronic component corresponding to each pressure, and the plurality of electronic components ^ =, = the contact point of the test socket Contact, turn effective and improve the quality of the test ^ Practical - HP. 0 Reduce the purpose of the Ϊ , , 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 赖 目的 赖 目的 目的 目的 目的 目的 目的 目的After the gas is stopped in the second accommodating space and the lower pressure 6 1334033' in the air passage 312, the calendars can be lifted and lowered by the elastic spring, and the lower portion of the first carrier 31 is locked. The plate 3 5 'the red plate 3 5 is attached to the corresponding first plate 3: the upper air pipe 33 is provided with a venting member 35i, and correspondingly _ The plate ^ each pressure rainbow 3 4 position Lang is provided with a second accommodating space 3 5 2 , each second accommodating space 3 5 2 for mounting - in a class shape and having a nozzle 3 6 i under the head 3 6 The nozzle 3 6 1 is connected to the venting member 3 5 i by the tube body for taking and discharging the electrons, and the lower portion of the lower pressing head 36 is protruded below the second carrier plate 3 5 , and then The second carrier plate 3 5; the t-position plate 3 7 has a lower pressing head 3 6 P ^ l, and each lower = head 3 6 is provided on the two sides of the suction nozzle 3 61 respectively as a guiding tip 3 6 2 The second accommodating space 3 5 2 of the guide 2f3 5 and the lower pressing head 36 are provided with a sub-movement, a structure, and the slick structure is disposed on the second surface of the second carrier plate 35, and the top surface is provided a tapered guide groove 3 5 3, and a spring 3 6 3 and a bead body 6 6 4 at a position of the lower _3 6 phase g 5 2 guide groove 3 5 3 and the bead body 3 6 4 is placed In the guide groove 3 5 3, since the second accommodating space 52 and the lower coffee cup have bribes, and the lower _3 6 system can make the lower pressing head 36 to perform horizontal and vertical floating displacement, and the second ϊ: Γίΐ is provided with a plurality of guides 3 8 , each of the guides 38 8 is provided with a set of 5 ^ ends ==:= Following _3 8 2 'Transformation bits ί 81 弹" Thirdly, the crimping mechanism 3 can be applied to execute the test memory 1 C 上方 above the test socket 4 1 of the test circuit board 4, and the number of the occupants 3 3, for example, the head 3 6; Please refer to Figure 1G, 3 of the hybrids 3 = 2 = 3 to absorb the memory ί. After that, there are 32 guides for the postal locating... The octa 5 series is displaced above the test pedestal 41, and the side of the guide hole 5 1 corresponds to the leading end of the head 326. £3=two
8 (S 1334033 且於相對應導具3 8位置設有導柱5 3，用以輔助導引下壓頭 3 6將記憶體Ic置入於測試套座41中。 。5月參閱第6、11圖，該壓接機構3係控制升降驅動源3 2 驅動第一、二承板31、35及32個下壓頭36等元件同步下 降位移，於導具3 8之套合件3 81接觸到導件治具5之導柱 53時，由於承置塊322與承座321間具有適當間距，而可 使承座3 21以導槽3 2!工沿承置塊3 2 2之鋼珠3 2 5位移 ，且壓縮彈簧3 24 ,使承座32 1帶動第一、二承板31、 3 5及3 2個下墨頭3 6等元件作適當浮動位移，而使導具3 8 ，套合件3 81套置於導件治具5之導柱5 3上，以先導/引各下 對餅導件治具5之各置入孔5 1，於升降驅動源 、、、’’貝▼動各下壓頭3 6下降位移時，由於各下壓頭3 6亦可 作^微雛移，該下壓頭3 6之導梢3 6 2碰觸至導件治具5 ^ H 2時’可受導孔5 2之導引，而利用珠體3 6 4沿第二 =3 5之導槽3 5 3位移，使下壓頭3 6帶動記憶體t c作浮 ，位移以便利將記憶體IC準確置入於測試套座41中， 2壓頭3 6於將記憶體Ϊ c置入測試套座4!時，係可受記憶 壓頭制力獅而向上位移，且壓轉I3 6 3，使各ί 闕16作一適當緩衝，以防止壓損記憶體I C。 矣;以2圖’於各下壓頭3 6將記憶體1 C置入於測試 驅動各/^^可於第—承板3 1之通氣道3 1 2注人氣體，以 向下位移，並壓縮彈簧3 4 1，使各壓缸3 4同 C由於各下』下，頭3 6 ’使下•頭3 6下壓記憶體I C 3 6以相6㈣獨立之壓缸3 4壓抵，而可使各下壓頭 3 道壓抵記憶體1 C，使各記憶體1 c均勻受 作章時^機構3於一次同時執行複數個記憶體I C之測試 S提己憶體1 °與測試套座4 1之各接點相接觸 違到研測试品質之實用效益。 1334033 承板3 1之職道3 i 2私=倾完錢，係可停止於第-量，使各愿虹34利用彈簧3L ^解除各麗虹34之下愿力 且脫離下廢頭3 6，而各下壓頭3 ^張彈力頂推而上升復位， 除對記憶體IC之愿抵，由於| 亦位於原始之最低點，並解 =體I c，而可控制升降驅動源嘴=If吸附 3 5及3 2個下麵36同步上 第、—承板31、 梢3 6 2脫離導件治具“忒3=位’並使導具3 8及導 在無外力牽制下，即可二f孔5 2，而承座3 2工 3 2 5位移，而帶動第一、二；3 2 11沿f置塊3 2 2之珠體 3 6等元件復位，以完成—次 5=3 2個下壓頭 作業。 吁執仃複數個記憶體IC之測試 盘導;ί:^、1 f圖所示，該壓接機構3之第-承板3 ! 之導梢⑴位置設有具導孔巧==-承板3 i 帶動第-、二承板3 1、3 5及3 2二=驅:源f ;，於第-承板3 1之導梢3 1 3接觸到導位 3 2 i以導槽3 2 χ !沿承置塊3 ^可使承座 縮彈簧3 2 4，使承座3 21帶動第一:二—”立移’且壓 3 2個下壓頭3 6等元件作適當浮動健，^ 、35及 插入於導塊7之導孔7 1中，達到導引各3 1 3便利 導件治具5之各置入孔51之目的。 3 6初步對位於 雷口 ，使下壓頭可浮動微 電子兀件’實為一深具實用性及進步性之設計，然未 1334033 產品及刊物公開，從軌符發明翻申請要件銳法提出申請 【圖式簡單說明】 第1圖：習式測試裝置之壓接機構及戦電路板的示意圖。 第2圖·習式測試電路板及測試套座之示意圖。 第3圖：習式壓接機構之使用示意圖（一）。 第4圖：習式壓接機構之使用示意圖（二）。 第5圖：本發明壓接機構之組裝剖視圖。 第6圖：係第5圖之局部放大示意圖。 第7圖：本發明壓接機構之局部結構示意圖。 第8圖：本發明壓接機構之局部組裝示意圖。 第9圖：本發明壓接機構配置於測試裝置之示意圖。 第10圖：本發明壓接機構之使用示意圖（一）。 第11圖：本發明壓接機構之使用示意圖（二）。 笙1 9圄：太益^日感彼撒圾i m /8 (S 1334033 and a guide post 53 is provided at the position of the corresponding guide 38 to assist the guiding of the lower pressing head 36 to insert the memory Ic into the test socket 41. See Chapter 6 in May. In the figure 11, the crimping mechanism 3 controls the lifting drive source 3 2 to drive the first and second carrier plates 31, 35 and the 32 lower pressing heads 36 and the like to synchronously descend the displacement, and the contacts of the guiding member 38 are contacted. When the guide post 53 of the guide jig 5 is attached, since the bearing block 322 and the retainer 321 have an appropriate spacing, the retainer 3 21 can be used as the guide groove 3 2 to join the steel ball 3 of the bearing block 3 2 2 . 2 5 displacement, and the compression spring 3 24, the bearing 32 1 drives the first and second plates 31, 3 5 and 32 2 ink heads 3 6 and other components for proper floating displacement, and the guides 3 8 , sets The set of 81 parts is placed on the guide post 53 of the guide jig 5, and the lead-in holes 5 1 of the pie guides 5 are guided/guided to the lifting drive source, and ▼When the lower pressing head 3 6 is moved down, the lower pressing head 36 can also be moved, and the guiding end 3 6 2 of the lower pressing head 3 6 touches the guiding fixture 5 ^ H 2 When 'can be guided by the guide hole 5 2, and use the bead 3 6 4 along the second = 3 5 guide groove 3 5 3 Move, so that the lower pressing head 3 6 drives the memory tc to float, the displacement to facilitate the accurate placement of the memory IC into the test socket 41, and the indenter 36 to place the memory Ϊ c into the test socket 4! At the same time, it can be displaced upward by the memory ram and the pressure is turned to I3 6 3, so that each 阙 阙 16 is properly buffered to prevent pressure loss of the memory IC. 矣; The head 3 6 puts the memory 1 C into the test drive, and the gas can be injected into the air passage 3 1 2 of the first carrier plate 3 to shift downward, and compress the spring 3 4 1 to make each pressure The cylinders 3 4 and C are pressed down by the lower heads, and the heads 3 6 'press the lower heads 3 6 to press the memory ICs 3 6 to press the phase 6 (four) independent cylinders 34 to press the lower pressure heads 3 When the memory 1 C is made evenly, the memory 1 c is evenly subjected to the chapter. The mechanism 3 performs the test of the plurality of memory ICs at the same time. The S 1 is in contact with the contacts of the test socket 4 1 . 1334033 The board of the board 3 1's job road 3 i 2 private = the money can be stopped, the system can stop at the first amount, so that each wish rainbow 34 uses the spring 3L ^ to lift each Lihong 34 Willing to work and get rid of the waste head 3, and Each of the lower indenters is pushed up and lifted by 3 ^ elastic force, except for the wish of the memory IC, since | is also located at the lowest point of the original, and the solution = body I c, and the lifting drive source nozzle can be controlled = If adsorption 3 5 and 3 2 under 36 synchronization on the first, the support plate 31, the tip 3 6 2 from the guide fixture "忒 3 = position" and the guide 38 and the guide without the external force, the two f holes 5 2, while the bearing 3 2 work 3 2 5 displacement, and drive the first, second; 3 2 11 along the f block 3 2 2 bead body 3 6 and other components reset to complete - times 5 = 3 2 down Indenter work. Calling for a test of a plurality of memory ICs; ί:^, 1 f shows that the guide (1) of the first-plate 3 of the crimping mechanism 3 is provided with a guide hole ==- The plate 3 i drives the first and second plates 3 1 , 3 5 and 3 2 2 = drive: source f;, the guide 3 1 3 of the first plate 3 contacts the guide 3 2 i with the guide groove 3 2 χ ! along the bearing block 3 ^ can make the seat shrink spring 3 2 4, so that the seat 3 21 drives the first: two - "vertical shift" and pressure 3 2 lower pressing head 3 6 and other components for proper floating health , ^, 35 and inserted into the guide hole 7 1 of the guide block 7 to achieve the purpose of guiding each of the 3 1 3 convenient guide jig 5 into the insertion hole 51. 3 6 preliminary pair located in the thunder, so that the pressure The head-floating microelectronics piece is a practical and progressive design. However, the 1334033 product and publication are open, and the application for the application of the method is as follows: Schematic diagram of the crimping mechanism and the circuit board of the conventional test device. Fig. 2 is a schematic diagram of the test circuit board and the test socket. Fig. 3: Schematic diagram of the use of the conventional crimping mechanism (1). : The use of the conventional crimping mechanism (2) Fig. 5 is an assembled sectional view of the crimping mechanism of the present invention. Fig. 6 is a partially enlarged schematic view of Fig. 5. Fig. 7 is a partial structural view of the crimping mechanism of the present invention. Fig. 8: The present invention Schematic diagram of partial assembly of the crimping mechanism. Fig. 9 is a schematic view of the crimping mechanism of the present invention disposed on the testing device. Fig. 10 is a schematic view showing the use of the crimping mechanism of the present invention (1). Fig. 11: The crimping mechanism of the present invention Use the schematic (2). 笙1 9圄:Taiyi^日感彼撒垃圾im /
〔習式〕 第1 2圖：本發明壓接機構之使用示意圖（三）。 測試電路板：1 壓接機構：2 面板：2 2 吸嘴：2 3 1 〔本發明〕 測試套座：11 升降驅動源：21 下壓頭：2 3 壓接機構：3 第一容置空間：311 導梢：3 1 3 承座：3 2 1 第一承板：31 通氣道：312 升降驅動源：3 2 導槽：3 2 1 1 11 1334033[Formula] Figure 1 2: Schematic diagram of the use of the crimping mechanism of the present invention (3). Test circuit board: 1 Crimp mechanism: 2 Panel: 2 2 Nozzle: 2 3 1 [Invention] Test socket: 11 Lifting drive source: 21 Lower pressing head: 2 3 Crimp mechanism: 3 First accommodating space :311 Guide tip: 3 1 3 Seat: 3 2 1 First carrier: 31 Airway: 312 Lifting drive source: 3 2 Guide slot: 3 2 1 1 11 1334033
承置塊： 3 2 2 彈簧 3 2 4 氣管 3 3 彈簧 3 4 1 通氣件： 3 5 1 導槽 3 5 3 吸嘴 3 6 1 彈簧 3 6 3 定位板： 3 7 套合件： 3 8 1 測試電路板 4 導件治具 5 導孔 5 2 機台 6 導孔 7 1 卡掣塊： 3 2 3 珠體：3 2 5 壓缸：3 4 第二承板 ： 3 5 第二容置空間 :3 5 2 下壓頭： 3 6 導梢：3 6 2 珠體：3 6 4 導具：3 8 彈簣：3 8 2 測試套座 4 1 置入孔： 5 1 導柱：5 3 導塊：7Bearing block: 3 2 2 Spring 3 2 4 Air pipe 3 3 Spring 3 4 1 Ventilation: 3 5 1 Guide groove 3 5 3 Nozzle 3 6 1 Spring 3 6 3 Positioning plate: 3 7 Housing: 3 8 1 Test circuit board 4 Guides fixture 5 Guide hole 5 2 Machine table 6 Guide hole 7 1 Card block: 3 2 3 Bead body: 3 2 5 Pressure cylinder: 3 4 Second carrier: 3 5 Second accommodation space :3 5 2 Lower Indenter: 3 6 Guide Tip: 3 6 2 Bead Body: 3 6 4 Guide: 3 8 Magazine: 3 8 2 Test Seat 4 1 Insert Hole: 5 1 Guide Post: 5 3 Guide Block: 7
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